• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.322-325
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• 2005

The shrinking critical dimensions of modern technology place a heavy requirement on optimizing feature shapes at the micro- and nano scale. In addition, the use of ion beams in the nano-scale world is greatly increased by technology development. Especially, Focused ion Beam (FIB) has a great potential to fabricate the device in nano-scale. Nevertheless, FIB has several limitations, surface swelling in low ion dose regime, precipitation of incident ions, and the re-deposition effect due to the sputtered atoms. In recent years, many approaches and research results show that the re-deposition effect is the most outstanding effect to overcome or reduce in fabrication of micro and nano devices. A 2D string based simulation software AMADEUS-2D $(\underline{A}dvanced\;\underline{M}odeling\;and\;\underline{D}esign\;\underline{E}nvironment\;for\;\underline{S}putter\;Processes)$ for ion milling and FIB direct fabrication has been developed. It is capable of simulating ion beam sputtering and re-deposition. In this paper, the 2D FIB simulation is demonstrated and the characteristics of ion beam induced direct fabrication is analyzed according to various parameters. Several examples, single pixel, multi scan box region, and re-deposited sidewall formation, are given.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.9
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• pp.1931-1942
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• 2002

In this paper a formulation of robust optimization is presented and illustrated by a design example of vibratory micro gyroscopes in order to reduce the effect of variations due to uncertainties in MEMS fabrication processes. For the vibratory micro gyroscope considered it is important to match the resonance frequencies of the vertical (sensing) and lateral (driving) modes as close as possible to attain a high sensing sensitivity. A deterministic optimization in which the difference of both the sensing and driving natural frequencies is minimized as an objective function results in highly enhanced performance but apt to be very sensitive to fabrication errors. The formulation proposed is to attain robustness of the performance by including the sensitivity of the response with respect to uncertain variables as a term of objective function to be minimized. This formulation is simple and practically applicable since no detail statistical information on fabrication errors is required. The geometric variables, beam width, length and thickness of vibratory micro gyroscopes are adopted as design variables and at the same time considered as uncertain variables because here occur the fabrication errors. A robustness test in terms of a percentage yield by using the Monte Carlo simulation has shown that the robust optimum produces twice more acceptable designs than the deterministic optimum. Improvement of robustness becomes bigger as the amount of fabrication errors is assumed larger. Considering that the magnitude of fabrication errors and uncertainties in a MEMS structure are comparatively large, the present method is illustrated to be a viable approach for a robust MEMS design.

• Elastomers and Composites
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• v.44 no.2
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• pp.106-111
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• 2009

Tissue engineering is a research field for artificial substitutes to improve or replace biological functions. Scaffolds play a important role in tissue engineering. Scaffold porosity and pore size provide adequate space, nutrient transportation and cell penetration throughout the scaffold structure. Scaffold structure is directly related to fabrication methods. This review will introduce the current technique of 3D scaffold fabrication for tissue engineering. The conventional technique for scaffold fabrication includes salt leaching, gas foaming, fiber bonding, phase seperation, melt moulding, and freeze drying. These conventional scaffold fabrication has the limitations of cell penetration and interconnectivity. In this paper, we will present the solid freeform fabrication (SFF) such as stereolithography (SLA), selective laser sintering (SLS), and fused deposition modeling (FDM), and 3D printing (3DP).

• Journal of Intelligence and Information Systems
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• v.9 no.1
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• pp.157-177
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• 2003

This paper presents a comprehensive and successful application of data mining methodologies to improve and predict wafer yield in a semiconductor wafer fabrication system. As the wafer fabrication process is getting more complex and the volume of technological data gathered continues to be vast, it is difficult to analyze the cause of yield deterioration effectively by means of statistical or heuristic approaches. To begin with this paper applies a clustering method to automatically identify AUF (Area Uniform Failure) phenomenon from data instead of naked eye that bad chips occurs in a specific area of wafer. Next, sequential pattern analysis and classification methods are applied to and out machines and parameters that are cause of low yield, respectively. Furthermore, radial bases function method is used to predict yield of wafers that are in process. Finally, this paper demonstrates an information system, Y2R-PLUS (Yield Rapid Ramp-up, Prediction, analysis & Up Support), that is developed in order to analyze and predict wafer yield in a korea semiconductor manufacturer.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.8
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• pp.524-530
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• 2015

We propose a three-electrode type electronic paper display and its fabrication process to realize single color at the same display panel. We establish a fabrication process with the mixing of electronic ink, loading of this ink, electronic ink assembly, packaging and driving. Also, we discuss an operating principle of this panel and the induced image reversal phenomenon by electric field area of the lower electrodes. This phenomenon is not occurred for the panel having $10{\mu}m$ electrode space. By this pixelation structure like this three-electronic paper display, a single color realization without color filter is possible and various kind of color is defined by a dye selection for charged particles and electrically neutral fluid.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.65-66
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• 2009

This paper describes a procedure developed to fabricate negative photo resist SUMS to a semi-insulating (SI)-GaAs-based substrate. SU-8 is attractive for micromachine multi-layer circuit fabrication, because it is photo-polymerizable resin, leading to safe, and economical processing. This work demonstrates SUMS photo resist can be used for RFIC/MMIC application.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.57 no.3
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• pp.429-432
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• 2008

Much studies have been concentrated to develop the fabrication technique for high critical current density but still there are a lot of gap which should be overcome for large scale application of superconducting materials at liquid nitrogen temperature. The improvement of the critical current can be achieved by forming the nano size defect working as a flux pinning center inside the superconductor. In this paper, the establishment of fabrication condition and additive effects of second elements were examined so as to improve the related properties to the practical use of superconductor.

• Proceedings of the Korean Operations and Management Science Society Conference
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• 2001.10a
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• pp.298-301
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• 2001

In semiconductor manufacturing, wafer fabrication is the most complicated and important process, which is composed of several hundreds of process steps and several hundreds of machines involved. The productivity of the manufacturing mainly depends on how well they control balance of WIP flow to achieve maximal throughput under short manufacturing cycle time. In this paper mathematical formulation is suggested for the stepper scheduling, in which cycle time reduction and maximal production is achieved.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.57 no.10
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• pp.1841-1846
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• 2008

In this paper, we present the fabrication of microlens by electrohydrodynamic atomization(EHDA) of PDMS prepolymer. The diameter and contact angle of PDMS microlens can be altered by changing the applied voltage and substrate temperature at the experimental setup. It is considered that PDMS microlens can be integrated into the Lab-on-a-chip directly without any photolithographic process by EHDA. The property of PDMS microlens is confirmed by transmitting and measuring the Gaussian beam through microlens.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.1093-1096
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• 2001

Eletrochemical phenomenon are employed in the manufacturing of micro-electrochemical machining(micro-ECM). The application of controlled electrochemical metal removal in the fabrication of microstructures and microcomponents is refer to as micro-electrochemical machining. In this paper, we introduce a new method named $\ulcorner$point-electrode electro chemical machining method$\lrcorner$ was proposed to establish micro fabrication technology by use of electrochemical machining. And we find effect of the electrochemical phenomenon in several conditions.