• Proceedings of the KSME Conference
• /
• 2003.11a
• /
• pp.31-36
• /
• 2003

Recently, the power consumption and heat generation in an electronic equipment increase as the components are miniaturized and the computing speed becomes faster. Effective cooling method is required to ensure the guaranteed performance and reliable operation of the electronic devices. The aim of the present study is to investigate the cooling characteristics of a pin-fin heat exchanger as a candidate for cooling system of the electronic devices. Various configuration of the pin-fin array is selected in order to find out the effect of spacing and diameter of the pin-fin on the heat transfer characteristics. The results are compared with the experimental data or correlations of several researchers for the channel flow with pin-fin arrays.

• Journal of the Institute of Electronics Engineers of Korea TC
• /
• v.46 no.10
• /
• pp.63-71
• /
• 2009

The patch antennas with an array of pins with excellent radiation characteristics are investigated for several substrate thicknesses. The patch length of a pin array patch antenna for the maximum suppression of radiation in the horizontal plane decreases as the substrate thickness increases. The radiation in the horizontal plane of a pin array patch antenna is very small compared to that of a conventional patch antenna. The increase of forward radiation and the decrease of backward radiation of a pin array patch are obtained compared to those of a conventional patch antenna. The half-power beamwidth of E-plane radiation pattern of a pin array patch antenna is narrow compared to that of a conventional patch antenna so that the directivity is improved.

• Journal of the Korean Institute of Telematics and Electronics A
• /
• v.31A no.6
• /
• pp.88-97
• /
• 1994

We describe the design, fabrication, and performance of the optical fiber-photodiode 1$\times$12 arry module using mesa-type InS10.53T GaS10.47TAS/INP 1$\times$12 PIN photodiode array. We fabricated the PIN PD array for high-speed optical fiber parallel data link optimizing quantum efficiency, operating speed sensitivity from the PIN-FET structure, and electrical AC crosstalk. For each element of the array, the diameter of the photodetective area is 80 $\mu$m, the diameter of the p-metal pad is 90 $\mu$m, and the photodiode seperation is 250 $\mu$m to use Si v-groove. Ground conductor line is placed around diodes and p-metal pads are formed in zigzag to reduce Ac capacitance coupling between array elements. The dark current (IS1dT) is I nA and the capacitance(CS1pDT) is 0.9 pF at -5 V. No signifcant variations of IS1dT and CPD from element to element in the array were observed. We calulated the coupling efficiency for 10/125 SMF and 50/125 GI MMF, and measured the responsivity of the PD array at the wavelength is 1.55 $\mu$ m. Responsivities are 0.93 A/W for SMF and 0.96 A/W for MMF. The optical fiber-PD array module is useful in numerous high speed digital and analog photonic system applications.

• Proceedings of the IEEK Conference
• /
• 2008.06a
• /
• pp.355-356
• /
• 2008

Effect of the pin radius on the radiation characteristics of a patch antenna with a pin array inserted between a patch and ground plane is investigated. As the pin radius increases, the resonant frequency increases and the radiation intensity in the horizontal plane decreases. However, the radiation intensity in the horizontal plane increases for the pin radius larger than a certain value.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2012.10a
• /
• pp.163-164
• /
• 2012

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2010.11a
• /
• pp.985-986
• /
• 2010

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2011.06a
• /
• pp.795-796
• /
• 2011

• Journal of the Microelectronics and Packaging Society
• /
• v.18 no.2
• /
• pp.29-33
• /
• 2011

Research about the geometry design of lead pin was carried based on the normal or shear stress of the interface between a lead pin and a PCB in terms of delamination failure. The taguchi method with four design factors of three levels and FEA(Finite element Analysis) are carried under $20^{\circ}$ bending and 50 ${\mu}m$ tension of lead pin. The contact width, d2, between head round and copper pad in PCB is the highest affection factor among design factors by analysis of contribution analysis. Equivalent von Mises stress of 18.7% reduction design is obtained by the parameter design of the taguchi method. Maximum normal stress occurred at contact position between solder outer surface and a Cu pad in PCB. Also, maximum shear stress happened at contact position between solder outer surface and SR layer of PCB. From these calculated results, delamination of the PGA package may be occurred from outer interface of solder to inner interface of solder.

• Journal of the Korea Institute of Information and Communication Engineering
• /
• v.13 no.1
• /
• pp.6-16
• /
• 2009

For the application to the direction finding(DF) antenna for V/UHF bands, circular active array composed of 9 dipole element has been investigate. For miniaturization of the overall size array, the element has been chosen to be of the top-hat dipole type. For the broadband operation over 20-1300MHz, some number of pin diodes have been inserted in each arms of each dipole element. By employing this type of each element dipole, the effective dipole length can be increased or decreased according as the inserted pin diodes is on or off. The active array antenna has been design to be directly connected to the balanced push full amplifier such that the amplifier may play a role as a balloon and may improve the sensitivity as a receiver as well. The active array antenna has been designed and fabricated. Some experimental results have been presented in comparison with simulated results.

• Journal of Advanced Navigation Technology
• /
• v.27 no.4
• /
• pp.463-468
• /
• 2023

In this paper, we proposed reconfigurable dual polarization patch array antenna that can select two polarizations(Vertical, RHCP) using defected ground structure and Pin diode. The proposed antenna was designed arranging a circular polarization patch antenna implemented with a square microstrip patch and two slots 3x3 at 25.8mm placed, a half-wavelength of 5.8 GHz. Conect the pin diode and the capacitor to the slot diagonally placed on the ground of each antennas, and select polarization using the open/short operating according to the application of DC voltage to the pin diode. As a result of the design, the gain of the antenna is 11.7 dBi at vertical polarization and 11.6 dBic at RHCP. The axial ratio is 20.3 dB at 1.8 dB vertical polarization at RHCP. Mutual Coupling is Maximum to -20.8 dB for vertical polarization and Maximum to -30.1 dB for RHCP.