• Title/Summary/Keyword: plasma spray

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The Effects of Water Addition on the Color and Crystalline Phase of Y2O3 Coatings Fabricated by Plasma Suspension Spray

  • Park, Sang-Jun;Lee, Jung-Ki;Oh, Yoon-Suk;Kim, Seongwon;Kim, Hyungsun;Lee, Sung-Min
    • Journal of the Korean Ceramic Society
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    • v.53 no.6
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    • pp.641-646
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    • 2016
  • The effects of water addition on $Y_2O_3$ coatings or thick films prepared by plasma suspension spray (SPS) have been investigated. Water addition in suspension media was found to be effective to control the color of a $Y_2O_3$ coating prepared by SPS. The color changed with water addition at the shortest stand-off distance of 50 mm even if samples had the same crystalline phase. Change was not correlated with fragmentation behavior of liquid suspension inside the plasma jet. Water content over 50 vol% was found to produce unmelted particles, indicating that water suppressed heat transfer to the particles. However, plasma jet temperature was not affected. Instead, the coating fabricated with water addition has higher oxygen and lower carbon content compared to these characteristics of the coating without water addition. This was attributed to the retarded complete evaporation of liquid media from the suspension droplet, resulting in inhibition of excessive heating and evaporation of the molten $Y_2O_3$ droplet. In this regard, crystalline phase development with respect to stand-off distance and water addition was discussed.

A Study on Plasma Corrosion Resistance and Cleaning Process of Yttrium-based Materials using Atmospheric Plasma Spray Coating (Atmospheric Plasma Spray코팅을 이용한 Yttrium계 소재의 내플라즈마성 및 세정 공정에 관한 연구)

  • Kwon, Hyuksung;Kim, Minjoong;So, Jongho;Shin, Jae-Soo;Chung, Chin-Wook;Maeng, SeonJeong;Yun, Ju-Young
    • Journal of the Semiconductor & Display Technology
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    • v.21 no.3
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    • pp.74-79
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    • 2022
  • In this study, the plasma corrosion resistance and the change in the number of contamination particles generated using the plasma etching process and cleaning process of coating parts for semiconductor plasma etching equipment were investigated. As the coating method, atmospheric plasma spray (APS) was used, and the powder materials were Y2O3 and Y3Al5O12 (YAG). There was a clear difference in the densities of the coatings due to the difference in solubility due to the melting point of the powdered material. As a plasma environment, a mixed gas of CF4, O2, and Ar was used, and the etching process was performed at 200 W for 60 min. After the plasma etching process, a fluorinated film was formed on the surface, and it was confirmed that the plasma resistance was lowered and contaminant particles were generated. We performed a surface cleaning process using piranha solution(H2SO4(3):H2O2(1)) to remove the defect-causing surface fluorinated film. APS-Y2O3 and APS-YAG coatings commonly increased the number of defects (pores, cracks) on the coating surface by plasma etching and cleaning processes. As a result, it was confirmed that the generation of contamination particles increased and the breakdown voltage decreased. In particular, in the case of APS-YAG under the same cleaning process conditions, some of the fluorinated film remained and surface defects increased, which accelerated the increase in the number of contamination particles after cleaning. These results suggest that contaminating particles and the breakdown voltage that causes defects in semiconductor devices can be controlled through the optimization of the APS coating process and cleaning process.

STUDY OF FLARE-ASSOCIATED X-RAY PLASMA EJECTIONS : II. MORPHOLOGICAL CLASSIFICATION

  • KIM YEON-HAN;MOON Y.-J.;CHO K.-S.;BONG SU-CHAN;PARK Y.-D.
    • Journal of The Korean Astronomical Society
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    • v.37 no.4
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    • pp.171-177
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    • 2004
  • X-ray plasma ejections often occurred around the impulsive phases of solar flares and have been well observed by the SXT aboard Yohkoh. Though the X-ray plasma ejections show various morphological shapes, there has been no attempt at classifying the morphological groups for a large sample of the X-ray plasma ejections. In this study, we have classified 137 X-ray plasma ejections according to their shape for the first time. Our classification criteria are as follows: (1) a loop type shows ejecting plasma with the shape of loops, (2) a spray type has a continuous stream of plasma without showing any typical shape, (3) a jet type shows collimated motions of plasma, (4) a confined ejection shows limited motions of plasma near a flaring site. As a result, we classified the flare-associated X-ray plasma ejections into five groups as follows: loop-type (60 events), spray-type (40 events), jet-type (11 events), confined ejection (18 events), and others (8 events). As an illustration, we presented time sequence images of several typical events to discuss their morphological characteristics, speed, CME association, and magnetic field configuration. We found that the jet-type events tend to have higher speeds and better association with CMEs than those of the loop-type events. It is also found that the CME association (11/11) of the jet-type events is much higher than that (5/18) of the confined ejections. These facts imply that the physical characteristics of the X-ray plasma ejections are closely associated with magnetic field configurations near the reconnection regions.

Removal of Humic Acid Using Titania Film with Oxygen Plasma and Rapid Thermal Annealing (산소플라즈마와 급속열처리에 의해 제조된 티타니아 박막의 휴믹산 제거)

  • Jang, Jun-Won;Park, Jae-Woo
    • Journal of Soil and Groundwater Environment
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    • v.12 no.3
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    • pp.29-35
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    • 2007
  • Titanium was oxidized with oxygen plasma and calcinated with rapid thermal annealing for degradation of humic acid dissolved in water. Titania photocatalytic plate was produced by titanium surface oxidized with oxygen plasma by Plasma Enhanced Chemical Vapor Deposition (PECVD). RF-power and deposition condition is controlled under 100 W, 150 W, 300 W and 500 W. Treatment time was controlled by 5 min and 10 min. The film properties were evaluated by the X-ray Photoelectron Spectroscopy (XPS) and X-Ray Diffraction (XRD). From the experimental results, we found the optimal condition of titania film which exhibited good performance. Moreover photocatalytic capacity was about twice better than thermal spray titania film, and also as good as titania powder.

Measurement of the Coating Temperature Evolution during Atmospheric Plasma Spraying (대기압 플라즈마 용사 공정에서의 기판 코팅 온도 영향 연구)

  • Lee, Kiyoung;Oh, Hyunchul
    • Applied Chemistry for Engineering
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    • v.31 no.6
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    • pp.624-629
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    • 2020
  • For more effective temperature control of atmospheric plasma sprayed (APS) zirconia thermal barrier coating, understanding of the parameters, which influence the substrate temperature, is essential and also more numerical results based on the experimental data are required. This study aims to investigate the substrate temperature control during an APS process. The APS process deals with air-cooled systems, plasma-gas flow, powder feed rate, robot velocity, and substrate effect on the substrate surface temperature control during the process. This systematic approach will help to handle the temperature control, and thus lead to better coating quality.

Thermal Spray Coating

  • 김종영
    • 전기의세계
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    • v.42 no.1
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    • pp.5-11
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    • 1993
  • 금속이나 세라믹 입자를 용사하여 보호피막을 형성하는 기술은 화염을 사용하는 방법에서 시작했으며 용사재료는 분말, 선, 봉의 형태로 공급되었다. 1960년대에 상업적인 plasma 용사장비가 개발되었으며 여기서 사용된 D.C.plasma jet를 이용하여 분말형태의 용사재료를 용융하고 고속으로 피용사테에 용융입자를 분사하여 피용사체면에 충돌시켜 다층의 얇은 피막을 형성한다. 최근(1985년)에는 R.F.(Radio Frequency) Plasma를 이용하여 열전도도가 작은 재료나 산소와 반응성이 큰 재료를 용사하는 방법도 개발되고 있다. 용사피복법은 현재 여러가지 방법이 실용되고 있으며 재료를 용융하는 열원에 따라 분류하면 표1과 같다. 즉 산소와 연료 가스의 혼합에 의한 연소나 폭발에너지를 이용하는 가스식 용사법과 Arc, Plasma등의 전기 에너지를 이용하는 전기식 용사법으로 크게 나눌 수 있다.

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Effect of AlF3 addition to the plasma resistance behavior of YOF coating deposited by plasma-spraying method (플라즈마-스프레이법에 의해 코팅한 옥시불화이트륨(YOF) 증착층의 플라즈마 내식성에 미치는 불화알루미늄(AlF3) 첨가 효과)

  • Young-Ju Kim;Je Hong Park;Si Beom Yu;Seungwon Jeong;Kang Min Kim;Jeong Ho Ryu
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.33 no.4
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    • pp.153-157
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    • 2023
  • In order to manufacture a semiconductor circuit, etching, cleaning, and deposition processes are repeated. During these processes, the inside of the processing chamber is exposed to corrosive plasma. Therefore, the coating of the inner wall of the semiconductor equipment with a plasma-resistant material has been attempted to minimize the etching of the coating and particle contaminant generation. In this study, we mixed AlF3 powder with the solid-state reacted yttrium oxyfluoride (YOF) in order to increase plasma-etching resistance of the plasma spray coated YOF layer. Effects of the mixing ratio of AlF3 with YOF powder on crystal structure, microstructure and chemical composition were investigated using XRD and FE-SEM. The plasma-etching ratios of the plasma-spray coated layers were calculated and correlation with AlF3 mixing ratio was analyzed.

Effects of Plasma Spray Conditions on Photoelectric Properties of Plasma Sprayed $TiO_2$ Semiconductor ($TiO_2$ 반도체 용사피막의 광전극 특성에 미치는 용사조건의 영향)

  • 박정식;박경채
    • Journal of Welding and Joining
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    • v.12 no.1
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    • pp.94-101
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    • 1994
  • In this study, plasma spraying has been used to produce $TiO_2$ polycrystalline coatings from $TiO_2$ powders. The physical and chemical properties of plasma sprayed $TiO_2$ coatings depend greatly on plasma spraying conditions. The electrical resistivity, oxygen concentration, photocurrent and crystal structure of plasma sprayed $TiO_2$ coating has been studied. The results are as follows: 1. The oxygen loss and electrical conductivity of $TiO_2$ plasma sprayed coatings increased by low pressure and high amount of auxiliary gas, hydrogen in plasma spraying. 2. Oxygen loss increase electrical conductivity, and decrease photocurrent of $TiO_2$ plasma sprayed coatings. 3. Photocurrent of $TiO_2$ plasma sprayed coatings manufactured in atmospheric pressure is higher than that of low pressure.

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Interaction study of molten uranium with multilayer SiC/Y2O3 and Mo/Y2O3 coated graphite

  • S.K. Sharma;M.T. Saify;Sanjib Majumdar;Palash K. Mollick
    • Nuclear Engineering and Technology
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    • v.55 no.5
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    • pp.1855-1862
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    • 2023
  • Graphite crucibles are used for melting uranium and its alloys in VIM furnace. Various coating materials namely Al2O3, ZrO2, MgO etc. are applied on the inner surface of the crucibles using paint brush or thermal spray technique to mitigate U-C interaction. These leads to significant amount of carbon pick-up in uranium. In this study, the attempts are made to develop multilayer coatings comprising of SiC/Y2O3 and Mo/Y2O3 on graphite to study the feasibility of minimizing U-C interaction. The parameters are optimized to prepare SiC coating of about 70㎛ thickness using CVD technique on graphite coupons and subsequently Y2O3 coating of about 250㎛ thickness using plasma spray technique. Molybdenum and Y2O3 layers were deposited using plasma spray technique with 70㎛ and 250㎛ thickness, respectively. Interaction studies of the coated graphite with molten uranium at 1450℃ for 20 min revealed that Y2O3 coating with SiC interlayer provides physical barrier for uranium-graphite interaction, however, this led to the physical separation of coating layer. Y2O3 coating with Mo interlayer provided superior barrier effect showing no degradation and the coatings remained intact after interaction tests. Therefore, the Mo/Y2O3 coating was found to be a promising solution for minimizing carbon pick-up during uranium/uranium alloy melting.