• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 1996.10a
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• pp.202-206
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• 1996

An experimental study of the characteristics of the repulsiveytype magnetic bearing using high Tc superconductor is presented. In field cooling superconductor has the position-stability due to a flux pinning effect and the strong damping due to hysterisis, while in zero field cooling it has the only strong repulsive force due to Meissner effect. Lift force in superconducting levitation has a hysterisis characteristics, and it is the dissipation of energy, the mechanism of damping. As the relative linear velocity between a magnet and a superconductor increases, the area of the hysterisis loop becomes smaller. It means the decrease of damping. In field cooling, the static stiffness is very nonlinear in smaller than initial gap, but almost linear in larger than initial gap.

• Progress in Superconductivity
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• v.1 no.1
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• pp.14-19
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• 1999

Measurements across single grain boundaries in YBCO thin films and bulk bicrystals have been used to demonstrate the influence of grain boundary structure on the critical current carried across the grain boundary. In particular, we show that one role of grain boundary structure is to change the degree of pinning along the boundary, thereby influencing the critical current. This effect can be used to explain the large difference in critical current density across grain boundaries in thin films compared to that for bulk bicrystal. These differences illustrate the distinction between the intrinsic mechanism of coupling across the grain boundary that determines the maximum possible critical current across a boundary and the measured critical current which is limited by dissipation due to the motion of vortices.

• Journal of the Korean Magnetics Society
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• v.1 no.2
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• pp.60-68
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• 1991

In compacting the melt-spun $Nd_{14}Fe_{76}Co_{4}B_{6}$ and $Nd_{10.5}Fe_{79}Co_{2}Zr_{15}B_{7}$ magnetic powders. the difference in composition induces a different behavior of closed packing rate as a function of aspect ratio of the powders. The $Nd_{10.5}Fe_{79}Co_{2}Zr_{1.5}B_{7}$ alloy having a low Co/Fe ratio (low density) shows the better green density to have an enhanced closed packing rate. An empirical power equation relating the green density with the compacting pressure was obtained such as ${\phi}(g/cm^{2})=5.2~5.6{\times}P^{0.045~0.065}(ton/cm^{2})$. The $Nd_{14}Fe_{76}Co_{4}B_{6}$ alloy having a high Nd/Fe ratio possesses much finer grain size(50~60 nm) than that of $Nd_{10.5}Fe_{79}Co_{2}Zr_{1.5}B_{7}$ alloy and shows the higher coercivity($iH_{c}=14~15kOe$). The higher Nd/Fe ratio in the melt-spun Nd-Fe-Co-B alloy, where the domain wall pinning mechanism was found to be predominant, assists the formation of Nd-rich grain boundary phase acting as a pinning site. The grain boundary ranges over $12~16\;{\AA}$ thick in the Nd-Fe-Co-B alloy while it ranges over $8~12\;{\AA}$ thick in the Nd-Fe-Co-Zr-B alloy.

• Journal of Energy Engineering
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• v.13 no.1
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• pp.60-67
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• 2004

The recent movement to deregulated and competitive electricity market reacquires new concepts against existing central dispatch in the system operation and pinning. As power systems tend to be operated more closely to their ultimate ratings, the role of SCOPF (Security Constrained Optimal Power flow) is changed and the importance for real-time security inhancement will be more increased i]1 the new and com partitive electricity market. This paper deals with the application of the SCOPF which makes possible the On-Line application. The security margin of power system truly is changed according to the conditions or configuration of power systems, therefore, the sensitivity factor reiated to the security is recalculated and the application should be updated in accordance with the state of power system. The goal of this paper is to obtain proper security through the effluent usage of the sensitivity and to apply this a1gorithm to system operation. The proposed mechanism has been tested on a sample system and the results show more secure conditions against critical contingencies.

• Archives of Plastic Surgery
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• v.43 no.2
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• pp.134-144
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• 2016

In adults, mallet finger is a traumatic zone I lesion of the extensor tendon with either tendon rupture or bony avulsion at the base of the distal phalanx. High-energy mechanisms of injury generally occur in young men, whereas lower energy mechanisms are observed in elderly women. The mechanism of injury is an axial load applied to a straight digit tip, which is then followed by passive extreme distal interphalangeal joint (DIPJ) hyperextension or hyperflexion. Mallet finger is diagnosed clinically, but an X-ray should always be performed. Tubiana's classification takes into account the size of the bony articular fragment and DIPJ subluxation. We propose to stage subluxated fractures as stage III if the subluxation is reducible with a splint and as stage IV if not. Left untreated, mallet finger becomes chronic and leads to a swan-neck deformity and DIPJ osteoarthritis. The goal of treatment is to restore active DIPJ extension. The results of a six- to eight-week conservative course of treatment with a DIPJ splint in slight hyperextension for tendon lesions or straight for bony avulsions depends on patient compliance. Surgical treatments vary in terms of the approach, the reduction technique, and the means of fixation. The risks involved are stiffness, septic arthritis, and osteoarthritis. Given the lack of consensus regarding indications for treatment, we propose to treat all cases of mallet finger with a dorsal glued splint except for stage IV mallet finger, which we treat with extra-articular pinning.

• Journal of the Korean Magnetics Society
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• v.11 no.2
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• pp.63-71
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• 2001

The effects of an Ag seed layer on the magnetic properties and the microstructural evolution of SmCo/Cr thin films deposited on glass substrates were investigated. Coercivity of the films is 2.0 kOe when the thickness of Ag seed layer was 1nm thick, but it increased to 2.7 kOe when the Ag seed layer thickness is 3 nm. The increase of coercivity for film with 3 nm-thick Ag is due to roughness of Cr and grain size of Cr by the Ag microbumps. Ar partial pressure influenced on the formation of Ag microbumps, for example, they were formed at 5 mTorr when Ag thickness was 1 nm. The mechanism of magnetization reversal of the SmCo films changed from domain wall motion to domain rotation as the Ag inserted. This was thought to be due to inhibition of domain wall motion by the reduction of Cr grain size and the increase of roughness.

• Journal of the Korean Magnetics Society
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• v.27 no.1
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• pp.23-29
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• 2017

In this study, the influences of magnetization reversal and magnetic interaction on the coercivity of Sr-ferrite particles with different sizes were investigated through various magnetic measurements. The shape of the initial magnetization curve and the magnetic field dependence of the coercive force indicate that the magnetization reversal changes from domain nucleation to wall pinning as the particle size decreases. On the other hand, the Henkel plot, interaction field factor and ${\Delta}M(H)$ obtained from the DCD and IRM curves show that the strength of the dipolar interaction is increased with increasing the particle size. Therefore, it can be concluded that coercivity is closely related to magnetic interaction as well as magnetization reversal mechanism.

• Journal of Magnetics
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• v.7 no.2
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• pp.45-50
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• 2002

A magnetic field annealing is firstly used for nanostructured Sm-Co/Co films, prepared by magnetron sputtering method. The effects of magnetic field annealing on single-layered Sm-Co films are different from those on multi-layered Sm-Co/Co films. A detailed analysis of microstructures and magnetic properties is made by means of HRTEM, Auger electron spectroscopy, XRD and Physical Property Measurement System (PPMS). From magnetic properties and microstructure analysis, it was confirmed that these differences originate from the effects of magnetic field annealing on crystallization behavior of the films. The relationship between magnetic properties and microstructures explains a different demagnetization process of single-layered and multilayered films. For the single-layered Sm-Co films, magnetic-field-annealing makes the main phases change from $CaCu_5/ to Zn_2Th_{17}$ structure, resulting in a decrease of coercivity. The results show that the magnetic-field-annealing is useful to improve the properties of nanostructured Sm-Co(30 nm)/Co(10 nm) films, which ascribe to improving the pinning effectiveness in coercivity mechanism and decreasing the magnetostatic interaction of films. A very high coercivity about 0.7 T was obtained from nanoscaled multi-layered Sm-Co(30 nm)-/Co(10 nm) films.

• Progress in Superconductivity and Cryogenics
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• v.16 no.2
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• pp.1-6
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• 2014

The five-year national project in Japan for R&D of coated conductors and applications, named as the Materials and Power Applications of Coated Conductors (M-PACC) project, was finished at the end of FY2013. The project consists of four sub-themes as cable, transformer, SMES and coated conductors. In the theme of coated conductors, the fabrication process had been developed to satisfy the requirements from the applications such as in-field $I_c$ performance, low AC loss in the long tapes etc. Through the project, the remarkable progress was achieved as follows; a high in-field minimum $I_c$ value over 54A/cm-width under 3T at 77K was realized in a 200m long EuBCO tape with artificial pinning centers of $BaHfO_3$ by the pulsed laser deposition (PLD) technique on the IBAD template. On the other hand, the AC loss reduction was confirmed in the tapes fabricated by both PLD and the metal organic deposition (MOD) techniques by scribing 100m tapes into 10-filamments. Additionally, the mechanism of the delamination phenomenon was systematically investigated and the strength was improved by eliminating the origins of the weak points in the films. Through the development, all targeted goals were accomplished and the several results were appreciated as a world champion data.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.108-108
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• 2007

Inkjet printing is a non-contact and direct writing associated with a computer. In the industrial field, there have been many efforts to utilize the inkjet printing as a new way of manufacturing, especially for electronic devices. The etching resist used in this process is an organic polymer which becomes solidified when exposed to ultraviolet lights and has high viscosity of 300 cPs at ambient temperature. A piezoelectric-driven ink jet printhead is used to dispense $20-40\;{\mu}m$ diameter droplets onto the copper substrate to prevent subsequent etching. In this study, factors affecting the pattern formation such as printing resolution, jetting property, adhesion strength, etching and strip mechanism, UV pinning energy have been investigated. As a result, microscale Etch resist patterning of printed circuit board with tens of ${\mu}m$ high have been fabricated.