• Applied Chemistry for Engineering
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• v.23 no.1
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• pp.18-22
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• 2012

Photocurable binder for a transparent glass fiber composite was prepared with alicyclic methacrylate and fluorene-based diacrylate. ANOVA (analysis of variance) analysis was used to know main factors affecting the conversion of photocurable binder. It showed radiation intensity and photoinitiator (PI) concentration were main factors. The conversion of photocurable binder was simply increased with radiation intensity. Its increment however was abated with increasing PI concentration. We found that average conversion of the binder measured by FTIR-ATR was 87% when it was exposed to $5J/cm^2$ of UV dose with 5 wt% of PI. Oxime ester type PI was very effective to get a high degree of conversion, but it caused a yellowing problem. Owing to post-baking process, UV cured film showed an improved thermal stability by increase of conversion and removal of volatile organic compounds. TG% at $260^{\circ}C$ of film cured with 5 wt% of PI (TPO+MBF) and $5J/cm^2$ of UV radiation increased from 95.4 to 99.0% by post-baking at $230^{\circ}C$ for 5 min.

• Applied Chemistry for Engineering
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• v.34 no.4
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• pp.444-449
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• 2023

As electronic devices become smaller and more integrated, the demand for manufacturing thin, flexible printed circuit boards (FPCBs) has increased. Although FPCBs are conventionally manufactured by a photolithography method using dry film resist, this process is complicated, and the mask is specifically designed to obtain the precision of the desired circuit line width. In this regard, manufacturing FPCBs with fine patterns through the direct printing method of photocurable inks has gained growing attention. Since the manufacturing process of FPCBs is based on the direct printing method that includes etching and stripping processes utilizing acid and basic chemicals, controlling the adhesion strength, the etching resistance, and the strippability of photocured inks has drawn a lot of attention for the fabrication of fine patterns through photocurable inks. In this study, acrylic ink with various types and contents of the photoinitiator was prepared, and the curing behavior was analyzed. Also, the adhesion strength, etching resistance, and strippability were analyzed to evaluate the applicability of developed photocurable etching resist inks.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.4
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• pp.102-108
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• 2010

Projection microstereolithography is a process of fabricating a micro-structure by using dynamic mask such as digital micromirror device(DMD). DMD shapes the beam into cross-sectional image of structure. Photocurable resin is cured by the beam and stacked layer on top of layer. It is difficult to deliver the beam from the DMD to the photocurable resin without any distortions. We assume that the beam exposed to the resin by 1 pixel of DMD has Gaussian distribution, so the shaped beam reflected by the DMD affects its neighboring area. Curing pattern corresponding to a cross-sectional images is predicted by superposition of pixels of Gaussian distribution and it is similar to cured shape.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1259-1264
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• 2007

Microstereolithography technology has potential capability for fabrication of 3D microstructures. It evolved from conventional SLA which is one of the RP processes. In a microstereolithography process, 3D microstructures can be easily fabricated by continuously stacking 2D layer which is photopolymerized using a liquid prepolymer. Combination between biocompatible/biodegradable photocurable prepolymer and 3D complex fabrication in microstereolithography makes broad application areas such as medical, pharmaceutic, and bio devices. In particular, a 3D microneedle for transdermal drug delivery and a scaffold for tissue engineering are fabricated using this technology. In this paper, the authors address development of microstereolithography system adapted to large surface and fabrication of various microstructures. In addition, to apply human body we suggest a biodegradable 3D microneedle and a scaffold using biodegradable photocurable prepolymer.

• Polymer(Korea)
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• v.28 no.6
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• pp.531-537
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• 2004

Various half-ester acrylates were prepared from anhydrides and 2-hydroxyethyl acrylate. Photocurable epoxy modified acrylates were prepared from synthesized half-ester acrylate and neopentylglycol diglycidylether. Physical properties such as hardness, yellowing, tensile strength and elongation were tested and compared as the structure of oligomer in cured-film differs. It was found that viscosity of neopentylglycol diglycidylether-hexahydrophthalic anhydride (NP-HA) was highest. Hardness and tensile strength of photocrosslinked neopentylglycol diglycidylether-hexahydrophthalic anhydride were better than those of other photocrosslinted epoxy acrylates. And 5% weight loss temperature of photocrosslinked neopentylglycol diglycidylether-hexahydrophthalic anhydride was higher than those of other photocrosslinked epoxy acrylates. Value of yellow index of photocrosslinked neopentylglycol diglycidyl ether-succinic anhydride (NP-SA) was lower than the other products.

• Polymer(Korea)
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• v.33 no.1
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• pp.19-25
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• 2009

New polyelectrolytes derived from ionene-containing photocurable reactive oligomer (PIDM) were prepared for water-resistant humidity-sensitive membranes. The mixture of PIDM, hexamethylene dimethacrylate (HDM), pentaerythritol triacrylate dimer (SP1013), and photoinitiator was simultaneously coated on the sensor electrode with photoinitiated radical polymerization. The pretreatment of the substrates with vinyl-type silane-coupling reagent was performed for improving the water durability and stability of the sensors at high temperature and humidity. When the resistance dependences on the relative humidity of the crosslinked PIDMs were measured, it was found that the resistance varied three orders of magnitude between 20 and 90%RH, which was required for the humidity sensor operating at ambient humidity. Their hysteresis, temperature dependence, response time, water durability, and high temperature/humidity stabilities were measured and evaluated as a humidity-sensing membrane.

• Korean Journal of Materials Research
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• v.31 no.9
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• pp.532-538
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• 2021

In this study, a spray dryer is used to make granules of Y₂O₃ and YF₃, and then Y₅O₄F₇ is synthesized following heat treatment of them under Ar gas atmosphere at 600 ℃. Single and binary monomer mixtures are compared and analyzed to optimize photocurable monomer system for DLP 3D printing. The mixture of HEA and TMPTA at 8:2 ratio exhibits the highest photocuring properties and low viscosity with shear thinning behavior. The optimized photocurable monomer and synthesized Y₅O₄F₇ are therefore mixed and applied to printing process at variable solid contents (60, 70, 80, & 85 wt.%) and light exposure times. Under optimal light exposure conditions (initial exposure time: 1.2 s, basic exposure time: 5 s), YOF composites at 60, 70 & 80 wt.% solid contents are successfully printed. As a result of measuring the size of the printed samples compared to the dimensions of the designed bar type specimen, the deviation is found to increase as the YOF solid content increases. This shows that it is necessary to maximize the photocuring activity of the monomer system and to optimize the exposure time when printing using a high-solids ceramic slurry.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.661-662
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• 2011

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.655-656
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• 2011

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1625-1628
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• 2006

Two different negative-type photosensitive polyimides were synthesized and characterized for an application as an interdielectric layer in TFTLCD array. In the case of photocurable polyimides, the photosensitive moiety, 2-HHSP, was synthesized through 3 step reaction, and then was incorporated into side chains of polyimide precursor by post reaction. Optimum compositions of negative-type photocurable polyimde were also formulated. For photopolymerizable polyimides, two novel UV monomers containing imide linkages were prepared. An aqueous alkaline developable polymer matrix was synthesized by free radical copolymerization. A negative photoresist formulation was developed utilizing synthesized UV monomers containing imide linkage, photoinitiator, UV oligomer, and alkali developable polymer matrix. It was found that viaholes with good resolution, high transmittance and thermal resistance could be obtained by photolithographic process utilizing the negative-type photoresist formulations.