• 제목/요약/키워드: plane-focus tube

검색결과 7건 처리시간 0.023초

Strength of connection fixed by TOBs considering out-of-plane tube wall deformation-Part 1: Tests and numerical studies

  • Wulan, Tuoya;Wang, Peijun;Xia, Chengxin;Liu, Xinyu;Liu, Mei;Liu, Fangzhou;Zhao, Ou;Zhang, Lulu
    • Steel and Composite Structures
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    • 제42권1호
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    • pp.49-57
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    • 2022
  • This paper presents a study on the behavior of a bolted T-stub to square tube connection using Thread-fixed One-side Bolts (TOBs) through tests and numerical simulations. It outlines a research work of four connections with focus on the failure modes and strengths of the connection under tensile load. It was observed that the thread anchor failure caused by shear failure of hole threads controlled the final failure of the connection in the tests. Meanwhile, the out-of-plane deformation of tube wall resulted in the contact separation between hole threads and bolt threads, which in turn reduced the shear strength of hole threads. Finite element models (FEMs) allowing for the configuration details of the TOBs fixed connection are then developed and compared with the test results. Subsequently, the failure mechanism of hole threads and stress distribution of each component are analyzed based on FEM results. It was concluded that the ultimate strength of connection was not only concerned with the shear strength of hole threads, but also was influenced by the plastic out-of-plane deformation of tube wall. These studies lay a foundation for the establishment of suitable design methods of this type of connection.

Quasi-monochromatic Parallel Radiography Achieved with a Polycapillary Plate

  • Sato, Eiichi;Komatsu, Makoto;Hayasi, Yasuomi;Tanaka, Etsuro;Mori, Hidezo;Kawai, Toshiaki;Ichimaru, Toshio;Takayama, Kazuyoshi;Ido, Hideaki
    • 한국의학물리학회:학술대회논문집
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    • 한국의학물리학회 2002년도 Proceedings
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    • pp.418-421
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    • 2002
  • Fundamental study on quasi-monochromatic parallel radiography using a polycapillary plate and a plane-focus x-ray tube is described. The x-ray generator consists of a negative high-voltage power supply, a filament (hot cathode) power supply, and an x-ray tube. The negative high-voltage is applied to the cathode electrode, and the transmission type target (anode) is connected to the ground potential. The maximum voltage and current of the power supply were -100 kV (peak value) and 3.0 mA, respectively. In this experiment, the tube voltage was regulated from 20 to 25 kV, and the tube current was regulated by the filament temperature and ranged from 1.0 to 3.0 mA. The exposure time is controlled in order to obtain optimum film density, and the focal spot diameter was about 10 mm. The polycapillary plate is J5022-21 made by Hamamatsu Photonics Inc., and the outside and effective diameters are 87 and 77 mm, respectively. The thickness and the hole diameter of the polycapillary are 1.0 mm and 25 ${\mu}$m, respectively. The x-rays from the tube are formed into parallel beam by the polycapillary, and the radiogram is taken using an industrial x-ray film of Fuji IX 100 without using a screen. In the measurement of image resolution, we employed three brass spacers of 2, 30, and 60 mm in height. By the test chart, the resolution fell according to increases in the spacer height without using a polycapillary. In contrast, the resolution slightly fell with corresponding increases in the height by the polycapillary. In angiography, fine blood vessels of about 100 ${\mu}$m are clearly visible.

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A design of transmission-type multi-target X-ray tube based on electric field modulation

  • Zhao, Lei;Jia, Wenbao;Jin, Limin;Shan, Qing;Cheng, Can;Zhu, Hongkui;Hei, Daqian
    • Nuclear Engineering and Technology
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    • 제53권9호
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    • pp.3026-3034
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    • 2021
  • Multi-target X-ray tube is a new type X-ray source, and can be applied in many fields such as sensitive X-ray fluorescence analysis and medical imaging. In this work, we report an electric field modulation multi-target X-ray tube, which contains four targets (Cr, Ni, Au, Mo) coated on a Beryllium (Be) window. A four-valve electric field deflector was developed to deflect the electron beam to bombard the corresponding targets. Particle dynamics analysis software was employed to simulate the particle tracking of electron beam. The results show that the 30 keV electron beam could get a 6.7 mm displacement on the target plane by 105 V/m electric field. The focus areas are about 2 mm × 5 mm and 4 mm × 2.5 mm after deflection in two directions. Thermal behavior calculated by ANSYS shows that the designed target assembly could withstand a 10 W continuous power. The optimum target thicknesses and emission spectra were obtained by Geant4 when the thickness of Be window was 300 mm and the electron beam incident angle was 0.141 rad. The results indicate that this multi-target X-ray tube could provide different X-ray sources effectively.

대형 캐비테이션 터널 내 선박 모형의 3차원 선체 반류 계측을 위한 레이저 유속계 개발 (Development of LDV(Laser Doppler Velocimetry) for Measuring Three Dimensional Hull Wake of Ship Model in Large Cavitation Tunnel)

  • 백부근;안종우;설한신;박영하;김기섭;전호근
    • 대한조선학회논문집
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    • 제54권6호
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    • pp.515-521
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    • 2017
  • Large Cavitation Tunnel (LCT) of KRISO enables us to conduct cavitation tests of the propeller attached to a ship model. As the ship model tests are done at rather high Reynolds number of 107~108, flow measurement system such as pitot tube cannot be employed because of structural safety problems in its system and difficulties in installing it within the test section. Thus, KRISO has developed new 3-D LDV system used in large test section of LCT. There are several difficulties in using 3-D LDV, which did not allow efficient operation of it. The first trouble was the calibration using the conventional pin hole. To make the focus with same laser-beam waists at the wanted position, the high spatial resolution CCD is utilized in the calibration procedure for 3-D LDV. The off-axis configuration provides two velocity components in the horizontal plane and on-axis configuration gives third velocity component in the vertical plane. The horizontal velocity components are also obtained in the coincidence mode, which prevents any misleading results in the off-axis configuration. The nominal wake of Aframax tanker model is measured by the developed 3-D LDV system. The measured hull wake showed good agreement with that obtained by CFD calculation.

후면투사식 CRT 고화질 텔레비전용 광학엔진의 변조전달함수 측정을 위한 후방검사 변조전달함수 측정법 (Backward Testing Method of MTF measurement for optical engine of CRT of rear projection HDTV)

  • 송종섭;조재흥;홍성목;이윤우;송재봉;이회윤;이인원
    • 한국광학회지
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    • 제16권1호
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    • pp.56-62
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    • 2005
  • 후면투사방식의 CRT(Cathod Ray Tube) 고화질 텔레비젼용 광학엔진은 큰 화면과 굽은 필드 때문에 일반적인 전방검사 MTF(modulation transfer function)로는 측정이 어렵다. 이러한 광학엔진의 MTF를 측정하기 위하여 광학엔진이 놓인 물체면과 상분석기의 위치를 서로 바꾸는 후방검사 MTF방법을 제안하고 이에 따른 MTF 측정장비를 구성하였다. 이러한 CRT HDTV용 광학엔진을 위한 후방검사 MTF측정법은 작은 수치개구(NA), 낮은 분해능, 긴 초점심도들 때문에 정밀도가 낮아지는 전방검사 MTF 측정법보다 사용하기가 훨씬 더 좋으며, 정렬이 매우 용이하고 측정반복성이 매우 좋다. 이 방법으로 측정한 MTF값과 설계된 MTF를 비교함으로써 이 방법의 신뢰성을 확인하였다.

고정식 초점형 SPECT에 있어, 선예도와 감도의 공간 균일성에 대한 평가 (Evaluation of Spatial Uniformity about Resolution and Sensitivity of a 'fixed focusing type SPECT')

  • 김재일;임정진;조성욱;노경운
    • 핵의학기술
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    • 제23권1호
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    • pp.54-58
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    • 2019
  • Capillary tube 10개를 $^{99m}Tc$로 채워서 고정식-초점형 SPECT와 회전식-평형 SPECT 장비를 이용하여 선예도와 감도를 평가하였다. 그리고 이 데이터를 이용하여 검출-조사야 내에서의 평균값과 표준편차를 이용하여 균일도를 나타내는 변동계수를 평가하였다. 고정식-초점형 SPECT의 선예도 균일도와 감도 균일도는 회전식-평형 SPECT 에 비해 각각 68%, 110% 높게 평가되었다.

주사형(走査型) 전자현미경(電子顯微鏡)의 응용분야(應用分野) (Applications of the Scanning Electron Microscope)

  • 김용락
    • Applied Microscopy
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    • 제2권1호
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    • pp.39-46
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    • 1972
  • There are many kinds of microscopes suitable for general studies; optical microscopes(OM), conventional transmission electron microscopes (TEM), and scanning electron microscopes(SEM). The optical microscopes and the conventional transmission electron microscopes are very familiar. The images of these microscopes are directly formed on an image plane with one or more image forming lenses. On the other hand, the image of the scanning electron microscope is formed on a fluorescent screen of a cathode ray tube using a scanning system similar to television technique. In this paper, the features and some applications of the scanning electron microscope will be discussed briefly. The recently available scanning electron microscope, combining a resolution of about $200{\AA}$ with great depth of field, is favorable when compared to the replica technique. It avoids the problem of specimen damage and the introduction of artifacts. In addition, it permits the examination of many samples that can not be replicated, and provides a broader range of information. The scanning electron microscope has found application in diverse fields of study including biology, chemistry, materials science, semiconductor technology, and many others. In scanning electron microscopy, the secondary electron method. the backscattererd electron method, and the electromotive force method are most widely used, and the transmitted electron method will become more useful. Change-over of magnification can be easily done by controlling the scanning width of the electron probe. It is possible. to continuously vary the magnification over the range from 100 times to 1.00,000 times without readjustment of focusing. Conclusion: With the development of a scanning. electron microscope, it is now possible to observe almost all-information produced through interactions between substances and electrons in the form of image. When the probe is properly focused on the specimen, changing magnification of specimen orientation does not require any change in focus. This is quite different from the conventional transmission electron microscope. It is worthwhile to note that the typical probe currents of $10^{-10}$ to $10^{-12}\;{\AA}$ are for below the $10^{-5}$ to $10^{-7}\;{\AA}$ of a conventional. transmission microscope. This reduces specimen contamination and specimen damage due to heatings. Outstanding features of the scanning electron microscope include the 'stereoscopic observation of a bulky or fiber specimen in high resolution' and 'observation of potential distribution and electromotive force in semiconductor devices'.

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