• Current Photovoltaic Research
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• 제7권3호
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• pp.65-70
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• 2019

As a demand of higher power photovoltaic modules, shingled, multi-busbar, half-cell, and bifacial techniques are developed. Multi-busbar module has advantage for large amount of light havesting. And, half-cell is high power module for reducing resistive losses and higher shade tolerance. Recently, researches on multi-busbar is focused on reliability according to adhesion and intermetallic compound between Sn-Pb solder and Ag electrode. And half-cell module is researched to comparing with full-sized cell module for structure difference. In this study, we investigated the factors affecting to efficiency and adhesion of multi-wires half-cell module according to wire thickness, solder thickness, and flux. The results of solar simulator and peel test was that peel strength and efficiency of soldered cell is not related. But samples with flux including high solid material showed high efficiency. The results of FE-SEM and EDX line scan on cross-section between wire and Ag electrode for different flux showed thickness of solder joint between wire and Ag electrode is increasing through solid material increasing. Flux including high solid material would affect to solder behavior on Ag electrode. Higher solid material occurred lower growth of IMC layer because solder permeate to sider of wire ribbon than Ag electrode. And it increased fill factor for high efficiency. In soldering process, amount of solid material in flux and solder thickness are the factor related with characteristic of soldered photovoltaic cell.

• 한국환경과학회지
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• 제31권8호
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• pp.691-706
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• 2022

Magnetic activated carbon was prepared by adding a magnetic material to activated carbon that had been prepared from waste citrus peel in Jeju. The adsorption characteristics of an aqueous solution of the antibiotic trimethoprim (TMP) were investigated using the magnetic activated carbon, as an adsorbent, and response surface methodology (RSM). Batch experiments were carried out according to a four-factor Box-Behnken experimental design affecting TMP adsorption with their input parameters (TMP concentration: 50~150 mg/L; pH: 4~10; temperature: 293~323 K; adsorbent dose: 0.05~0.15 g). The significance of the independent variables and their interaction was assessed by ANOVA and t-test statistical techniques. Statistical results showed that TMP concentration was the most effective parameter, compared with others. The adsorption process can be well described by the pseudo-second-order kinetic model. The experimental isotherm data followed the Langmuir isotherm model. The maximum adsorption capacities of TMP, estimated with the Langmuir isotherm model were 115.9-130.5 mg/g at 293-323 K. Also, both the thermodynamic parameters, ΔH and ΔG, have both positive values, indicating that the adsorption of TMP by the magnetic activated carbon is an endothermic reaction and proceeds via an involuntary process.

• 한국기계가공학회지
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• 제21권5호
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• pp.9-15
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• 2022

Discarded bio-wastes, such as seeds and rinds, cause environmental problems. Multiple studies have recycled bio-wastes as eco-friendly energy sources to solve these problems. This study uses bio-waste to fabricate a mandarin peel powder based triboelectric nanogenerator (MPP-TENG). The MPP-TENG is based on the contact separation mode. It generates an open-circuit voltage and short-circuit current of 156V and 2µA, respectively. In addition, MPP-TENG shows stable operation over continuous 3000s without any deviation in output. Also, the device exhibits maximum power density of 5.3㎼/cm² when connected to a resistance of 100MΩ. In an energy storage capacity test for 1000s, the MPP-TENG stores an energy of 171.6µJ in a 4.7µF capacitor. The MPP-TENG can power 9 blue LEDs and 54 green lettering LEDs. These results confirm that the MPP-TENG can provide a new avenue for eco-friendly energy harvesting device fabrication.

• Composites Research
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• 제22권4호
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• pp.13-19
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• 2009

접착제에 의한 접합기술은 다양한 목적과 환경에서 널리 사용되는 방법이다. 그 중 우레탄 접착제는 저온에서의 우수한 접착 특성으로 인하여 액화천연가스 운반선과 같은 극저온 환경의 접착에 사용되고 있다. 유사한 우레탄 접착제라도 각기 다른 기재와의 접착특성을 갖게 된다. 특히 기재에 사용된 수지의 종류와 섬유와의 상응성에 따른 접착력의 변화는 산업현장에서의 접착제 선정에 매우 중요한 인자로 작용된다. 본 연구에서는 서로 다른 제조사의 우레탄 접착제를 사용하여 동일한 리섬유강화복합재료에 접착하였을 때 실험 온도에 따른 다른 경향의 박리강도를 얻었다. 그 원인을 주사전자현미경을 사용하여 검토하였으며, 실혐 결과 극저온에서 접착제와 복합재료 수지간의 접착력은 거의 유사하였으나 접착제와 가재에 노출된 유리섬유간의 접착력이 달라짐에 따른 원인으로 확인하였다.

• Elastomers and Composites
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• 제42권2호
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• pp.107-111
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• 2007

초기 상태를 선가황 혹은 미가황으로 다르게 한 NR과 BR 복합체 간의 접착에 대해 연구하였다. 동일한 고무인 NR/NR과 BR/BR 간의 접착뿐 아니라 이종 고무 간의 접착인 NR/BR의 접착도 조사하였다. 미가황 시트 간의 접착력이 선가황/미가황 시험편과 선가황/선가황 시험 편보다 우수하였다. 선가황/선가황 시험편과 미가황 NR/선가황 BR시험편은 완전 박리가 일어났다. 박리 시험 중 파단이 일어난 경우, 고무의 종류에 상관없이 두 개의 시트 중에 가교밀도가 높은 곳에서 끊어졌다. 이종 고무 간의 접착력보다는 동종 간의 접착력이 더 우수하였으며, 선가황 NR/미가황 BR의 접착력이 미가황 NR/선가황 BR의 경우보다 더 컸다. 실험 결과는 가교밀도와 고무 사슬의 계면간 확산으로 설명하였다.

• 한국표면공학회지
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• 제49권2호
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• pp.141-146
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• 2016

In this study, electrophoretic paint (E-paint) was deposited on the knife-abraded surface of AZ31 magnesium alloy (AZ31), and its adhesion and corrosion resistance were examined by tape peel-test and salt spray test, respectively. E-paint started to deposit on AZ31 Mg alloy after an inductance time and pores were found in the E-paint layer which is ascribed to hydrogen bubbles generated on the surface during the painting process. The pores disappeared after curing for 15 min at $160^{\circ}C$. The E-paint on AZ31 exhibited good adhesion after immersion in deionized water for 500 h at $40^{\circ}C$. The E-paint sample without scratch showed no corrosion after 1500 h of salt spray test. However, on the scratched sample, blisters were visible adjacent to the scratched sites after 500 h of salt spray test.

• 한국재료학회지
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• 제19권11호
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• pp.625-630
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• 2009

Embedding of active devices in a printed circuit board has increasingly been adopted as a future electronic technology due to its promotion of high density, high speed and high performance. One responsible technology is to embedded active device into a dielectric substrate with a build-up process, for example a chipin-substrate (CiS) structure. In this study, desmear treatment was performed before Cu metallization on an FR-4 surface in order to improve interfacial adhesion between electroless-plated Cu and FR-4 substrate in Cu via structures in CiS systems. Surface analyses using atomic force microscopy and x-ray photoemission spectroscopy were systematically performed to understand the fundamental adhesion mechanism; results were correlated with peel strength measured by a 90o peel test. Interfacial bonding mechanism between electrolessplated Cu and FR-4 substrate seems to be dominated by a chemical bonding effect resulting from the selective activation of chemical bonding between carbon and oxygen through a rearrangement of C-C bonding rather than from a mechanical interlocking effect. In fact, desmear wet treatment could result in extensive degradation of FR-4 cohesive strength when compared to dry surface-treated Cu/FR-4 structures.

• Journal of Welding and Joining
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• 제18권3호
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• pp.89-96
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• 2000

As solder becomes small and fine, the reliability and solderability of solder joint are the critical issue in present electronic packaging industry. Besides the use of lead(Pb) containing solders for the interconnections of microelectronic subsystem assembly and packaging has enviromental problem. In this study, using Sn/Pb and Sn/Ag eutectic solder paste, in order to obtain decrease of solder joint strength with increasing aging time, initial solder joint strength and aging strength after 1000 hour aging at $100^{\circ}C$ were measured by peel test. And in order to obtain the growth of intermetallic compound(IMC) layer thickness, IMC layer thickness was measured by scanning electron microscope(SEM). As a result, solder joint strength was decreased with increasing aging time. The mean IMC layer thickness was increased linearly with the square root of aging time. The diffusion coefficient(D) of IMC layer was found to $1.29{\times}10^{-13}{\;}cm^2/s$ at using Sn/Pb solder paste, 7.56{\times}10^{-14}{\textrm}{cm}^2/s$ at using Sn/Ag solder paste.

• 한국식품저장유통학회지
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• 제9권1호
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• pp.97-101
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• 2002

비파 부위별 추출물의 항균성과 항산화 활성을 조사한 결과는 다음과 같다. 과피 및 종자의 추출수율은 부탄을 분획물에서 각각 4.95%와 4.42%로 높게 나타난 반면, 잎, 씨를 제거한 과실과 과육은 물분획물에서 각각 5.10%, 23.60% 및 21.10%로 높게 나타났다. 항균활성은 잎과 씨를 제거한 과실의 경우 clear zone이 각각 Staphylococcus aureus에서 19 mm, 15mm, Escherichia coli에서 15 mm, 16 mm로 에칠 아세테이트 분획물에서 항균활성이 높게 나타났다. 비파의 메탄을 추출물을 극성과 비극성 용매로 순차별로 분획한 수소공여 능은 잎에서 82%, 씨를 제거한 과실 74%, 종자 68%, 과피 52% 및 과육 30%로 에칠 아세테이트 분획물에서 가장 높았다.

• 한국재료학회지
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• 제19권3호
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• pp.119-124
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• 2009

In the microelectronics packaging industry, the adhesion strength between Cu and polyimide and the thermal stability are very important factors, as they influence the performance and reliability of the device. The three different buffer layers of Cr, 50%Cr-50%Ni, and Ni were adopted in a Cu/buffer layer/polyimide system and compared in terms of their adhesion strength and thermal stability at a temperature of $300^{\circ}C$ for 24hrs. A 90-degree peel test and XPS analysis revealed that both the peel strength and thermal stability decreased in the order of the Cr, 50%Cr-50%Ni and Ni buffer layer. The XPS analysis revealed that Cu can diffuse through the thin Ni buffer layer ($200{\AA}$), resulting in a decrease in the adhesion strength when the Cu/buffer layer/polyimide multilayer is heat-treated at a temperature of $300^{\circ}C$ for 24hrs. In contrast, Cu did not diffuse through the Cr buffer layer under the same heat-treatment conditions.