• 한국진공학회지
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• 제6권S1호
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• pp.141-153
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• 1997

The paraelectric cubic-to-ferroelectric tetragonal phase transition of the thin Pb(Zr, Ti)$O_3$ (PZT) films grown on MgO(001) substrate was investigated in a series of synchrotron x-ray scattering experiments. As the thickness of the film decreases the transition temperature and the amount of the tetragonal distortion were decreased continuously Different from only the c-domains were existent in the thinnest 25nm thick film. Based on this we propose a model for the domain structure of the tetragonal PZT/MgO(100) film that is very different from the ones suggested in literature. We attribute the suppression of the transition to the substrate field that prefers the c-type domains near the interface and suppresses the tetragonal distortion to minimize the film-substrate lattice mismatch.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2003년도 추계학술발표강연 및 논문개요집
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• pp.170-170
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• 2003

We have implanted on sapphire substrate with various ions and investigated the properties of GaN epilayers grown on implanted sapphire substrate by metal organic chemical vapor deposition (MOCVD). Sapphire is typical substrate for GaN epilayers. However, there are many problems such as lattice mismatch and thermal coefficient difference between sapphire substrate and GaN. The ion implanted substrate's surface had decreased internal tree energies during the growth of the GaN epilayer, md the misfit strain was relieved through the formation of an AlN phase on the ions implanted sapphire(0001) substrates. [1] The crystal and optical properties of GaN epilayer grown in ions implanted sapphire(0001) substrate were improved.

• 한국항해학회지
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• 제16권2호
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• pp.21-27
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• 1992

Shortening the lasing wavelength(particularly below infrared ; the visible region) of laser diodes is very attractive because it can provide a wide range of applications in the fields of optical information, measurement, sensor, the development of medical instrument, and optical communication through plastic fibers. According to the recent researches on the field, InGaAsP/GaAs was suggested as a material for red-light laser. In this study, in order to grow InGaAsP/GaAs epitaxial layer on InGaAsP/GaAs by LPE, we used GaP and InP two phase solution technique for 670nm and 780 nm region, respectively. Through the X-ray diffraction measurement for the epitaxial layer grown from the experiments, we found that the lattice mismatch of $In_{0.46}Ga_{0.54}As_{0.07}P_{0.93}$/GaAs and $In_{0.19}Ga_{0.81}As_{0.62}P_{0.38}$/GaAs was about +0.3% and +0.1%, respectively.

• 대한전자공학회논문지
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• 제27권5호
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• pp.737-746
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• 1990

Ga0.47In0.53As PIN photodiodes(PD) having various areas have been fabricated by liquid phase epitaxial techniques. Ternary melt has been baked out at 675\ulcorner in H2 atmosphere for 20 hours before growth, which resulted in reduction of background carrier concentration of grown epi-layer. Also, lattice mismatch has been controlled within 0.01%. The room temperature performance of 10**-4cm\ulcornerarea PIN PD at a bias voltage of -5V were` quantum efficiency(with no antireflection coating)=60% for 1.3\ulcorner light source, dark current\ulcorner5nA, and capacitance\ulcornerpE. Frequency response measurement of packaged PIN PD has shown that cut-off frequency (f-3dB) was 961MHz. This PD has shown a good eye pattern when it was incorporated in a 565Mbps optical receiver.

• 마이크로전자및패키징학회지
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• 제21권4호
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• pp.33-39
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• 2014

To establish the reliability of a packaging structures, adhesion testing of key interfaces is a critical task. Due to the material mismatch, the interface may be prone to delamination failure due to conditions during the manufacturing of the product or just from the day-to-day use. To assess the reliability of the interface adhesion strength testing can be performed during the design phase of the product. One test method of interest is the four-point bending (4PB) adhesion strength test method. This test method has been implemented in a variety of situations to evaluate the adhesion strength of interfaces in bimaterial structures to the interfaces within thin film multilayer stacks. This article presents a review of the 4PB adhesion strength testing method and key implementations of the technique in regards to semiconductor packaging.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1989년도 하계종합학술대회 논문집
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• pp.633-636
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• 1989

The simulation results of the third harmonic conversion with 1.064 um Nd :YAG laser using polarization mismatch method are reported. The third harmonic conversion efficiency was over 65% for the Gaussian incident pulse of $300{\sim}400MW/cm^2$ peak intensity, and over 80% for $3{\sim}4GW/cm^2$ peak intensity pulse. The dependence of the third harmonic conversion efficiency' on the variation of incident polarization angle ${\theta}_p$ and angular discrepancy ${\Delta}{\theta}$ of phase matched angle ${\theta}_m$ is discussed.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 1999년도 하계종합학술대회 논문집
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• pp.319-322
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• 1999

In this paper, we report characteristics of a internal chip of LiNbO$_3$ modulator with low-driving-voltage at 150nm wavelength. A Ti diffusion method for LiNbO$_3$ optical waveguide and a buffer layer for improving phase velocity mismatch between optical and microwave waves were employed. The traveling-wave coplanar waveguide electrode of 35mm is used for reducing the driving voltage. From this work, wideband modulation of 10㎓ and low-driving voltage of 3.9volts are realized.

• 한국마린엔지니어링학회:학술대회논문집
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• 한국마린엔지니어링학회 2005년도 전기학술대회논문집
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• pp.1176-1185
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• 2005

A linear power amplifier is particularly emphasized on the system using a linear modulations, such as 16QAM and QPSK with pulse shaping, because intermodulation distortion which causes adjacent channel interference and co-channel interference is mostly generated in a nonlinear power amplifier. In this paper, parameters of a linearization loop, such as an amplitude imbalance, a phase imbalance and a delay mismatch, are briefly analyzed to get a specific cancellation performance and linearization bandwidth. Experimental results are presented for IMT-2000 frequency band. The center frequency of the feedforward amplifier is 2140 MHz with 60 MHz bandwidth. When the average output power of feedforward amplifier is 20 Watt, the intermodulation cancellation performance is more than 21 dB. In this case, the output power of feedforward amplifier reduced 3.5 dB because of extra delay line loss and coupling loss. The feedforward amplifier efficiency is more than 7.2 % for multicarrier signals, 59 dBc for ACPR.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.185-185
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• 2008

This paper describes the broadband SDC (Single-ended to Differential Converter) for Digital Video Broadcasting-Satellite $2^{nd}$ edition (DVB-S2) receiver tuner IC. It is fabricated by using $0.18{\mu}m$ CMOS process. In order to obtain high linearity and low phase mismatch, the broadband SDC (Single-ended to Differential Converter) is designed with current mirror structure and cross-coupled capacitor and current source binding differential structure at VDD. The simulation result of SDC shows IIP3 of 11.9 dBm and IIP2 of 38 dBm. It consumes 5mA current with 2.7V supply voltage.

• 한국기계가공학회지
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• 제13권6호
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• pp.139-144
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• 2014

As a result of a mismatch of the residual stress between both sides of the silicon wafer, which warps and distorts during the patterning process. The accuracy of the warpage measurement is related to the calibration. A CCD camera was used for the calibration. Performing optimization of the error function constructed with phase values measured at each pixel on the CCD camera, the coordinates of each light source can be precisely determined. Measurement results after calibration was performed to determine the warpage of the silicon wafer demonstrate that the maximum discrepancy is $5.6{\mu}m$ with a standard deviation of $1.5{\mu}m$ in comparison with the test results obtained by using a Form TalySurf instrument.