• Journal of the Korean Ceramic Society
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• v.31 no.6
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• pp.678-684
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• 1994

The surface of alumina is capable of acquiring a change when it is in an aqueous solution. This surface change will have a strong influence on the surrounding ions, particularly those of opposite change known as the counter ions. A site-binding model of the {{{{ gamma }}-alumina/KCl(aq) interface was used to calculated theoretical surface ionization constants and P.Z.C.(Point of zero change) of {{{{ gamma }}-alumina. This paper was carried out to investigate the effect of calcination temperature on the acidic and electrical properties of pure {{{{ gamma }}-alumina prepared by the precipitation method from the Al(NO3)3.9H2O and NH4OH. From the experimental data it was shown that {{{{ gamma }}-alumina have a mainly Br nsted acid site. However, the acidity of {{{{ gamma }}-alumina decreased with increasing calcination temperature at strength Ho +9.3. The surface charge density of {{{{ gamma }}-alumina was increased with electrolyte ionic strength and calcination temperature.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.10 no.5
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• pp.44-50
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• 2011

The effect of deposition time in arc ion plating on surface properties of the TiN-coated SM45C steel is presented in this paper. The surface roughness, micro-particle, micro-hardness, coated thickness, atomic distribution of TiN, and adhesion strength are measured for various deposition times. It has been shown that the deposition time has a considerable effect on the micro-hardness, the coated thickness, and the atomic distribution of TiN of the SM45C steels but that it has little influence on the surface roughness and adhesion strength.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.214-217
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• 2002

Micro Surface Electrochemical Machining has traditionally been used in highly specialized fields such as those of the aerospace and defense industries. It is now increasingly being applied in other industries where parts with difficult-to-cut material, complex geometry and tribology such as compute. hard disk drive(HDD) are required. Pulse Electrochemical Micro-machining provides an economical and effective method for machining high strength, high tension, heat-resistant materials into complex shapes such as turbine blades of titanium and aluminum alloys. Usually aluminum alloys are used bearings to hard disk drive in computer. In order to apply aluminum alloys to bearing used in hard disk drive, this paper presents the characteristics of Micro Surface Electrochemical machining for aluminum alloy.

• Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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• 2009.05a
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• pp.270-272
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• 2009

This paper presents a basic data of the surface discharge characteristics for solid dielectric under non-uniform field in $N_2/O_2$ mixture gas. Used electrodes are needle and plane. Used solid dielectric is expoxy resin. With the variation of the mixture rates of the gas by 80[%]:20[%], 60[%]:40[%] and 40[%]:60[%] in same condition, we can obtain different surface dielectric strength. Increased Pressure and thickness caused increased surface dielectric strength.

• Journal of Ocean Engineering and Technology
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• v.10 no.1
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• pp.53-64
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• 1996

In this paper, rotating bending fatigue tests have been carried out to investigate the growth behabiors of surface fatigue crack initiated from a small artificial surface defect, that might exist in real structures, on 2024-T3 and 6:4 brass. The test results are analysed in the viewpoints of both strength of materials and fracture mechanics, it can be concluded as follows. The effect of a small artificial surface defect upon the fatigue strength is very large. The sensitivity of 2024-T3 on the defect is higher than that of 6:4 brass. The growth behavior of the surface fatigue crack of 2024-T3 is different from that of 6:4 brass. The growth rate of the surface fatigue crack of 2024-T3 is considerably rapid in the early stage of the fatigue life and apt to decrease in the later stage. It was impossible to establish a unifying approach in the analysis of crack growth begabior of 2024-T3 and 6:4 brass using the maximum stress intensity factor because of their dependence on stress level. But if the elastic strain and cyclic total strain intensity factor range were applied to obtain the growth rate of surface fatigue cracks of the materials, the data were found to be nearly coincided.

• Journal of Korean Society of Water and Wastewater
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• v.12 no.1
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• pp.81-87
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• 1998

The possibility of collision of two particles slowly settling one after another in water can be described using the collision efficiency factor in differential sedimentation (${\alpha}_{DS}$). ${\alpha}_{DS}$ was found to be a function of several parameters particle size, particle size ratio, Hamaker constant, density of liquid and particle, gravity acceleration. Previous researches were limited to the case when there is no electric repulsion assuming that the suspension is destabilized. In this paper, ${\alpha}_{DS}$ is calculated for the stabilized condition. The relative trajectory of two particles are calculated including hydrodynamics, attraction and repulsion forces. Ionic strength and surface potential significantly affect the collision possibility of two settling particles. Depending on the surface potential and ionic strength, ${\alpha}_{DS}$ value is divided into three regions; stable, unstable and transition zone. ${\alpha}_{DS}$ increases as the ionic strength increases, and as the surface charge decreases. This result can be used to model both destabilized and stabilized suspension incorporating the collision efficiency factors of the other coagulant mechanisms such as fluid shear and Browian motion.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.10a
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• pp.319-324
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• 2004

Cross wedge rolling process is utilized to manufacture multi-stepped axis symmetrical parts. This process is generally performed under high temperature conditions in order to induce serious deformation. But cold cross wedge rolling process has been rarely studied due to the limits of deformation. Recently, the cold cross wedge rolling process has been utilized to enhance the material strength in specified parts of manufactured products. In this paper, experimental researches were carried out with various forming conditions of cold cross wedge rolling process in order to suggest the design guidance to make preform for cold cross wedge rolling. The tensile strength and the surface hardness of specified region were compared to that of initial material with the variation of the area reduction and the rotational speed of rolling die. With respect to the area reduction, the maximum tensile strength was linearly increased and the surface hardness was rapidly increased within lower percent of area reduction. The surface hardness was saturated over the rotational die speed of 0.8 RPM.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.8
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• pp.700-704
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• 2003

This paper describes on characteristics of 2" 3C-SiC wafer bonding using PECVD (plasma enhanced chemical vapor deposition) oxide and HF (hydrofluoride acid) for SiCOI (SiC-on-Insulator) structures and MEMS (micro-electro-mechanical system) applications. In this work, insulator layers were formed on a heteroepitaxial 3C-SiC film grown on a Si (001) wafer by thermal wet oxidation and PECVD process, successively. The pre-bonding of two polished PECVD oxide layers made the surface activation in HF and bonded under applied pressure. The bonding characteristics were evaluated by the effect of HF concentration used in the surface treatment on the roughness of the oxide and pre-bonding strength. Hydrophilic character of the oxidized 3C-SiC film surface was investigated by ATR-FTIR (attenuated total reflection Fourier transformed infrared spectroscopy). The root-mean-square suface roughness of the oxidized SiC layers was measured by AFM (atomic force microscope). The strength of the bond was measured by tensile strength meter. The bonded interface was also analyzed by IR camera and SEM (scanning electron microscope), and there are no bubbles or cavities in the bonding interface. The bonding strength initially increases with increasing HF concentration and reaches the maximum value at 2.0 ％ and then decreases. These results indicate that the 3C-SiC wafer direct bonding technique will offers significant advantages in the harsh MEMS applications.ions.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.10 no.2
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• pp.84-89
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• 2011

This paper studied the carburizing of chromium molybdenum steel which the heat treatment effect of gear geometric tolerance, OPD, Runout, the surface hardness, the maximum hardness, the core hardness and the bending fatigue strength were investigated. Firstly, the deformation is observed, and the results of circularity, squareness, OPD and Runout of SCM822, SCM425, and SCM415 are obtained in order. Secondly, in order to investigate the gear hardness, the surface hardness, the maximum hardness and the core hardness of SCM822, SCM425, and SCM415 are obtained; and the surface hardness of SCM822 is about 10% higher than SCM415's, and about 3% higher than SCM425's. Thirdly, the fatigue strength of SCM822 is about 10% higher than SCM415's, and about 7% higher than SCM425's in the fatigue test results. At last, for the purpose of the minimum deformation of heat treatment, and also the improvement of fatigue strength, the best gear material is SCM822 in this test.

• Nuclear Engineering and Technology
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• v.56 no.6
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• pp.2367-2374
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• 2024

In this paper, based on the need for high-strength connections between all-tungsten-oriented plasma materials and thermal sinking materials of copper and its alloys in nuclear fusion devices, a study on the effect of tungsten surface laser micro structuring on the interfacial bonding properties of W/Cu joints was carried out. In the experiment, the connectors were prepared by vacuum fusion infiltration technology, and the effects of microgroove structure on the mechanical and thermal conductivity of W/Cu connectors were investigated under different parameters (including microgroove pitch, microgroove depth, and microgroove taper). The maximum shear strength is 126.0 MPa when the pitch is 0.15 mm and the depth is 34 ㎛. In addition, the negative taper structure, i.e., the width of the entrance of the microstructure is smaller than the width of the interior of the microstructure, is also investigated. The shear tests show that there is an approximately linear relationship between the shear strength of W/Cu and taper. Compared with the positive taper, the shear strength of the samples with the same morphological density and depth of the tungsten surface is significantly higher.