공업화학 (Applied Chemistry for Engineering)

  • 제34권4호
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  • Pages.444-449
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  • 2023
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  • 1225-0112(pISSN)
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  • 2288-4505(eISSN)
한국공업화학회 (The Korean Society of Industrial and Engineering Chemistry)
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광개시제 종류 및 함량에 따른 광경화형 잉크의 광경화 특성과 인쇄회로기판용 에칭 레지스트 소재로의 적용성 연구

Investigating the Effect of Photoinitiator Types and Contents on the Photocuring Behavior of Photocurable Inks and Their Applications for Etching Resist Inks

  • 김보영 (한국전자기술연구원 융복합전자소재연구센터) ;
  • 조수빈 (한국전자기술연구원 융복합전자소재연구센터) ;
  • 정과정 (한국전자기술연구원 융복합전자소재연구센터) ;
  • 박성대 (한국전자기술연구원 융복합전자소재연구센터) ;
  • 김지훈 (공주대학교 신소재공학부) ;
  • 최의근 (주식회사 프로텍) ;
  • 유명재 (한국전자기술연구원 융복합전자소재연구센터) ;
  • 양현승 (한국전자기술연구원 융복합전자소재연구센터)
  • Bo-Young Kim (Electronic Convergence Materials & Device Research Center, Korea Electronics Technology Institute) ;
  • Subin Jo (Electronic Convergence Materials & Device Research Center, Korea Electronics Technology Institute) ;
  • Gwajeong Jeong (Electronic Convergence Materials & Device Research Center, Korea Electronics Technology Institute) ;
  • Seong Dae Park (Electronic Convergence Materials & Device Research Center, Korea Electronics Technology Institute) ;
  • Jihoon Kim (Division of Advanced Materials Engineering, Kongju National University) ;
  • Eui-Keun Choi (R&D Center, PROTECH Co., LTD.) ;
  • Myong Jae Yoo (Electronic Convergence Materials & Device Research Center, Korea Electronics Technology Institute) ;
  • Hyunseung Yang (Electronic Convergence Materials & Device Research Center, Korea Electronics Technology Institute)
  • 투고 : 2023.05.24
  • 심사 : 2023.07.09
  • 발행 : 2023.08.10
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초록

전자 기기의 소형화, 집적화 및 박형화에 따라 인쇄회로기판 제조 시 미세한 회로 패턴이 요구되고 있다. 기존의 인쇄회로기판은 dry film resist를 이용한 photolithography 법을 적용하여 주로 제조하지만, 미세 회로 패턴 구현을 위해서는 정밀한 마스크 설계 및 고가의 노광장비 등이 필요하다는 한계점이 있다. 이에 따라서 최근에는 dry film resist를 대체하여 미세 회로 패턴 형성에 유리한 광경화형 잉크를 직접인쇄 공정을 통해 인쇄회로기판의 회로 패턴을 형성하는 연구들이 관심받고 있다. 광경화형 잉크를 통한 회로 패턴 형성을 위해서는 동박과의 밀착성, 패턴 형성 과정에서의 에칭 저항성, 박리 특성의 제어가 필수적이다. 본 연구에서는 광개시제 종류 및 함량이 다른 여러 광경화형 잉크를 제조하고 이들의 광경화 거동을 분석하였다. 또한, 광경화형 에칭 레지스트 잉크로의 적용성 평가를 위해 에칭 저항성, 박리성, 밀착성 등을 분석하였다.

As electronic devices become smaller and more integrated, the demand for manufacturing thin, flexible printed circuit boards (FPCBs) has increased. Although FPCBs are conventionally manufactured by a photolithography method using dry film resist, this process is complicated, and the mask is specifically designed to obtain the precision of the desired circuit line width. In this regard, manufacturing FPCBs with fine patterns through the direct printing method of photocurable inks has gained growing attention. Since the manufacturing process of FPCBs is based on the direct printing method that includes etching and stripping processes utilizing acid and basic chemicals, controlling the adhesion strength, the etching resistance, and the strippability of photocured inks has drawn a lot of attention for the fabrication of fine patterns through photocurable inks. In this study, acrylic ink with various types and contents of the photoinitiator was prepared, and the curing behavior was analyzed. Also, the adhesion strength, etching resistance, and strippability were analyzed to evaluate the applicability of developed photocurable etching resist inks.

키워드

과제정보

본 연구는 산업통상자원부 차세대 하이브리드 PCB 기술개발사업 (Grant No. 20006472)의 연구비 지원으로 수행되었으며, 이에 감사드립니다.

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