• The KIPS Transactions:PartB
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• v.8B no.2
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• pp.189-194
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• 2001

본 논문에서는 개인 식별을 위하여 복수 해상도 구조를 제시하였고 이 방법으로 구순문 인식을 구현하였다. 구순문 인식은 지문, 음성 패턴, 홍채 패턴과 얼굴 인식과 같은 신체적 특징에 비하여 상대적으로 연구가 많이 이루어지지 않은 신체적 특징이다. 구순문은 CCD 카메라를 이용할 경우 홍채나 얼굴 패턴 같은 다른 특징 요소와 연결하여 인식 시스템을 구축할 수 있는 장점을 가지고 있다. 구순문 인식을 위해 pattern kernels를 이용한 새로운 방법을 제시하였다. Pattern kernels는 여러 개의 local lip print mask들로 구성된 함수이며, lip print의 정보를 디지털 데이터로 전환시켜 준다. 복수 해상도를 가지는 인식 시스템은 단일 해상도의 시스템보다 더욱 신뢰적이며 인식률도 높다.

• The Research Journal of the Costume Culture
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• v.10 no.4
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• pp.404-418
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• 2002

The pattern of a dance had changed and made a progress delicately according to the change of the myth, religion, and civilization. One genre which had experienced the change for the dance is a mask dance. This dance started from wishes to adore spirit or god with imitated masks of native animals and desire to identify with nature. After the middle ages, it finally became to approach to the artistic state. In that dance, there was used a role of the head of the family which was strongly adapted to the shape of the mask as performing casts After studying symbolic characteristics of the mask dancing, we could conclude these as fol1ows.: First, Masks symbolized the totemism that adores spirit or god. This kind of whole masks were consistently used. Second, Mask was worn for expressing a dancer's cast well. This function of performing cast was in the primitive ages. However at the age which was characterized as the age of the art, the expression of using a mask became various. Third, Mask was mostly related to the head of the family and appeared with the desire to be others not themselves. Since the middle ages, this tendency continued to the modern dance. Now we can see this type at the carnival. The mask was not only an effective means of dance but also an expression of totemism, performing cast, and the head of the family. Therefore it contributed to the growth of the dance a lot.

• Journal of the Korean Society for Precision Engineering
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• v.25 no.1
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• pp.138-144
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• 2008

Micro-machining of a brittle material such as glass, silicon, etc., is important in micro fabrication. Particularly, micro-abrasive jet machining (${\mu}-AJM$) has become a useful technique for micro-machining of such materials. The ${\mu}-AJM$ process is mainly based on the erosion of a mask which protects brittle substrate against high velocity of micro-particle. Therefore, fabrication of an adequate mask is very important. Generally, for the fabrication of a mask in the ${\mu}-AJM$ process, a photomask based on the semi-conductor fabrication process was used. In this research a rapid mask fabrication technology has been developed for the ${\mu}-AJM$. By scanning the focused UV laser beam, a micro-mask pattern was fabricated directly without photolithography process and photomask. Two kinds of mask patterns were fabricated using SU-8 and photopolymer (Watershed 11110). Using fabricated mask patterns, abrasive-jet machining of Si wafer were conducted successfully.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2002.04a
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• pp.296-301
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• 2002

In this study, we investigated the machinability of machinable ceramics which were developed by a research lab. of Inha Univ., Korea. The effect of the nozzle scanning times, the size of patterns and compositions of BN in ceramics on the erosion depth of samples with no mask and samples with three different mask pattern in powder blasting of machinable ceramics. The blasting conditions were the impact angles 90$^{\circ}$, scanning times of noble up to 30 and the stand-off distances 100mm. The widths of mask pattern were 0.1mm, 0.5mm and 1 mm. The powder was alumina sharp particles, WA#600. The mass flow rate of powder during the erosion test was fixed constant at 150g/min and the blasting pressure of powder at 0.25Mpa

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.503-507
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• 2002

Mask manufacturing is a high COC and COO process in developing of semiconductor devices, because of the mass production tool with high resolution. Direct writing has been thought to be one of the patterning method to cope with development or small-lot production of the device. This study focused on the development of the direct, mastless patterning process using stereolithography tool for the easy and convenient application to micro and miso scale products. Experiments are utilized by three dimensional CAD/CAM as a mask and photo-curable resin as a photo-resist in a conventional stereo-lithography apparatus. Results show that the resolution of the pattern was achieved about 300 micron because of complexity of SLA apparatus settings, inspite of 100 micro of inherent resolution. This paper concludes that photo resist and laser spot diameter should be adjusted to get finer patterns and the proposed method is significantly feasible to mastless and low cost patterning with micro and miso scale.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2001.10a
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• pp.349-354
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• 2001

In this study, we investigated the effect of the impacting ang1e of particles, the scanning times and the stand-off distance on the surface roughness and the weight-loss rate of samples with no mask, and the wall profile and overetching of samples with different mask pattern in powder blasting of soda-lime glass. The varying parameters were the different impact angles between 50$^{\circ}$ and 90$^{\circ}$, scanning times of nozz1e up to 40 and the stand-off distances 70mm and 100mm. The widths of mask pattern were 0.2mm, 0.5mm and 1mm. The powder was alumina sharp particles, WA#600. The mass flow rate of powder during the erosion test was fixed constant at 175g/min and the blasting pressure of powder at 0.2MPa

• Journal of the Semiconductor & Display Technology
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• v.19 no.3
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• pp.55-60
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• 2020

The hard mask photo-resist strip inspection system for the semiconductor wafer manufacturing process inspects the position of the circuit pattern formed on the wafer by measuring the distance from the edge of the wafer to the strip processing area. After that, it is an inspection system that enables you to check the process status in real time. Process defects can be significantly reduced by applying a tester that has not been applied to the existing wafer strip process, edge etching process, and wafer ashing process. In addition, it is a technology for localizing semiconductor process inspection equipment that can analyze the outer diameter of the wafer and the state of pattern formation, which can secure process stability and improve wafer edge yield.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.05a
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• pp.12.1-12.1
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• 2009

For the micro conductive line, memory device fabrication process use many expensive processes such as manufactur-ing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because nano-metal particles contained inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as FPCB, PCB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line on flexible PCB substrate for the next generation electronic circuit using Ag nano-particles contained ink. To improve the line tolerance on flexible PCB, metal lines are fabricated by sequential prinitng method. Sequential printing method has vari-ous merits about fine, thick and high resolution pattern lines without bulge.

• Convergence Security Journal
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• v.2 no.2
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• pp.155-164
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• 2002

A design implemented the $\delta$SAcc234bit Mask Data Insertion algorithm that can let the Mask which commercialized Wave Steganography had improved the problem that a filter ring was able to easily become and raised Capacity and extend the width that Cover-data was alternative. Also, it applied 3-Tier file encryption algorithm with a proposal in order to improve a security level of Mask. 3-Tier file encryption algorithm is the algorithm that a specific pattern improved the problem that appeared in Ciphertext according to a file. A design implemented the StegoWaveK model carried out Wave Steganography, using $\delta$SAcc234bit Mask Data Insertion algorithm and the 3-Tier file encryption algorithm that proposed in this paper.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.8
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• pp.91-97
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• 2010

Micro-abrasive Jet Machining is one of the new technology which enables micro-scale machining on the surface of high brittle materials. In this technology it is very important to fabricate a mask that prevents excessive abrasives not to machine un-intend surface. Our previous work introduced the micro-stereolithography technology for the mask fabrication. And is good to not only planar material but also for non-planar materials. But the technology requires a 3 dimensional mask CAD model which is perfectly matched with the surface topology of parent material as an input. Therefore there is strong need to develop an automated modeling technology which produce adequate 3D mask CAD model in fast and simple way. This paper introduces a fast and simple mask modeling algorithm which represents geometry of models in voxel. Input of the modeling system is 2D pattern image, 3D CAD model of parent material and machining parameters for Micro-abrasive Jet Machining. And the output is CAD model of 3D mask which reflects machining parameters and geometry of the parent material. Finally the suggested algorithm is implemented as software and verified by some test cases.