• Title/Summary/Keyword: plating process

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A Study on Microstructure, Mechanical Properties, Friction and Adhesion of TiN Thin Films Coated on SKD61 and Radical Nitrided SKD61 Substrates by Arc Ion Plating (SKD61과 Radical Nitriding 처리된 SKD61 기판상에 Arc Ion Plating으로 증착된 TiN 박막의 미세구조 및 기계적 특성, 마찰 및 접착력에 관한 연구)

  • Joo, Yun-Kon;Yoon, Jae-Hong;Fang, Wei;Zhang, Shi-Hong;Cho, Tong-Yul;Ha, Sung-Sik
    • Journal of the Korean institute of surface engineering
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    • v.40 no.6
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    • pp.254-257
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    • 2007
  • TiN coating on tool steel has been widely used for the improvement of durability of tools. In this work, radical nitriding(RN) is carried out on SKD61 at $450^{\circ}C$ for 5 hours in the ammonia gas pressure $2.7{\times}10^3\;Pa$. The TiN coating is carried out by arc ion plating(AIP) with the process parameters: arc power 150 A, bias voltage -50V, coating time 40 minutes and nitrogen gas pressure $4{\times}10^3\;Pa$. Hardness, elastic modulus, friction coefficient and adhesion of TiN coating on substrates of both TiN/SKD61 and TiN/RN SKD61 coatings are investigated comparatively. The primary crystalline faces of TiN surface are(200) and(111) for TiN/SKD61 and TiN/RN SKD61 respectively. In addition to the primary phase, Fe phase exists in TiN/SKD61 coating, but not in TIN/RN SKD61. The hardness of TiN/RN SKD61 is about 700 Hv, 250 Hv(56%) higher than that of TiN/SKD61 at the near interface of TiN and substrates. At the TiN surface, hardness of TiN/RN SKD61 is 2,149 Hv, 71 Hv(3%) higher than that of TiN/SKD61. The elastic modulus of TiN coating is improved to 26.7 GPa(6%) by radical nitriding. The adhesion is improved by the RN coating showing no spalling. buckling and chipping on the scratch test track which are shown on the non-RN TiN/SKD61.

A Study on the Manufacturing Process of Fe-Ti Type Electrode for Ni/MH Secondary Battery (Ni/MH 2차전지용 Fe-Ti계 전극 제조공정에 대한 연구)

  • Joung, Sang-sik;Kim, Ki-won;Ahn, Hyo-jun;Joung, Soon-dol
    • Transactions of the Korean hydrogen and new energy society
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    • v.9 no.2
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    • pp.65-75
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    • 1998
  • Five different processes were selected and tested to find an useful method of manufacturing Fe-Ti type electrode. Initially, FeTi alloy was prepared by melting in plasma arc furnace and then powdered for shaping. Electroless Ni plating on these powder particles before shaping improved the discharge characteristics. The effects of heat-treatments on the electrode characteristics were also investigated. The discharge capacities of electrods were increased with the increasing heat-treatment temperatures. When heat treated at $1000^{\circ}C$ after shaping, the best results were acquired in the discharge capacity and cycle life. Both electroless Ni plating and heat-treatment were appeared to be crucial for the performance improvement of FeTi type electrode. Fe-Ti -Mn electrodes were prepared according to the process suggested in this study and tested to verify the promising effects of that.

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Development of Alkaline Degreasing Agent for Electroplating Pretreatment Process (도금 전처리공정에서 맞춤형 알칼리계 탈지제 개발)

  • Lee, Seung-Bum;Joeng, Koo-Hyung;Lee, Jae-Dong
    • Applied Chemistry for Engineering
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    • v.21 no.3
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    • pp.301-305
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    • 2010
  • In this study, the alkaline degreasing agent was developed for electroplating pretreatment process, and the efficiency and the durability was predicted. The alkaline deeping degreasing agent was prepared by blending sodium hydroxide (NaOH), sodium carbonate ($Na_2CO_3$), sodium silicate ($Na_2SiO_3$), and sodium lauric sulfate (SLS). The performance tests of the degreasing agent were evaluated in the $40{\sim}50^{\circ}C$ of the degreasing temperature and 30~40 min of the degreasing time. The efficiency and durability of the prepared degreasing agent were tested by the waterdrop formation test and Hull-cell plating test. The optimum ratio of alkaline degreasing agent was NaOH (30 g/L) + SLS (6.0 g/L) + $Na_2SiO_3$ (2.0 g/L) + $Na_2CO_3$ (40 g/L). Also, the optimum degreasing conditions were $50^{\circ}C$ of the degreasing temperature and 35 min of the degreasing time.

Adsorption Properties of Nickel ion from Plating Rinse Water Using Hybrid Sulfonated Bead and Fibrous Ion Exchanger (설폰산형 비드와 섬유 혼성체를 이용한 도금수세수 중의 니켈 흡착 특성)

  • 황택성;조상연
    • Polymer(Korea)
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    • v.27 no.1
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    • pp.61-68
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    • 2003
  • In this study, we have investigated the preparation of mixed bead and fiber type hybrid ion-exchanger for recovering nickel ion from plating rinse water. There was little dependence of adsorption capacity for nickel ion on the mixing ratio of resin type and fiber type of ion exchangers. However, it increased with increasing the resin content in the mixed bed. It was shown that the data Langmuir and Freundlich's adsorption isotherm model were well fitted to the linear. Affinity between the functional groups in the ion exchanger and nickel ion in the process was confirmed. The pressure drop decreased with increasing the number of stage in the multistage bed, but it increased with increasing the resin content in the mixing bed. The initial breakthrough time in the multistage bed was short due to the increase of number of stage in the continuous process. It was found that the final breakthrough time of the multistage bed was little changed. The breakthrough time decreased with increasing the amount of fibrous ion exchanger in the mixed bed. The maximum adsorption capacities of the mixed and multistage beds were 2.51 meq/g and 2.69 meq/g, respectively. The desorption time for the nickel ion with $1N H_2SO_4$ solution was lower than 10 minutes and the yield of desorption was greater than 98 percent.

A Study of Fluid Structure Interaction Analysis and Coating Characteristics of a Two-stage Pressure Reduction Hydrogen Regulator (2단 감압 수소레귤레이터의 연성해석 및 도금특성에 관한 연구)

  • Song, Jae-Wook;KIM, Seung-Mo
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.22 no.1
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    • pp.37-44
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    • 2021
  • In this study, shape design and material selection were carried out for a two-stage pressure-reducing regulator to compensate for the shortcomings of a one-stage mechanical decompression regulator. The shape of the contact surface of the depressurization unit was considered, material was selected, and the shape was designed to compensate for the pulsation and slow response through the two-stage decompression and to solve the problem of high pressure deviation. In terms of airtightness, the deformation amount of TPU showed a small amount of displacement of up to 15.82%. Considering the fact that it is applicable to various hydrogen fuel supply systems by securing universality by applying electronic solenoids to the second pressure reduction, magnetic materials were selected. The hydrogen embrittlement and corrosion resistance were evaluated to verify the plating process. Surface corrosion did not occur in only the case of Cr plating. The elongation during the corrosion process was compared using a tensile test, and there was a difference within 2%.

High Speed Cu Filling into Tapered TSV for 3-dimensional Si Chip Stacking (3차원 Si칩 실장을 위한 경사벽 TSV의 Cu 고속 충전)

  • Kim, In Rak;Hong, Sung Chul;Jung, Jae Pil
    • Korean Journal of Metals and Materials
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    • v.49 no.5
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    • pp.388-394
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    • 2011
  • High speed copper filling into TSV (through-silicon-via) for three dimensional stacking of Si chips was investigated. For this study, a tapered via was prepared on a Si wafer by the DRIE (deep reactive ion etching) process. The via had a diameter of 37${\mu}m$ at the via opening, and 32${\mu}m$ at the via bottom, respectively and a depth of 70${\mu}m$. $SiO_2$, Ti, and Au layers were coated as functional layers on the via wall. In order to increase the filling ratio of Cu into the via, a PPR (periodic pulse reverse) wave current was applied to the Si chip during electroplating, and a PR (pulse reverse) wave current was applied for comparison. After Cu filling, the cross sections of the vias was observed by FE-SEM (field emission scanning electron microscopy). The experimental results show that the tapered via was filled to 100% at -5.85 mA/$cm^2$ for 60 min of plating by PPR wave current. The filling ratio into the tapered via by the PPR current was 2.5 times higher than that of a straight via by PR current. The tapered via by the PPR electroplating process was confirmed to be effective to fill the TSV in a short time.

Industrial application of WC-TiAlN nanocomposite films synthesized by cathodic arc ion plating system on PCB drill

  • Lee, Ho. Y.;Kyung. H. Nam;Joo. S. Yoon;Jeon. G. Han;Young. H. Jun
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2001.06a
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    • pp.3-3
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    • 2001
  • Recently TiN, TiAlN, CrN hardcoatings have adapted many industrial application such as die, mold and cutting tools because of good wear resistant and thermal stability. However, in terms of high speed process, general hard coatings have been limited by oxidation and thermal hardness drop. Especially in the case of PCB drill, high speed cutting and without lubricant process condition have not adapted these coatings until now. Therefore more recently, superhard nanocomposite coating which have superhard and good thermal stability have developed. In previous works, WC-TiAlN new nanocomposite film was investigated by cathodic arc ion plating system. Control of AI concentration, WC-TiAlN multi layer composite coating with controlled microstructure was carried out and provides additional enhancement of mechanical properties as well as oxidation resistance at elevated temperature. It is noted that microhardness ofWC-TiA1N multi layer composite coating increased up to 50 Gpa and got thermal stability about $900^{\circ}C$. In this study WC-TiAlN nanocomposite coating was deposited on PCB drill for enhancement of life time. The parameter was A1 concentration and plasma cleaning time for edge sharpness maintaining. The characteristic of WC-TiAlN film formation and wear behaviors are discussed with data from AlES, XRD, EDS and SEM analysis. Through field test, enhancement of life time for PCB drill was measured.

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Development of CTP Selection Methodology of Semiconductor Equipment Line Using AHP and Fuzzy Decision Model (AHP 및 Fuzzy 의사결정 모형을 활용한 반도체 장치라인의 CTP 선정 방법론 개발)

  • Jeong, Jaehwan;Kim, Jungseop;Kim, Yeojin;Lee, Jonghwan
    • Journal of the Semiconductor & Display Technology
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    • v.20 no.2
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    • pp.6-13
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    • 2021
  • Cases and studies on the selection method of CTQ are relatively active, but there are few cases or studies on the selection method of CTP which is important in the device industry. In fact, many companies simply select and manage CTP from the point of contact based on their experience and intuition. The purpose of this study is to present an evaluation model and a mathematical decision model for rational and systematic CTP selection to improve the process quality of semiconductor equipment lines. In the evaluation model, AHP (Analytic Hierarchy Process) analysis technique was applied to show objective and quantitative figures, and Fuzzy decision-making model was used to solve the ambiguity and uncertainty in the decision-making process. Decision Value (DV) was presented. The subjects were 22 process factors managed in the Plating Process that the representative equipment line can do. As a result, the evaluation model proposed in this study can support more efficient and effective decision-making for process quality improvement by more objectively measuring the problem of subjective CTP selection in manufacturing sites.

Velocity Field Measurement of Flow Inside SNOUT of Zinc Plating Process ( I ) (용융아연 도금공정에서의 SNOUT 내부 유동장 해석 ( I ))

  • Shin, Dae Sig;Choi, Jayho;Lee, Sang-Joon
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.23 no.10
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    • pp.1265-1273
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    • 1999
  • PIV(Particle Image Velocimetry) velocity field measurements inside the snout of a1/10 scale model of the Zn plating process were carried out at the strip speed $V_s=1.5m/s$. Aluminum powder particles ($1{\mu}m$) and atomized olive oil ($3{\mu}m$) were used as seeding particles to simulate the molten Zinc flow and deoxidization gas flow, respectively. A pulsed Nd:Yag laser and a $2K{\times}2K$ high-resolution CCD camera were synchronized for the PIV velocity field measurement. From flow visualization study, it is found that the liquid flow in the Zn pot is dominantly governed by the uprising flow caused by the rotating sink roll, with its effect on the steel strip inside the snout largely diminished by installing of the snout. The deoxidization gas flow in front of the strip inside the snout can be characterized by a large-scale vortex rotating clockwise direction formed by the moving strip. In the rear side of the strip, a counter-clockwise vortex is formed and some of the flow entrained by the moving strip impinges on the free surface of molten zinc. The liquid flow in front of the strip is governed by the flow entering the snout, caused by the spinning sink roll. Just below the free surface a counter-clockwise vortex is formed near the snout wall. The moving strip affects dominantly the flow behind the strip inside the snout, and large amount of the liquid flow follows the moving strip toward the sink roll. The thickness of the flow following the strip is very thin in the front side due to the uprising flow, however thick boundary layer is formed in the rear side of the strip. Its thickness is increased as moving downstream toward the sink roll. Inside the snout, the deoxidization gas flow above the free surface is much faster than the liquid flow in the zinc pot. Due to the larger influx of the flow following the moving strip in the rear side of the strip, higher percentage of imperfection can be anticipated on the rear surface of the strip.

Properties of PZT Ultrasonic Transducer Array Fabricated by Micro-Pressing and Dicing method (Micro-Pressing 방법과 Dicing 방법에 의해 제조된 PZT Ultrasonic Transducer Array의 특성)

  • Park, Joon-Shik;Hong, Sung-Jei;Cho, Jin-Woo;Park, Soon-Sup;Han, Jin-Ho
    • Proceedings of the KIEE Conference
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    • 2000.07c
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    • pp.2248-2250
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    • 2000
  • We investigated properties of PZT composite for medical ultrasonic transducer array (briefly UTA) for medicine applications fabricated by micro pressing and dicing method. Dicing method was the fabrication process of conventional ultrasonic transducer array by dicing sintered PZT sheet. Micro pressing method was the proposed process using pressing PZT green sheet by PMMA micro mold from LIGA process. Microstructures, electrical and electro -mechanical properties of fabricated UTAs of two cases were analyzed. Thickness mode electro-mechanical coupling coefficient of two cases have same values of 51%. Sintered PZT Microstructures of them showed dense and uniform. Micro pressing method was very mass productive process because of using batch type LIGA process. From results, we found micro pressing method was more competitive than dicing method for UTA fabrication. For further study, uniformity of microstructures and electro-mechanical properties of large scale, and fabrication processes of Ni plating and PMMA molding should be improved and investigated.

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