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http://dx.doi.org/10.5370/KIEEP.2016.65.3.224

Conductivity Pattern Manufacture Technology of Solid Surface Compound Polymer Material  

Youn, Shin-Yong (Institute of Technology Research, Digital Graphics Incorporation)
Publication Information
The Transactions of the Korean Institute of Electrical Engineers P / v.65, no.3, 2016 , pp. 224-234 More about this Journal
Abstract
This study developed the conductivity pattern of solid surface using laser direct pattern and compound polymer material technology. For development direct patterning system of solid surface, we used the laser power stabilizer, the dynamic focusing, 3D scanner S/W and the auto aligning techniques. Also For conductivity pattern, we are developed compound polymer material with additive by electro-less plating. These technologies are already used commercially. However operation and control integrated system for direct patterning of solid surface are not yet developed. The objective of this paper is to introduce the laser direct structuring for simple process improvement instead complex PCB process, and develop the operating stability and integration system. Also we implemented new application of laser direct structuring through sample manufacture.
Keywords
Laser direct pattern; Conductivity pattern of solid compound polymer; Compound polymer material; Power stabilizer; Auto-alignment;
Citations & Related Records
Times Cited By KSCI : 5  (Citation Analysis)
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1 K K. B. Hon, L. Li,, and I. M. Hutchings, "Directing Writing Technology," Advances and developments CIRP Annals-Manufacturing Technology, Vol.57, No.2, pp.601-620. 2008   DOI
2 L. Thomas, H. Soeren, and S. Bertram, "A Multilayer Process for Fine-pitch Assemblies on Molded Interconnect Devices(MIDs)," Circuit World, Vol.35, No.2, pp.23-29. 2009   DOI
3 A. Islam, "Two Component Micro Injection Moulding for Moulded Interconnect Devices," A Thesis for a Doctorate, Technical University of Denmark, Denmark. 2008
4 B. M. Paik, J. H. Lee, D. S. Shin, and K. S. Lee, "A Study on Formation of Conductive Pattern on Polymer using LDS," KSLP, Vol.12, No.4, pp.6-11. 2009
5 S. J. Lee, J. S. Kim, B. C. Shin, D. W. Kim, and M. W. Cho, "Development of a LDI System for the Maskless Exposure Process and Energy Intensity Analysis of Single Laser Beam," KSME, Vol.19, No.6, pp.834-840. 2010
6 B. M. Paik, J. H. Lee, D. S. Shin and K. S. Lee, "Development of 3-D Conductive Pattern Fabrication System using Laser," KSME, pp.349-350, 2011
7 LPKF Laser & Electronics AG, n.d., viewed I, August, 2011
8 H. Eugene, Optic, Addison Wesley Longman, Inc, United States, 2002
9 B. M. Paik, J. H. Lee, D. S. Shin and K. S. Lee, "Development of Three Dimensions Laser Direct Patterning System," Korea Society of Manufacturing Technology Engineers, Vol.21, No.1, pp.116-122, February, 2012   DOI
10 H. Y. Yun and H. C. Kim, "Basic Research for the 3DCD(3D Circuit Devices)," The Korean Society for Precision Engineering, Vol.31, No.12, pp.1061-1066, December, 2014   DOI
11 B. G. Lee, "Deposition of Micropattern using The Laser Direct Writing Method with a Polymer Coating Layer," Journal of the Korea Academia-Industrial Cooperation Society, Vo1.15, No.12, pp.6980-6985, 2014   DOI
12 M. Huske, J. Kickehain, J. Muller, and G. Eber, "Laser Supported Activation and Additive Metalization of Thermoplastic for 3D-MIDS," Proceeding of the 3rd LANE, pp.1-12. 2001