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Novel Process of Precision Nickel Mesh Fabrication for EMI Shielding Using Continuous Electroforming Technique  

Lee Joo-Yul (Surface Technology Research Center, Korea Institute of Machinery & Materials)
Kim Man (Surface Technology Research Center, Korea Institute of Machinery & Materials)
Kwon Sik-Chol (Surface Technology Research Center, Korea Institute of Machinery & Materials)
Hue Nguyen Viet (Surface Technology Research Center, Korea Institute of Machinery & Materials)
Kim In-gon (Department of Materials and metallurgical Engineering, Dong-eui University)
Publication Information
Journal of the Korean institute of surface engineering / v.38, no.6, 2005 , pp. 212-215 More about this Journal
Abstract
Novel continuous electroforming process equipped with a rotating patterned mandrel, soluble/insoluble anode and multiple stage of rolling wheels was proposed to produce precision nickel mesh, which is known as a very efficient electromagnetic interference (EMI) shielding material. Continuously electroformed nickel deposits showed a tendency to form small-sized particles as the plating solution temperature increased and mandrel rotation speeded up and the applied current density decreased. Along the honeycomb patterns of mandrel, nickel was accurately electrodeposited on the surface of rotating mandrel, but quite different visual/structural characteristics were measured on both sides.
Keywords
Precision nickel mesh; continuous electroforming; Rotating mandrel;
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1 L. Li, DDL Chung, Composites, 25 (1994) 215   DOI   ScienceOn
2 W. M. Kim, D. Y. Ku, I. K. Lee, Y. W Seo, B. K. Cheong, T. S. Lee, I. H. Kim, K. S. Lee, Thin Solid Films, 473 (2005) 315   DOI   ScienceOn
3 C.-Y. Huang, W-W Mo, M.-L. Roan, Surf. Coat. Tech., 184 (2004) 163   DOI   ScienceOn
4 I. Kim, K. Kang, J. Lee, S. C. Kwon, M. Kim, J. Y. Lee, J. Kor, Inst. Surf. Eng., 38, (2005) 14
5 A. E. W Rennie, C. E. Bocking, G. R. Bennett, J. Mater. Process. Tech., 110 (2001) 186   DOI   ScienceOn
6 Y. K. Hong, C. Y. Lee, C. K. Jeong, J. H. Sim, K. Kim, J. Joo, M. S. Kim, J. Y. Lee, S. H. Jeong, S. W Byun, Curr. Appl. Phys., 1 (2001) 439   DOI   ScienceOn
7 L. Li, DDL Chung, Polym. Compos., 14 (1993) 467   DOI   ScienceOn
8 X. Shui, DDL Chung, J. Electron Mater., 26 (1997) 928   DOI   ScienceOn
9 H. Yang, S.-W. Kang, International J. Machine Tools & Manufacture, 40 (2000) 1065   DOI   ScienceOn
10 T. Kagotani, R. Kobayashi, S. Sugimoto, K. Inomata, K. Okayama, J. Akedo, J. Magnetism & Magnetic Mater., 290 (2005) 1442   DOI   ScienceOn
11 J. Wu, DDL Chung, Carbon, 40 (2002) 445   DOI   ScienceOn
12 DDL Chung, Carbon, 39 (2001) 279   DOI   ScienceOn
13 J.-Y. Lee, J.-W. Kim, B.-Y. Chang, H. T. Kim, S.-M. Park, J. Electrochem. Soc., 151 (2004) C333   DOI   ScienceOn