• Journal of Industrial Technology
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• v.31 no.A
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• pp.21-25
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• 2011

A comparison of temperature distributions along the fin length coordinate between two different fin tip boundary conditions for a circular pin fin is made by using the one-dimensional analytic method. One tip boundary condition is the actual fin tip boundary condition and fin tip temperature is arbitrarily given for another fin tip boundary condition. The value of the fin base temperature is depend on the fin base thickness and fin radius. One of the results shows that the temperature distribution along the fin length coordinate for the actual fin tip boundary condition and that for the arbitrarily given fin tip temperature are the same if the arbitrarily given fin tip temperature and the fin tip temperature for the actual fin tip boundary condition are the same.

• Korean Journal of Agricultural Science
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• v.30 no.1
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• pp.76-88
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• 2003

This study exploits the robot system which is necessary in gene study, bio-technology industry. As well, it can achieve the job of DNA chip manufacturing whose use rate has been increased recently. The robot consists of DNA spotting device for spotting DNA on the silylated slide and well plate, bed for fixing well-plate, washing & drying device of washing and drying the pin part of DNA spotting device, distillation-water vessel, and discharge vessel of wash water. We made the term of sticking DNA to the pin on well plate to be 15 seconds. The spot size of DNA was set to be 0.28 mm on the average by bringing the slide into contact with pin for 1 second. At this rate, if DNA is spotted in the minimum space possible of about 0.32mm, it can stick about 8,100 DNA spots on the well plate. Analyzing the procedure: Movement starts. Pin washes, dries, and smears DNA on the well plate. Spots DNA onto 12 chips takes 2 minutes and 50 seconds.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.46 no.10
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• pp.63-71
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• 2009

The patch antennas with an array of pins with excellent radiation characteristics are investigated for several substrate thicknesses. The patch length of a pin array patch antenna for the maximum suppression of radiation in the horizontal plane decreases as the substrate thickness increases. The radiation in the horizontal plane of a pin array patch antenna is very small compared to that of a conventional patch antenna. The increase of forward radiation and the decrease of backward radiation of a pin array patch are obtained compared to those of a conventional patch antenna. The half-power beamwidth of E-plane radiation pattern of a pin array patch antenna is narrow compared to that of a conventional patch antenna so that the directivity is improved.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.13 no.8
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• pp.811-818
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• 2002

In this paper, a shorting pin and slot-loaded microstrip patch antenna is designed and fabricated. A shorting pin and slots are used for harmonic suppression on an inset fed antenna. A shorting pin and slot properties are analyzed by cavity model of the rectangular patch and the characteristics of the designed antenna are described. The designed antenna provides a gain of 7 dBi at the fundamental frequency, 5.8 GHz. In the second and third harmonic frequencies, the proposed antenna has gain suppression properties of -3.3 dB and -14.3 dB at each harmonic frequency, respectively.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.46 no.12
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• pp.44-51
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• 2009

The radiation characteristics of a pin array patch antenna phased array are compared to those of a conventional patch antenna phased array. The performance of a pin array patch antenna phased array is much improved than that of a conventional patch antenna phased array because the mutual coupling between the adjacent pin array patch antennas is very small compared to that between the adjacent conventional patch antennas. The radiation characteristics of a pin array patch antenna phased array show the superior performance such as low variation of the gain of the main beam and the side lobe level for the variation of the direction of the main beam.

• Journal of Industrial Technology
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• v.23 no.A
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• pp.21-27
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• 2003

The bio-micro pin is usually used for biochemistry analysis. The capability of manufacturing the micro-pin and array with effective and low-cost way is very important to developers. The micro-pin is composed of "sample channel" putting liquid into already fixed volume, "flat tip" having connection with printing quantity, and "head part" for preventing it from rotation of pin in the holder. We analyzed out printing variation in accordance with shape and tip size of the micro-pin point channel, In this study, we suggested the manufacturing progress and shape demand condition of the micro-pin which could put $0.2{\mu}{\ell}$-biochemistry material into the sample volume, and will be able to produce the micro-pin which can put $10n{\ell}$-biochemistry material into the sample volume in the future.

• Composites Research
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• v.25 no.3
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• pp.65-69
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• 2012

The main objective of this study is to investigate the effect of metal z-pinning on the failure behavior of cocured composite single-lap joints. Three different pin diameters (0.3, 0.5, and 0.7 mm) and three pin areal densities (0.5, 2.0, and 4.0%) were examined. The specimens were fabricated by T700-12K-31E#2510 unidirectional prepreg from Toray. Stainless steel pins were used for z-pinning. Test results showed that except one case with extremely low pin density of 0.5%, all other z-pinned joints exhibited lower initial crack stresses than those of the unpinned joint. However the ultimate strength of the z-pinned joint increased up to 45% at most. Furthermore, even after the complete failure of the joint, the z-pins sustained the carried load to a certain degree experiencing large deformation and provided the stable fracture behavior for the composite joint.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.27 no.12
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• pp.1084-1096
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• 2016

This paper presents method of design and analysis of a high-speed serial interface connector with a data rate of 12.5 Gbps. A high-speed serial interface connector is composed of various material and complex structures. It is very difficult to match the impedance of each discontinuous portion of connector. Therefore, this paper proposes the structure of a connector line that be simplified a connector. In the structure of proposed connector line, this research presents a method for extracting R, L, C and G parameters, analyzing the differential mode impedance, and minimizing the impedance discontinuity using time domain transmissometry and time domain reflectometry. This paper applies the proposed methods in the connector line to the high-speed serial interface connector. The proposed high-speed serial interface connector, which consists of forty-four pins, is analyzed signal transmission characteristics by changing the width and spacing of the four pins. According to the analysis result, as the width of the ground pin increases, the impedance decreases slightly. And as the distance between the ground pin and the signal pin increases, the impedance increases. In addition, as the width of the signal pin increases, the impedance decreases. And as the distance between the signal pin and the signal pin increases, the impedance decreases. The impedance characteristic of initial connector presents ranges from 96 to $139{\Omega}$. Impedance characteristic after applying the structure of proposed connector is shown as a value between 92.6 to $107.5{\Omega}$. This value satisfies the design objective $100{\Omega}{\pm}10%$.

• Journal of the Korean Society of Propulsion Engineers
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• v.23 no.3
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• pp.35-43
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• 2019

In this study, a guide vane with varying positions and incidence angles was adopted to a pin-fin channel to analyze the change in thermal performance and pressure loss characteristics. A numerical analysis was conducted to investigate the effect of incidence angles and positions on heat transfer and flow characteristics at Re =1400. The results of it were compared those of a pin-fin channel without a guide vane. In case 1 when the incidence angle is $0^{\circ}$, the heat transfer performance is maximized and improved by approximately 5% when compared to the pin-fin channel without the guide vane. In case 2 when the incidence angle is $10^{\circ}$, the pressure loss is minimized and decreased by approximately 1.9% when compared to the pin-fin channel without the guide vane.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.2
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• pp.29-33
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• 2011

Research about the geometry design of lead pin was carried based on the normal or shear stress of the interface between a lead pin and a PCB in terms of delamination failure. The taguchi method with four design factors of three levels and FEA(Finite element Analysis) are carried under $20^{\circ}$ bending and 50 ${\mu}m$ tension of lead pin. The contact width, d2, between head round and copper pad in PCB is the highest affection factor among design factors by analysis of contribution analysis. Equivalent von Mises stress of 18.7% reduction design is obtained by the parameter design of the taguchi method. Maximum normal stress occurred at contact position between solder outer surface and a Cu pad in PCB. Also, maximum shear stress happened at contact position between solder outer surface and SR layer of PCB. From these calculated results, delamination of the PGA package may be occurred from outer interface of solder to inner interface of solder.