• Title/Summary/Keyword: photolithography

Search Result 506, Processing Time 0.032 seconds

Tribology Characteristics in 200 μm of Hexagonal Array Dimple Pattern

  • Choi, W. S.;Angga, S.H.;Kwon, S. H.;Kwon, S. G.;Park, J. M.;Kim, J. S.;Chung, S. W.;Chae, Y. H.
    • Tribology and Lubricants
    • /
    • v.31 no.2
    • /
    • pp.50-55
    • /
    • 2015
  • This study investigates the effects of a pattern of 200 μm dimples in a hexagonal array on tribological characteristics. A textured surface might reduce the friction coefficient and wear caused by third-body abrasion and thus improve the tribological performance. There are three friction conditions based on the Stribeck curve: boundary friction, mixed friction, and fluid friction conditions. In this experiment, we investigate the friction characteristics by carrying out the friction tests at sliding speeds ranging from 0.06 to 0.34 m/s and normal load ranging from 10 to 100 N. We create dimple surfaces for texturing by using the photolithography method. There are three kinds of specimens with different dimple densities ranging from 10% to 30%. The dimple density on the surface area is the one of the important factors affecting friction characteristics. Friction coefficient generally decreases with an increase in the velocity and load, indicating that the lubrication regime changes depending on the load and velocity. The fluid friction regime is fully developed, as indicated by the duty number graph. Fluid friction occurs at a velocity of 0.14-0.26 m/s. The best performance is seen at 10% dimple density and 200 μm dimple circle in the hexagonal array.

Fabrication of diffractive optical element for objective lens of small form factor data storage device (초소형 광정보저장기기용 웨이퍼 스케일 대물렌즈 제작을 위한 회절광학소자 성형기술 개발)

  • Bae H.;Lim J.;Jeong K.;Han J.;Yoo J.;Park N.;Kang S.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
    • /
    • 2005.09a
    • /
    • pp.35-40
    • /
    • 2005
  • The demand for small and high-capacity optical data storage devices has rapidly increased. The areal density of optical disk is increased using higher numerical aperture objective lens and shorter wavelength source. A wafer-scale stacked micro objective lens with a numerical aperture of 0.85 and a focal length of 0.467mm for the 405nm blue- violet laser was designed and fabricated. A diffractive optical element (DOE) was used to compensate the spherical aberration of the objective lens. Among the various fabrication methods for micro DOE, the UV-replication process is more suitable for mass-production. In this study, an 8-stepped DOE pattern as a master was fabricated by photolithography and reactive ion etching process. A flexible mold was fabricated for improving the releasing properties and shape accuracy in UV-molding process. In the replication process, the effects of exposing time and applied pressure on the replication quality were analyzed. Finally, the shapes of master, mold and molded pattern were measured by optical scanning profiler. The deviation between the master and the molded DOE was less than 0.1um. The efficiency of the molded DOE was measured by DOE efficiency measurement system which consists of laser source, sample holder, aperture and optical power meter, and the measured value was $84.5\%$.

  • PDF

Comparative Study of Thermal Annealing and Microwave Annealing in a-InGaZnO Used to Pseudo MOSFET

  • Mun, Seong-Wan;Jo, Won-Ju
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 2013.08a
    • /
    • pp.241.2-241.2
    • /
    • 2013
  • 최근, 비정질 산화물 반도체 thin film transistor (TFT)는 수소화된 비정질 실리콘 TFT와 비교하여 높은 이동도와 큰 on/off 전류비, 낮은 구동 전압을 가짐으로써 빠른 속도가 요구되는 차세대 투명 디스플레이의 TFT로 많은 연구가 진행되고 있다. 한편, 기존의 MOSFET 제작 시 우수한 박막을 얻기 위해서는 $500^{\circ}C$ 이상의 높은 열처리 온도가 필수적이며 이는 유리 기판과 플라스틱 기판에 적용하는 것이 적합하지 않고 높은 온도에서 수 시간 동안 열처리를 수행해야 하므로 공정 시간 및 비용이 증가하게 된다는 단점이 있다. 따라서, 본 연구에서는 RF sputter를 이용하여 증착된 비정질 InGaZnO pesudo MOSFET 소자를 제작하였으며, thermal 열처리와 microwave 열처리 방식에 따른 전기적 특성을 비교 및 분석하고 각 열처리 방식의 열처리 온도 및 조건을 최적화하였다. P-type bulk silicon 위에 산화막이 100 nm 형성된 기판에 RF 스퍼터링을 이용하여 InGaZnO 분말을 각각 1:1:2mol% 조성비로 혼합하여 소결한 타겟을 사용하여 70 nm 두께의 InGaZnO를 증착하였다. 연속해서 Photolithography 공정과 BOE(30:1) 습식 식각 과정을 이용해 활성화 영역을 형성하여 소자를 제작하였다. 제작 된 소자는 pseudo MOSFET 구조이며, 프로브 탐침을 증착 된 채널층 표면에 직접 접촉시켜 소스와 드레인 역할을 대체하여 동작시킬 수 있어 전기적 특성을 간단하고 간략화된 공정과정으로 분석할 수 있는 장점이 있다. 열처리 조건으로는 thermal 열처리의 경우, furnace를 이용하여 각각 $300^{\circ}C$, $400^{\circ}C$, $500^{\circ}C$, $600^{\circ}C$에서 30분 동안 N2 가스 분위기에서 열처리를 실시하였고, microwave 열처리는 microwave를 이용하여 각각 400 W, 600 W, 800 W, 1000 W로 20분 동안 실시하였다. 그 결과, furnace를 이용하여 열처리한 소자와 비교하여 microwave 를 통해 열처리한 소자에서 subthreshold swing (SS), threshold voltage (Vth), mobility 등이 개선되는 것을 확인하였다. 따라서, microwave 열처리 공정은 향후 저온 공정을 요구하는 MOSFET 제작 시의 훌륭한 대안으로 사용 될 것으로 기대된다.

  • PDF

Electrical characteristics of SiC thin film charge trap memory with barrier engineered tunnel layer

  • Han, Dong-Seok;Lee, Dong-Uk;Lee, Hyo-Jun;Kim, Eun-Kyu;You, Hee-Wook;Cho, Won-Ju
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 2010.08a
    • /
    • pp.255-255
    • /
    • 2010
  • Recently, nonvolatile memories (NVM) of various types have been researched to improve the electrical performance such as program/erase voltages, speed and retention times. Also, the charge trap memory is a strong candidate to realize the ultra dense 20-nm scale NVM. Furthermore, the high charge efficiency and the thermal stability of SiC nanocrystals NVM with single $SiO_2$ tunnel barrier have been reported. [1-2] In this study, the SiC charge trap NVM was fabricated and electrical properties were characterized. The 100-nm thick Poly-Si layer was deposited to confined source/drain region by using low-pressure chemical vapor deposition (LP-CVD). After etching and lithography process for fabricate the gate region, the $Si_3N_4/SiO_2/Si_3N_4$ (NON) and $SiO_2/Si_3N_4/SiO_2$ (ONO) barrier engineered tunnel layer were deposited by using LP-CVD. The equivalent oxide thickness of NON and ONO tunnel layer are 5.2 nm and 5.6 nm, respectively. By using ultra-high vacuum magnetron sputtering with base pressure 3x10-10 Torr, the 2-nm SiC and 20-nm $SiO_2$ were successively deposited on ONO and NON tunnel layers. Finally, after deposited 200-nm thick Al layer, the source, drain and gate areas were defined by using reactive-ion etching and photolithography. The lengths of squire gate are $2\;{\mu}m$, $5\;{\mu}m$ and $10\;{\mu}m$. The electrical properties of devices were measured by using a HP 4156A precision semiconductor parameter analyzer, E4980A LCR capacitor meter and an Agilent 81104A pulse pattern generator system. The electrical characteristics such as the memory effect, program/erase speeds, operation voltages, and retention time of SiC charge trap memory device with barrier engineered tunnel layer will be discussed.

  • PDF

Analysis on Design and Fabrication of High-diffraction-efficiency Multilayer Dielectric Gratings

  • Cho, Hyun-Ju;Lee, Kwang-Hyun;Kim, Sang-In;Lee, Jung-Hwan;Kim, Hyun-Tae;Kim, Won-Sik;Kim, Dong Hwan;Lee, Yong-Soo;Kim, Seoyoung;Kim, Tae Young;Hwangbo, Chang Kwon
    • Current Optics and Photonics
    • /
    • v.2 no.2
    • /
    • pp.125-133
    • /
    • 2018
  • We report an in-depth analysis of the design and fabrication of multilayer dielectric (MLD) diffraction gratings for spectral beam combining at a wavelength of 1055 nm. The design involves a near-Littrow grating and a modal analysis for high diffraction efficiency. A range of wavelengths, grating periods, and angles of incidence were examined for the near-Littrow grating, for the $0^{th}$ and $-1^{st}$ diffraction orders only. A modal method was then used to investigate the effect of the duty cycle on the effective indices of the grating modes, and the depth of the grating was determined for only the $-1^{st}$-order diffraction. The design parameters of the grating and the matching layer thickness between grating and MLD reflector were refined for high diffraction efficiency, using the finite-difference time-domain (FDTD) method. A high reflector was deposited by electron-beam evaporation, and a grating structure was fabricated by photolithography and reactive-ion etching. The diffraction efficiency and laser-induced damage threshold of the fabricated MLD diffraction gratings were measured, and the diffraction efficiency was compared with the design's value.

Emission Characteristics of VOCs Distributions in Semiconductor Workplace (반도체 작업환경의 VOCs 농도분포 특성)

  • Lee, Jeong Joo
    • Journal of the Korean Society of Urban Environment
    • /
    • v.18 no.4
    • /
    • pp.503-509
    • /
    • 2018
  • In this study, a Proton-Transfer Reaction-Time-of-Flight Mass spectrometer (PTR-TOF-MS) was used for the continuous monitoring of Volatile Organic Compounds (VOCs) emitted from semiconductor workplace such as photolithography (PHOTO), flat panel display (FPD), organic light emitting diode (OLED), etching (WET) process. The averaged VOCs mixing ratio in the such workplace, PHOTO was 6.5 ppm, FPH was 6.4 ppm, WET was 2.0 ppm and OLED was 1.3 ppm, respectively. The abundance of VOCs in the workplace were methyl ethyl ketone (MEK) with 2.8 ppm (69%) and acetaldehyde with 0.5 ppm (13.2%). Depending on the semiconductor process characteristics, various VOCs have been observed in the workplace. The VOCs mixing ratio are lower than the workplace regulation standard (TWA), it is necessary to continuously monitor and effectively manage these VOCs.

Tribology Characteristics of Hexagonal Shape Surface Textured Reduction Gear in Electric Agricultural Vehicle

  • Choi, Wonsik;Pratama, Pandu Sandi;Byun, Jaeyoung;Kwon, Soonhong;Kwon, Soongu;Park, Jongmin;Kim, Jongsoon;Chung, Songwon
    • Journal of the Korean Society of Industry Convergence
    • /
    • v.22 no.1
    • /
    • pp.47-54
    • /
    • 2019
  • An experimental study was conducted on the wear and friction responses in sliding tests of a micro-textured surface on laser pattern (LP) steel as reduction gear material in electric guided vehicle. In this research, the friction characteristics of laser pattern steel under different micro texture density conditions were investigated. The friction tests were carried out at sliding speeds of 0.06 m/s to 0.34 m/s and at normal loads of 2 to 10 N. Photolithography method was used to create the dimples for surface texturing purpose. Four different specimens having different dimple densities of 10%, 12.5%, 15%, and 20% were observed respectively. In this research, friction conditions as shown in Stribeck curve were investigated. Furthermore, the microscopic surface was observed using scanning electron microscope. It was found that the dimple density had a significant role on the friction characteristics of laser pattern steel conditioned as reduction gear material in an agricultural vehicle. The duty number showed that the friction condition was hydrodynamic regime. The best performance was obtained from 12.5% dimple density with lowest friction coefficient achieved at 0.018771 under the velocity of 0.34 m/s and 10N load.

Evaluation of Hazardous Chemicals with Material Safety Data Sheet and By-products of a Photoresist Used in the Semiconductor-Manufacturing Industry

  • Jang, Miyeon;Yoon, Chungsik;Park, Jihoon;Kwon, Ohhun
    • Safety and Health at Work
    • /
    • v.10 no.1
    • /
    • pp.114-121
    • /
    • 2019
  • Background: The photolithography process in the semiconductor industry uses various chemicals with little information on their constitution. This study aimed to identify the chemical constituents of photoresist (PR) products and their by-products and to compare these constituents with material safety data sheets (MSDSs) and analytical results. Methods: A total of 51 PRs with 48 MSDSs were collected. Analysis consisted of two parts: First, the constituents of the chemical products were identified and analyzed using MSDS data; second, for verification of the by-products of PR, volatile organic compounds were analyzed. The chemical constituents were categorized according to hazards. Results: Forty-five of 48 products contained trade secrets in amounts ranging from 1 to 65%. A total of 238 ingredients with multiple counting (35 ingredients without multiple counting) were identified in the MSDS data, and 48.7% of ingredients were labeled as trade secrets under the Korea Occupational Safety and Health Act. The concordance rate between the MSDS data and the analytical result was 41.7%. The by-product analysis identified 129 chemicals classified according to Chemical Abstracts Service No., with 17 chemicals that are carcinogenic, mutagenic, and reprotoxic substances. Formaldehyde was found to be released from 12 of 21 products that use novolak resin. Conclusion: We confirmed that several PRs contain carcinogens, and some were not specified in the toxicological information in the MSDS. Hazardous chemicals, including benzene and formaldehyde, are released from PRs products as by-products. Therefore, it is necessary to establish a systematic management system for chemical compounds and the working environment.

Fabrication of 3D Multilayered Microfluidic Channel Using Fluorinated Ethylene Propylene Nanoparticle Dispersion (불소화 에틸렌 프로필렌 나노 입자 분산액을 이용한 3차원 다층 미세유체 채널 제작)

  • Min, Kyoung-Ik
    • Korean Chemical Engineering Research
    • /
    • v.59 no.4
    • /
    • pp.639-643
    • /
    • 2021
  • In this study, fluorinated ethylene propylene (FEP) nanoparticle as an adhesive for fabricating a three-dimensional multilayered microfluidic device was studied. The formation of evenly distributed FEP nanoparticles layer with 3 ㎛ in thickness on substrates was achieved by simple spin coating of FEP dispersion solution at 1500 rpm for 30 s. It is confirmed that FEP nanoparticles transformed into a hydrophobic thin film after thermal treatment at 300 ℃ for 1 hour, and fabricated polyimide film-based microfluidic device using FEP nanoparticle was endured pressure up to 2250 psi. Finally, a three-dimensional multilayered microfluidic device composed of 16 microreactors, which are difficult to fabricate with conventional photolithography, was successfully realized by simple one-step alignment of FEP coated nine polyimide films. The developed three-dimensional multilayered microfluidic device has the potential to be a powerful tool such as high-throughput screening, mass production, parallelization, and large-scale microfluidic integration for various applications in chemistry and biology.

Fabrication and Characterization of Dissolving Microneedles Containing Lecithin for Transdermal Drug Delivery (레시틴이 함유된 경피 약물전달용 용해성 마이크로니들의 제작과 특성)

  • Choi, Won-Ho;Kim, Bumsang
    • Korean Chemical Engineering Research
    • /
    • v.59 no.3
    • /
    • pp.429-434
    • /
    • 2021
  • The feasibility of lecithin as a material for dissolving microneedles to improve skin permeability of drugs and the effect of the composition of lecithin on the mechanical strength, solubility, and skin permeability of rhodamine B (RhB) of the dissolving microneedles were investigated. Dissolving microneedles with needles of uniform shape and size were fabricated with the mold made using the laser-writing technique, simpler and more efficient method compared to the photolithography method, the conventional method to fabricate the microneedle mold. The composition of lecithin in the microneedle affected the mechanical strength and solubility of the needle thus, the mechanical strength of the needle increased as the composition of lecithin in the needle increased, resulting in improving the skin permeability of RhB contained in the microneedles. When comparing the microneedles containing same composition of amylopectin (AP), the skin permeability of RhB of the microneedles containing lecithin was higher. These results indicate that lecithin can be used as a material for dissolving microneedles and the skin permeability of the microneedle could be controlled by changing the composition of lecithin.