• 제목/요약/키워드: patterned substrate

검색결과 312건 처리시간 0.041초

Catalytic growth of single wall carbon nanotubes by laser vaporization and its purification and The carbon nanotube growth on the Si substrate by CVD method

  • Lee, Sung won;Jung in Sohn;Lee, Seonghoon
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2000년도 제18회 학술발표회 논문개요집
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    • pp.213-213
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    • 2000
  • Direct laser vaporization of transition-metal(Co, Ni)/graphite composite pellet produced single wall carbon naotubes(SWNT) in the condensing vapor in a heated flow cylinder-type tube furnace, Transition metal/graphite composite pellet target was made by mixing graphite, Co, and Ni in 98:1:1 atomic weight ratios, pressing the mixed powder, and curing it. The target was placed in a tube furnace maintained at 1200$^{\circ}C$ and Ar inert collision gas continuously flowed into the tube. The 2nd harmonic, 532nm wavelength light from Nd-YAG laser was used to vaporize the tube. The carbon nanotubes produced by the laser vaporization were accumulated on quartz tube wall. The raw carbon nanotube materials were purified with surfactants(Triton X-100) in a ultrasonicator. These carbon nanotubes were analyzed using SEM, XRD, and Raman spectroscopic method. The carbon nanotube growth on the Ni-patterned Si substrate was investigated by the CVD process. Transition-metal, Ni and CH4 gas were used as a catalyst and a reactant gas, respectively. The structure and the phonon frequencies of the carbon nanotubes formed on the patterned Si substrate were measured by SEM and Raman spectrometer.

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Thin Film Battery Using Micro-Well Patterned Titanium Substrates Prepared by Wet Etching Method

  • Nam, Sang-Cheol;Park, Ho-Young;Lim, Young-Chang;Lee, Ki-Chang;Choi, Kyu-Gil;Park, Gi-Back
    • 전기화학회지
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    • 제11권2호
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    • pp.100-104
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    • 2008
  • Titanium sheet metal substrates used in thin film batteries were wet etched and their surface area was increased in order to increase the discharge capacity and power density of the batteries. To obtain a homogeneous etching pattern, we used a conventional photolithographic process. Homogeneous hemisphere-shaped wells with a diameter of approximately $40\;{\mu}m$ were formed on the surface of the Ti substrate using a photo-etching process with a $20\;{\mu}m{\times}20\;{\mu}m$ square patterned photo mask. All-solid-state thin film cells composed of a Li/Lithium phosphorous oxynitride (Lipon)/$LiCoO_2$ system were fabricated onto the wet etched substrate using a physical vapor deposition method and their performances were compared with those of the cells on a bare substrate. It was found that the discharge capacity of the cells fabricated on wet etched Ti substrate increased by ca. 25% compared to that of the cell fabricated on bare one. High discharge rate was also able to be obtained through the reduction in the internal resistance. However, the cells fabricated on the wet etched substrate exhibited a higher degradation rate with charge-discharge cycling due to the nonuniform step coverage of the thin films, while the cells on the bare substrate demonstrated a good cycling performance.

다구찌 실험 계획법을 이용한 나선형 인덕터의 패턴드 그라운드 쉴드 최적 설계 연구 (Optimization of 'Patterned Ground Shield' of Spiral Inductor using Taguchi's Method)

  • 고재형;오상배;김동훈;김형석
    • 한국정보통신설비학회:학술대회논문집
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    • 한국정보통신설비학회 2007년도 학술대회
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    • pp.436-439
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    • 2007
  • This paper describes the optimization of PGS(Patterned Ground Shield) of 5.5 turns rectangular spiral inductor using Taguchi's method. PGS is decrease method of parasite component by silicon substrate among dielectric loss reduction method. By using the taguchi's method, each parameter is fixed upon that PGS high poison(A), slot spacing(B), strip width(C) and overlap turn number(D) of PGS design parameter. Then we verified that percentage contribution and design sensitivity analysis of each parameter and level by signal to noise ratio of larger-the-better type. We consider percentage contribution and design sensitivity of each parameter and level, and then verify that model of optimization for PGS is lower inductance decreasing ratio and higher Q-factor increasing ratio by EM simulation.

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PVA모드에서 공통 전극 패턴을 통한 전기장 간섭의 감소 효과 (Reducing of cross-talk by patterning of common electrode in the patterned vertical alignment (PVA) mode)

  • 전연문;김연식;황성진;이승희;류재진;김경현
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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    • pp.43-44
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    • 2006
  • We have studied electro-optical characteristics and stability of liquid crystal director depending on electrode patterning of common electrode on top substrate in patterned vertical alignment (PVA) mode. In the present studies, new type of common electrode pattern was suggested to enhance a dark state by reducing interference area due to data signal. According to the simulation result, PVA device with new common electrode pattern contributed to Improvement of an aperture ratio.

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실리콘 공정에서 패턴으로 삭각된 접지(PGS)를 이용한 인터컨넥션의 전송선 특성분석 및 RF/초고주파 집적회로에의 응용 (Transmission Line Characteristics of Silicon Based Interconnections with Patterned Ground Shields and its Implication for RF/Microwave ICs)

  • 곽혁용;이상국;조윤석
    • 대한전자공학회논문지SD
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    • 제37권6호
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    • pp.50-56
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    • 2000
  • 초고주파에서 집적회로용 연결선(interconnect)에 PGS(Patterned Grouned Shield)를 적용하는 실험을 하였다. PGS는 신호선으로부터 비절연 실리콘 기판을 차폐시킴으로써 광대역에 걸쳐 전송선의 실리콘기판을 통한 전력손실을 크게 줄일 수 있음을 측정결과를 통해 보였다. 또한 PGS를 이용한 전송선의 특성을 분석하고 PGS가 전송선의 파장을 줄여주는 효과가 있음을 확인하였다.

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패턴이 있는 유리기층 위 러빙된 Polyimide의 광학 이방성 미세변화 정밀 측정 (Precise Measurement of Optical Anisotropy of Rubbed Polyimide on Patterned Glass and its Nanoscale Variation)

  • 김하랑;김상열
    • 한국광학회지
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    • 제20권5호
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    • pp.281-287
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    • 2009
  • 편광법을 사용하여 패턴이 있는 LCD 유리기층위에 놓여 있는 러빙된 PI(polyimide)의 광학이방성을 분석하였다. 투과형 편광계를 사용하여 0.4 nm 이하의 극히 작은 위상지연의 크기와 광축의 방향을 정밀하게 측정하였다. 온도에 따르는 광학이방성의 미세변화를 위상지연의 크기 및 광축 방향의 변화곡선으로 나타내고 간단한 광학모델을 사용하여 설명하였다.

초음파 성형시 진동전달 방향에 따른 미세패턴의 전사특성 고찰 (Replication Characteristics of Micro-Patterns according to the Vibration Transmission Direction in the Ultrasonic Imprinting Process)

  • 서영수;이기연;조영학;박근
    • 한국정밀공학회지
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    • 제29권11호
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    • pp.1256-1263
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    • 2012
  • The present study covers the ultrasonic patterning process to replicate micro-patterns on a polymer substrate. The ultrasonic patterning process uses ultrasonic waves to generate frictional heat between an ultrasonic horn and the polymer substrate, from which the surface region of the polymer substrate is softened sufficiently for the replication of micro-patterns. The ultrasonic patterning process can divided into two categories according to the direction of vibration transmission: direct patterning and indirect patterning. The direct patterning uses a patterned horn, and the ultrasonic vibration is transferred directly from the patterned horn to the substrate. On the contrary, the indirect patterning process uses a plain horn, and the micro-patterns are engraved on a mold that is located below the substrate. Thus, the micro-patterns are replicated as an indirect manner. In this study, these direct and indirect patterning processes are compared in terms of the replication characteristics. Additionally, the possibility of double-side patterning is also discussed in comparison with the conventional single-side patterning process.

Fabrication of Flexible Inorganic/Organic Hybrid Thin-Film Transistors by All Ink-Jet Printed Components on Plastic Substrate

  • Kim, Dong-Jo;Lee, Seong-Hui;Moon, Joo-Ho
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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    • pp.1463-1465
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    • 2008
  • We report all-ink-jet printed inorganic/organic hybrid TFTs on plastic substrates. We have investigated the optimal printing conditions to make uniform patterned layers of gate electrode, dielectrics, source/drain electrodes, and semiconductor as a coplanar type TFT in a successive manner. All ink-jet printed devices have good mechanical flexibility and current modulation characteristic even when bent.

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