• 마이크로전자및패키징학회지
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• 제6권4호
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• pp.61-71
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• 1999

통신분야에서 사용주파수대역의 증가, 제품의 소형화 및 가격경쟁력등의 요구에 따라 RF 소자의 패키징 기술도 플라스틱 패키지 대신에 flip chip interconnection, MCM(multichip module)등과 같은 고밀도 실장기술이 발전해가고 있다. 따라서, 본 논문은 최근 수년간 보고된 응용사례를 중심으로 RF flip chip의 기술적인 개발방향과 장점들을 분석하였고, RF 소자 및 시스템의 개발단계에 따른 적합한 적용기술을 제시하였다. RF flip chip의 기술동향을 요약하면, 1) RF chip배선은 microstrip 대신에 CPW 구조을 선택하며, 2) wafer back-side grinding을 하지 않아서 제조공정이 단순하고 wafer 파손이 적어 제조비용을 낮출 수 있고, 3) wire bonding 패키징에 비해 전기적인 특성이 우수하고 고집적의 송수신 모듈개발에 적합하다는 것이다. 그러나, CPW 배선구조의 RF flip chip 특성에 대한 충분한 연구가 필요하며 RF flip chip의 초기 개발 단계에서 flip chip interconnection 방법으로는 Au stud bump bonding이 적합할 것으로 제안한다.

• Journal of the Korean Wood Science and Technology
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• 제32권1호
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• pp.67-72
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• 2004

은수원사시나무 파티클과 저밀도 폴리에틸렌을 50:50, 60:40, 70:30의 3종류 혼합비율로 열압온도 145℃와 열압시간 5분에서 목질플라스틱패널을 제조하였다. 본 연구에서 목질플라스틱패널을 제조하는데 왁스와 접착제 등 어떤 첨가제도 사용하지 않았다. 제조한 목질플라스틱패널의 밀도, 박리강도, 휨탄성계수, 휨파괴계수, 두께팽창률 및 물흡수율에 대한 성질을 측정하여 패널의 성능을 평가하였다. 성능평가한 data를 SAS programing package에 의해 통계분석한 결과에 의하면 목질플라스틱패널의 박리강도, 휨파괴계수 등의 성질은 목재/폴리에틸렌 혼합비율이 50:50으로 제조된 패널이 다른 혼합비율인 60:40과 70:30으로 제조된 패널보다 5% 수준에서 높게 나타났다. 목질플라스틱패널의 치수안정화를 기준으로 볼 때, 목재/폴리에틸렌 최적의 혼합 비율이 60:40이라는 결과를 보여줬다.

• 한국포장학회지
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• 제22권3호
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• pp.41-47
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• 2016

This paper provides an overview of kimchi packaging technology, focusing on packaging materials, package design, and active/intelligent packaging technology for kimchi. From a packaging-material standpoint, although various materials have been used to ensure customer satisfaction and convenience, plastic is the most widely used material, in the form of bags, trays, pouches, and rigid containers. Additionally, recent efforts in the kimchi packaging industry have allowed companies to differentiate their products by using different packaging materials and technologies, while simultaneously improving product safety and quality. On the other hand, the biggest problem in kimchi packaging is excess $CO_2$ production, leading to package expansion and leakage. To alleviate this problem, the use of $CO_2$ absorbers, high $CO_2$-permeable films, and degassing valves, in addition to the use of different packaging systems, has been investigated. Active and/or intelligent packaging systems have been developed, to include active functions beyond simply inert, passive containment and protection of the kimchi product. However, most such approaches are not yet adequately effective to be useful on a commercial scale. Therefore, further studies are needed to resolve the limitations of each technology.

• 대한기계학회논문집A
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• 제32권2호
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• pp.186-193
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• 2008

[ $Moir{\acute{e}}$ ] interferometry is an optical method, providing whole field contour maps of in-plane displacements with high resolution. The demand for enhanced sensitivity in displacement measurements leads to the technique of microscopic $moir{\acute{e}}$ interferometry. The method is an extension of the $moir{\acute{e}}$ interferometry, and employs an optical microscope for the required spatial resolution. In this paper, the sensitivity of $moir{\acute{e}}$ interferometry is enhanced by an order of magnitude using an immersion interferometry and the optical/digital fringe multiplication(O/DFM) method. In fringe patterns, the contour interval represents the displacement of 52 nm per fringe order. In order to estimate the reliability and the applicability of the optical system implemented, the measurements of rigid body displacements of grating mold and the coefficient of thermal expansion(CTE) for an aluminium block are performed. The system developed is applied to the measurement of thermal deformation in a flip chip plastic ball grid array package.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2001년도 춘계학술대회논문집A
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• pp.90-95
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• 2001

Thermo-mechanical and flexural behavior of a wire-bond plastic ball grid array (WB-PBGA) are characterized by high sensitive $moir{\acute{e}}$ interferometry. $Moir{\acute{e}}$ fringe patterns are recorded and analyzed at several various bending loads and temperature steps. At the temperature higher that $100^{\circ}C$, the inelastic deformation in solder balls became more dominant. As a result the bending of the molding compound decreased while temperature increased. The strain results show that the solder ball located at the edge of the chip has largest shear strain by the thermal load while the maximum average shear strain by the bending moment occurs in the end solder. The results also show that $moir{\acute{e}}$ interferometry is a powerful and effective tool in experimental studies of electronic packaging.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.I
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• pp.609-613
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• 2005

Advanced mobile communication devices require a bright, high information content display in a small, light-weight, low power consumption package. In this paper we will outline our progress towards developing such a low power consumption active-matrix flexible OLED ($FOLED^{TM}$) display. Our work in this area is focused on three critical enabling technologies. The first is the development of a high efficiency long-lived phosphorescent OLED ($PHOLED{TM}$) device technology, which has now proven itself to be capable of meeting the low power consumption performance requirements for mobile display applications. Secondly, is the development of flexible active matrix backplanes, and for this our team are employing poly-Si TFTs formed on metal foil substrates as this approach represents an attractive alternative to fabricating poly-Si TFTs on plastic for the realization of first generation flexible active matrix OLED displays. Unlike most plastics, metal foil substrates can withstand a large thermal load and do not require a moisture and oxygen permeation barrier. Thirdly, the key to reliable operation is to ensure that the organic materials are fully encapsulated in a package designed for repetitive flexing. We also present progress in operational lifetime of encapsulated T-PHOLED pixels on planarized metal foil and discuss PHOLED encapsulation strategy.

• Journal of Welding and Joining
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• 제17권3호
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• pp.90-95
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• 1999

The increase in high speed, multi-function and high I/O pin semiconductor devices highly demands high pin count, very thin, and high density packages. BGA is one of the solutions, but the package has demerits in package reliability, surface mounting problems due to the PCB warpage and solder joint crack related with TCE mismatch between the materials. On this study to verify the thermal fatigue lifetime of the solder joint FEM and experiments were performed after surface mounting BGA with different solder composition and reliability conditions. FEM showed optimum composition of Ag3.2-Sn96.5 and under the composition minimum creep deformation of the solder joint was calculated, and the thermal fatigue lifetime was improved. In view of temperature cycle condition, the conditions of $-65^{\circ}C$to $150^{\circ}C$ showed minimum lifetime and t was 1/3 of $0^{\circ}C$ to $125^{\circ}C$ condition. Test board was prepared and solder joint crack was verified. Until 1000cycle on soder joint crack was observed.

• International Journal of Advanced Culture Technology
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• 제11권3호
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• pp.163-171
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• 2023

A blind box is a kind of sales method in that you can only get the product information by opening the package. In 2019, blind box products began to grow rapidly in the Chinese market, and gradually formed a special "blind box economy". The particularity of blind box products is that driven by consumers' curiosity, consumers' purchasing behavior can be directly induced by the visual and tactile perception of commodity packaging. Therefore, it is necessary to explore the psychological needs of consumers and master the blind box packaging design elements under the influence of consumer psychology. This paper takes figurine blind box packaging elements as the research scope and Chinese blind box consumers as the research object. Through market research and literature study, We are designed to conduct a questionnaire survey and SPSS empirical study to find out the differences in the preferences of different consumer temperament types for blind box packaging, taking the characteristics of blind box products and consumer psychology as the relevant theoretical background. The research results show that among the blind box consumers, choleric type consumers predominate, the color of the blind box packaging presents red, orange, and yellow preference, and the material presents metal, and plastic preference. The shape of the blind box shows a preference for special shape.

• Tribology and Lubricants
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• 제40권2호
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• pp.61-66
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• 2024

Micro-plastics are synthetic high-differentiation chemicals of less than 5mm in size, and are deposited not only on the sea surface but also on the coast. If these micro-plastics are not properly separated from the sand, they can threaten marine ecosystems. Thus, in the present study, we aimed to apply cyclone separator to the micro-plastic retrieval in order to predict the movement of particles according to the formation of the cyclone separator by applying the centrifugal force of the particle in accordance with the rotational movement of the air. The cyclone separator has three shapes, the first one is a typical interconnected cyclone separator. The second is the horn form, except for the cylinder in a regular cyclone separator, and the third is a form that increases the horn's height twice in the second. The numerical analysis simulation of the Cyclone separator used the Fluent software package. The output speed of the Cyclone separator was 5 to 13m/s at 1m/s intervals. The simulated particles include sand, Styrofoam, PET, PP, and PU. Sand particles are assigned a fixed diameter of 2mm, while other particles have a diameter of 3mm. As a result of the analysis, the first form was not separated from plastic. The Styrofoam separation efficiency in the second showed its highest efficiency at 72.7% at 7m/s, and the efficiency decreased after 12m/s as the sand particles were mixed into the plastic attachment location. In the third form, the separation efficiency of Styrofoam at 12m/s was highest at 67.9%.

• 커뮤니케이션디자인학연구
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• 제64권
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• pp.64-75
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• 2018

고가의 의류, 가방, 신발 등의 시장을 장악해온 명품 패션브랜드들이 최근 본격적으로 화장품 시장에 뛰어드는 행보를 보이고 있다. 본 연구는 명품 패션브랜드가 화장품브랜드로 확장을 진행하면서 자사의 브랜드 정체성을 화장품브랜드에 어떻게 표출하고 있는지, 화장품 패키지 디자인의 조형적 기호를 분석하고 준상징적 체계를 도출하는 시각적 정체성 분석 방식을 통해 살펴보고자 하였다. 따라서 본 연구에서는 최근 화장품브랜드로 명성이 높은 입생로랑과 아르마니 같은 패션 명품브랜드의 대표적 인기 제품군인 쿠션 팩트와 립틴트의 패키지 디자인의 시각기호학적 분석을 시도하였다. 연구분석 결과, 본 연구는 입생로랑과 아르마니 패키지의 조형적 요소가 표출하는 의미론적 자질들을 파악하였으며, 이 자질들이 입생로랑이 지향하는 '고전주의'적 정체성과 아르마니가 지향하는 '바로크'적 정체성의 추구를 드러내는 시각기호로서 활용되고 있음을 발견하였다. 이 연구결과를 토대로 본 연구는 입생로랑의 경우 패션브랜드로서의 브랜드 정체성을 화장품 브랜드의 시각적 정체성에 전이하지 못하고 있는 반면, 아르마니는 패션브랜드로서의 브랜드 정체성을 화장품 브랜드의 시각적 정체성에 효과적으로 전이하는 시각커뮤니케이션 전략을 활용하고 있음을 파악하였다. 이와 같은 두 브랜드의 서로 다른 결과를 통해 본 연구는 명품 패션브랜드들은 물론 국내 패션브랜드들도 화장품 시장으로 영역을 확장하는 과정에서 기존의 브랜드 정체성을 잘 파악하고, 이를 화장품 브랜드의 커뮤니케이션 전략에도 효과적으로 활용하고 있는지를 검토해봐야 할 필요가 있음을 제시하였다.