• 제목/요약/키워드: patterning process

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Optical properties of ink color filters (잉크 색상 필터의 광학적 특성)

  • Lee, Chan-Ku;Lee, Su-Dae
    • Journal of Korean Ophthalmic Optics Society
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    • v.8 no.1
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    • pp.23-28
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    • 2003
  • We report a switchable RGB color filters for Lab on a chip. Ink color filter devices are fabricated by PDMS patterning process. The optical transmission in the ultra-violet and visible wavelengths of color filters have been investigated. The ink color filters are characterised by the slope and shape of the spectrum. The transmission of red/yellow filter consists of curves with a sharp cut-off spectrum at 600 and 500 nm. The blue output of the ink filter has 80% peak transmission and weak red-leak, while the green ink filter has 48% peak transmission and red-leak.

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Electrical Characteristics of Organic TFTs Using ODPA-ODA and 6FDA-ODA Polyimide Gate Insulators

  • Lee, Min-Woo;Pyo, Sang-Woo;Jung, Lae-Young;Shim, Jae-Hoon;Sohn, Byoung-Chung;Kim, Young-Kwan
    • 한국정보디스플레이학회:학술대회논문집
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    • 2002.08a
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    • pp.770-772
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    • 2002
  • A new dry-processing method of organic gate dielectric film in field-effect transistors (FETs) was proposed. The method use vapor deposition polymerization (VDP) that is continuous and low temperature process. It has the advantages of shadow mask patterning and dry processing in flexible low-cost large area applications. Here, 80 nm-thick Al as a gate electrode was evaporated through shadow mask. Gate insulators used two different polyimides. The one material was 4,4'-oxydiphtahlic anhydride (ODPA) and 4,4'-oxydianiline (ODA). Another was 2,2-bis(3,4-dicarboxyphenyl) Hexafluoropropane Dianhydride (6FDA) and 4,4' -oxydianiline (ODA). These were co-deposited by high-vaccum thermal-evapora and cured at 150 $^{\circ}C$ for 1 hour, respectively. Pentacene as a semiconductor and 100 nm-thick Au as a source and drain electrode were evaporated through shadow mask.

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ICP ETCHING OF TUNGSTEN FOR X-RAY MASKS

  • Jeong, C.;Song, K.;Park, C.;Jeon, Y.;Lee, D.;Ahn, J.
    • Journal of the Korean institute of surface engineering
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    • v.29 no.6
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    • pp.869-875
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    • 1996
  • In this article the effects of process parameters of inductively coupled plasma etching with $SF_6$ /$N_2$/Ar mixture gas and mask materials on the etched profile of W were investigated. While the etched profile was improved by $N_2$-addition, low working presure, and reduced $SF_6$ flow rate, the etching selectity (W against SAL resist) was decreased. Due to the difficulty of W etching with single layer resist, sputter deposited $Al_2O_3$ film was used as a hardmask. Reduction of required EB resist thickness through $Al_2O_3$ mask application could reduce proximity effect during e-beam patterning, but the etch anisotropy was degraded by decreased sidewall passiviation effect.

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Silicon Nano Patterning Using Focused ion Beam: Simulation and Fabrication (집속이온빔을 이용한 실리콘 나노 패터닝: 시뮬레이션과 가공)

  • Han J.;Min B.K.;Lee S.J.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2006.05a
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    • pp.489-490
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    • 2006
  • To establish fabrication techniques for nano structure understanding of focused ion beam (FIB) milling process is required. In this study the mathematical model containing the factors related to FIB milling is developed to acquire the optimal fabrication condition. Then, the model is verified by comparison with various nano pattern fabricated in actual FIB system. Consequently, it is demonstrated that the nano patterns with the smallest pitch can be fabricated using developed FIB milling model.

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Analytical Approach of Polymer Flow in Thermal Nanoimprint Lithography (열-나노임프린트 리소그래피 공정에서의 폴리머 유동에 대한 해석적 접근)

  • Kim, Kug-Weon;Kim, Nam-Woong
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.17 no.3
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    • pp.20-26
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    • 2008
  • Nanoimprint lithography(NIL) is becoming next generation lithography of significant interest due to its low cost and a potential patterning resolution of 10nm or less. Success of the NIL relies on the adequate conditions of pressure, temperature and time. To have the adequate conditions for NIL, one has to understand the polymer flowing behavior during the imprinting process. In this paper, an analytical approach of polymer flow in thermal NIL was performed based on the squeeze flow with partial slip boundary conditions. Velocity profiles and pressure distributions of the polymer flow were obtained and imprinting forces and residual thickness were predicted with the consideration of the slip velocity between the polymer and the mold/substrate. The results show that the consideration of the slip is very important for investigating the polymer flow in Thermal NIL.

Laser micro-patterning of Zn-plated printing roll for electronic devices (전자소자용 Zn 코팅된 프린팅 롤 레이저 미세 패터닝)

  • Sohn, Hyon-Kee;Suh, Jeong
    • Laser Solutions
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    • v.13 no.2
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    • pp.6-9
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    • 2010
  • In printed electronics, printing rolls are used to transfer electronic ink onto a flexible substrate. Generally printing rolls are being made by the indirect laser method which is based on the etch process, thus not environment-friendly and not suitable for making a large printing roll. For the pursuit of making a large printing roll for mass printing of electronic devices, we have directly engraved micro-patterns into a Zn plated printing roll using a 30W pulse-modulated fiber laser. We have successfully engraved line patterns ranging from about 15-30${\mu}m$ in width.

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Observation of Growth Behavior of Induced Hillock for Nano/Micro Patterning on Surface of Borosilicate with Etching Time and Load (보로실리케이트 표면의 나노/마이크로 패터닝을 위한 식각 시간, 하중에 따른 유기 힐록의 성장거동 관찰)

  • Cho S. H.;Youn S. W.;Kang C. G.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2005.10a
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    • pp.182-185
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    • 2005
  • Indentation pattern and line pattern were machined on borosilicate(Pyrex 7740 glass) surface using the combination of mechanical machining by $Nanoi-indenter\circledR$ XP and HF wet etching, and a etch-mask effect of the affected layer of the nano-scratched and indented Pyrex 7740 glass surface was investigated. In this study, effects of indentation and scratch process with etching time on the morphologies of the indented and scratched surfaces after isotropic etching were investigated from an angle of deformation energies.

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Carbon Nanoscrolls from CVD Grown Graphene

  • Jang, A-Rang;Shin, Hyeon-Suk;Kang, Dae-Joon
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.574-574
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    • 2012
  • We report a simple way of fabricating high-quality carbon nanoscrolls (CNSs) by taking advantage of strain relief due to large difference in strain at the interface of graphene and underlying layer. This method allows strain-controlled self rolling-up of monolayer graphene during etching process at predefined positions on SiO2/Si substrates by photolithography. The size and the length of the CNSs can be easily controlled by adjusting the thickness of the underlying layer and by pre-patterning. Raman spectroscopy studies show that the CNSs is free of significant defects, and the electronic structure and phonon dispersion are slightly different from those of two-dimensional graphene. The preparation of high-quality CNSs may open up new opportunities for both fundamental and applied research of CNSs.

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Fabrication of Organic Nanowire Electronics by Direct Printing Method

  • Park, Gyeong-Seon;Seong, Myeong-Mo
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.563-563
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    • 2012
  • We report a one-step fabrication of single-crystal organic nanowire arrays on substrates using a new direct printing method (liquid-bridge-mediated nanotransfer moulding, LB-nTM), which can simultaneously enable the synthesis, alignment and patterning of the nanowires using molecular ink solutions. Two- or three-dimensional complex structures of various single-crystal organic nanowires were directly fabricated over a large area with a successive process. The position of the nanowires can be aligned easily on complex structures because the mold is movable on substrates before drying the polar liquid layer, which acts as an adhesive lubricant. This efficient manufacturing method can produce a wide range of optoelectronic devices and integrated circuits with single-crystal organic nanowires.

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The Fabrication of SiOB by using Bulk Micromachining Process for the Application of Slim Pickup (벌크 마이크로머시닝 기술을 이용한 박형 광픽업용 SiOB 제작)

  • Choi, Seog-Moon;Park, Sung-Jun;Hwang, Woong-Lin
    • Transactions of the Society of Information Storage Systems
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    • v.1 no.2
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    • pp.175-181
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    • 2005
  • SiOB is an essential part of slim optical pickup, where the silicon mirror, LD stand, silicon PD are integrated and LD is flip chip bonded. SiOB is fabricated with bulk micromachining. Especially the fabrication of silicon wafer with stepped concave areas has many extraordinary difficulties. As a matter of fact, experiences and knowledges are rare in the fabrication of the highly stepped silicon wafer. The difficulties occurring in the integration of PD and SiOB, and highly stepped patterning, and silicon mirror roughness and how-to-solve will be discussed.

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