• 마이크로전자및패키징학회지
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• 제20권2호
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• pp.39-46
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• 2013

본 논문은 캐리어의 이동도 및 전도도를 개선하고, 흡수된 빛의 이동 경로를 증가시켜 광흡수도를 높이기 위하여 정공 수송층 재료에 금 나노입자를 첨가하여 유기태양전지를 제작하였다. 광활성층으로는 P3HT와 PCBM의 bulk-heterojunction 구조를 사용하였다. 유기태양전지에서 금 나노입자를 첨가한 정공 수송층의 효과를 관찰하기 위하여 금 나노입자의 첨가량(0, 0.5, 1.0 wt% Au)과 열처리온도(상온, $110^{\circ}C$, $130^{\circ}C$, $150^{\circ}C$)에 따른 광학적 전기적 특성을 조사하였다. 최대전력변환효율을 갖는 유기태양전지는 0.5 wt% 금 나노입자 첨가한 소자와 $130^{\circ}C$에서 열처리한 소자에서 관찰되었다. 이때 유기태양전지의 전기적 특성은 금 나노입자를 0.5 wt% 첨가한 경우, 단락전류밀도, 곡선인자 및 전력변환효율은 각각 10.2 $mA/cm^2$, 55.8% 및 3.1%로 나타났으며, $130^{\circ}C$에서 열처리한 경우, 12.0 $mA/cm^2$의 단락전류밀도와 64.2%의 곡선인자를 가지며, 4.0%의 전력변환효율이 관찰되었다.

• 한국산학기술학회논문지
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• 제19권6호
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• pp.37-45
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• 2018

전기자동차는 내연기관 자동차와는 달리 배출가스가 없어 친환경 차량을 대표하지만, 장착된 축전지에 충전된 전기로 구동되기 때문에, 1회 충전으로 갈 수 있는 거리가 전지의 에너지 밀도에 의해 좌우된다. 따라서 높은 에너지 밀도를 갖는 리튬이온 배터리가 전기구동자동차용 전지로 많이 사용하고 있다. 리튬이온 배터리의 효율을 지배하는 중요한 구성품은 전극이므로 전극 제조공정은 리튬이온 배터리 전체생산 공정에서 중요한 역할을 한다. 특히 전극의 제조 공정 중 건조공정은 성능에 큰 영향을 미치는 매우 중요한 공정이다. 본 논문에서는 전극제조에서 건조공법의 효율성 및 생산성 증대를 위한 혁신적인 공정을 제안하고, 장비 설계 방법 및 개발 결과에 대하여 기술하였다. 구체적으로, 극판 결착력 향상 기술, 대기압 과열증기 건조 기술, 그리고 건조로 폭 슬림화 기술들에 대한 설계 절차 및 개발방법을 제시하였다. 결과로 세계최초의 개방형/일체형 대기압 과열증기 Turbo Dryer 양산기술 확보를 통해 전기차 전지용 극판 고속건조기술을 확보 하였다. 기존의 건조공정과 비교할 때 건조로 길이 생산성을 향상시켰다 (건조 Lead Time 0.7분(分) ${\rightarrow}$ 0.5분(分)기준).

• 한국막학회:학술대회논문집
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• 한국막학회 1998년도 제6회 하계 Workshop (98 한국막학회, 국립환경연구원 국제 Workshop, 수자원 보전과 막분리 공정)
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• pp.135-153
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• 1998

Nanofiltration (NF) is a recently introduced term in membrane separation. In 1988, Eriksson was one of the first authors using the word 'nanofiltration' explicitly. Some years before, FilmTech started to use this term for their NF50 membrane which was supposed to be a very loose reverse osmosis membrane or a very tight ultrafiltration membrane. Since then, this term has been introduced to indicate a specific boundary of membrane technology in between ultrafiltration and reverse osmosis. The application fields of the NF membranes are very broad as follows: Demeneralizing water, Cleaning up contaminated groundwater, Ultrapure water production, Treatment of effleunts containing heavy metals, Offshore oil platforms, Yeast production, Pulp and paper mills, Textile production, Electroless copper plating, Cheese whey production, Cyclodextrin production, Lactose production. The earliest NF membrane was made by Cadotte et al, using piperazine and trimesoyl chloride as monomers for the formation of polyamide active layer of the composite type membrane. They coated very thin interfacially potymerized polyamide on the surface of the microporous polysulfone supports. The NF membrane exhibited low rejections for monovalent anions (chloride) and high rejections for bivalent anions (sulphate). This membrane was called NS300. Some of the earliest NF membranes, like the NF40 membrane of FilmTech, the NTR7250 of Nitto-Denko and the UTC20 and UTC60 of Toray, are formed by a comparable synthesis route as the NS300 membrane. Commercially available NF membranes nowadays are as follows: ASP35 (Advanced Membrane Technology), MPF21; MPF32 (Kiryat Weizmann), UTC20; UTC60; UTC70; UTC90 (Toray), CTA-LP; TFCS (Fluid Systems), NF45; NF70 (FilmTec), BQ01; MX07; HG01; HG19; SX01; SX10 (Osmonics), 8040-LSY-PVDI (Hydranautics), NF CA30; NF PES 10 (Hoechst), WFN0505 (Stork Friesland). The typical ones among the commercially available NF membranes are polyamide composite membrane consisting of interfacially polymerized polyamide active layer and microporous support. While showing high water fluxes and high rejections of multivalent ions and small organic molecules, these membranes have relatively low chemical stability. These membranes have low chlorine tolerance and are unstable in acid or base solution. This chemical instability is appearing to be a big obstacle for their applications. To improve the chemical stability, we have tried, in this study, to prepare chemically stable NF membranes from PVA. The ionomers and interfacially polymerized polyamide were used for the modification of'the PVA membranes. For the detail study of the active layer, homogeneous NF membranes made only from active layer materials were prepared and for the high performance, composite type NF membranes were prepared by coating the active layer materials on microporous polysulfone supports.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.431-432
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• 2012

In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.

• 분석과학
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• 제16권5호
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• pp.1041-1051
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• 2003

즉발감마선 중성자방사화법 (PGAA)은 시료내 미량 및 주원소를 빠르게 비파괴적으로 분석하는 방법으로 주로 광물, 금속, 석탄, 시멘트, 석유, 코팅, 제지 등 다양한 산업체에서 실시간 분석법으로 매우 유용하다. 이 방법은 제약과 관련된 산업체 또는 연구업무에도 활용되며, 마약 또는 폭발물과 같은 위험물질의 탐지에도 이용되고 있다. 본 총설은 즉발감마선 중성자 방사화법의 현재의 기술현황과 앞으로 연구추진 경향에 대하여 서술하였다. PGAA 시스템은 중성자 선원, 증성자 핵반응으로부터 발생하는 즉발감마선을 측정하기위한 다중채널분석기와 A/D 변환기 등의 전자모듈과 고분해능 HPGe 검출기로 구성된다. 속중성자의 콤프턴 산란에 의한 높은 바탕값은 감마-감마 동시계수장치의 도입으로 개선될 수 있다. 현재 $^{252}Cf$를 사용한 즉발감마선 중성자 방사화 장치는 수용액중에 존재하는 원소들의 실시간분석을 위해 한국원자력연구소에서 개발중에 있다. 이 장치는 다양한 마약 및 폭발물 또는 화학무기의 탐지에도 응용될 수 있다.

• 공업화학
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• 제24권1호
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• pp.31-37
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• 2013

텍스쳐링에 의해 실리콘 웨이퍼의 표면반사율을 감소시키는 것은 실리콘 태양전지의 효율향상을 위해 매우 중요한 공정이다. 본 연구에서는 에칭속도 제어를 위해 촉매제를 포함한 산 용액으로 텍스쳐링 처리한 웨이퍼의 표면효과와 그 태양전지 특성을 평가 고찰하였다. 텍스쳐링 전 $HNO_3-H_2O_2-H_2O$ 용액의 전처리는 표면반사율의 초기 저감효과를 가져왔다. 이는 산화특성에 의해 유기 불순물이 제거되고 텍스쳐링을 위한 핵의 생성에 기인한다고 할 수 있다. 이후 공정에서 불산/질산 용액에 인산 및 초산과 같은 완충제를 첨가한 혼합용액을 제조하고, 적정 농도 조합과 그 처리시간의 최적화를 통해 개선된 텍스쳐링 효과를 얻을 수 있었으며 이 효과는 표면반사율 감소를 통해 확인할 수 있었다. 이렇게 제조된 실리콘 웨이퍼에 반사방지막 코팅 후 태양전지를 제작하여 그 변환효율을 측정한 결과 16.4%의 양호한 특성을 나타냈다. 이는 개선된 텍스쳐링 처리에 의해 저감된 표면특성에 의한 단락전류의 증가에 기인한 것으로 추정된다.

• 대한치과보철학회지
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• 제45권5호
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• pp.589-600
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• 2007

Statement of Problem: Titanium has many advantages of high biocompatibility, physical porperties, low-weight, low price and radiolucency, but it is incompatible with conventional dental porcelain due to titanium's oxidative nature. Many previous studies have shown that they used the method of sandblast surface treatment prior to porcelain application, the researchs are processing about the method of acid etching or surface coating. Purpose: The purpose of this research is to study the effect on bond strength between titanium and porcelain when using macro-surface treatment and micro-surface treatment and macro and micro surface treatment. Material and method: In this study, we evaluated the bond strength by using 3-point bending test based on ISO 9693 after classified 7 groups-group P : polished with #1200 grit SiC paper, group SS : sandblasted with $50{\mu}m$ aluminum oxides, group LS : sandblasted with $250{\mu}m$ alumium oxides, group HC : treated with 10% hydrochloric acid, group NF : treated with 17% solution of fluoric acid and nitric acid, group SHC : treated with 10% hydrochloric aicd after sandblsting with $50{\mu}m$ alumium oxides, group SNF treated with 17% solution of fluoric acid and nitric acid. Results : Within the confines of our research, the following results can be deduced. 1. Group SS which was sandblasted with $50{\mu}m$ aluminum oxides showed the highest bond strength of 61.74 MPa and significant differences(P<0.05). The bond strengths with porcelain in groups treated acid etching after sandblasting decreased more preferable than the group treated with sandblasting only. It gives significant differences(P<0.05). 2. After surface treatments, the group treated with sandblasting showed irregular aspect formed many undercuts, in the SEM photographs. The group treated with hydrochloric acid had the sharp serrated surfaces, the group treated with the solution of fluoric acid and nitric acid had the smooth surfaces, the group with sandblasting and hydrochloric acid had irrigular and porous structure, the group with sandblasting and the solution of fluoric acid and nitric acid had crater-like surfaces. But all of the groups treated with acid etching was not found and undercut. Conclusion: In above results, average surface roughness increase, bond strength also increase, but surface topographs influences more greatly on bond strengths.

• 대한소아치과학회지
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• 제32권4호
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• pp.611-619
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• 2005

본 연구의 목적은 초기 우식 병소에서 광원에 따른 형광효과를 비교하는 것으로 정량 분석형 laser/light 형광법(Quantitative laser/light-induced fluorescence, QLF)을 이용하여 아르곤 레이저광, 할로겐광, 발광다이오드광(LED), 플라즈마광의 형광효과를 비교하였다. 발거된 60개의 치아를 선정한 후, 인공우식용액에 노출되지 않을 부분에 nail varnish를 도포하였고 치아는 24, 48, 72시간 동안 인공우식용액에 보관되었다. 건조 후 QLF영상으로 초기 우식 부위의 광밀도 차이에 의한 탈회정도가 기록되었다. 또한 조영제를 이용하여 동일한 방법으로 실험하였고 다음과 같은 결과를 얻었다 염료를 이용하여 같은 방법으로 실험하여 또 다른 결과를 얻었다. 1. 각 군의 평균 광밀도를 볼 때, 플라즈마광이 세 군 모두에서 다른 광원들 보다 높았다(p<0.05). 2. 세 군 사이에서 평균 광밀도를 비교해 볼 때, 플라즈마광과 할로겐광이 차이를 보였다(p<0.05). 3. 조영제를 사용하였을 경우 평균 광밀도를 비교해 볼 때, 플라즈마광이 세 군 모두에서 다른 광원들보다 높았고 (p<0.05), 발광다이오드광(LED)와 아르곤 레이저광을 제외한 모든 광원이 차이를 보였다(p<0.05). 4. 조영제를 사용하지 않은 경우와 사용한 경우 평균 광밀도를 비교해 볼 때, 사용한 경우에 모든 광원의 평균 광밀도 차이가 컸다.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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• pp.421-427
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• 2009

We successfully fabricated 4.7-inch organic thin film transistors array with $640{\times}480$ pixels on flexible substrate. All the processes were done by photolithography, spin coating and ink-jet printing. The OTFT-Electrophoretic (EP) pixel structure, based on a top gate OTFT, was fabricated. The mobility, ON/OFF ratio, subthreshold swing and threshold voltage of OTFT on flexible substrate are: 0.01 ^2/V-s, 1.3 V/dec, 10E5 and -3.5 V. After laminated the EP media on OTFT array, a panel of 4.7-inch $640{\times}480$ OTFT-EPD was fabricated. All of process temperature in OTFT-EPD is lower than $150^{\circ}C$. The pixel size in our panel is $150{\mu}m{\times}150{\mu}m$, and the aperture ratio is 50 %. The OTFT channel length and width is 20 um and 200um, respectively. We also used OTFT to drive EP media successfully. The operation voltages that are used on the gate bias are -30 V during the row data selection and the gate bias are 0 V during the row data hold time. The data voltages that are used on the source bias are -20 V, 0 V, and 20 V during display media operation.

• Advanced Composite Materials
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• 제17권1호
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• pp.25-40
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• 2008

The research and development in soundproof materials for preventing noise have attracted great attention due to their social impact. Noise insulation materials are especially important in the field of soundproofing. Since the insulation ability of most materials follows a mass rule, the heavy weight materials like concrete, lead and steel board are mainly used in the current noise insulation materials. To overcome some weak points in these materials, fiber reinforced composite materials with lightweight and other high performance characteristics are now being used. In this paper, innovative insulation sheet materials with carbon and/or glass fabrics and nano-silica hybrid PU resin are developed. The parameters related to sound performance, such as materials and fabric texture in base fabric, hybrid method of resin, size of silica particle and so on, are investigated. At the same time, the wave analysis code (PZFlex) is used to simulate some of experimental results. As a result, it is found that both bundle density and fabric texture in the base fabrics play an important role on the soundproof performance. Compared with the effect of base fabrics, the transmission loss in sheet materials increased more than 10 dB even though the thickness of the sample was only about 0.7 mm. The results show different values of transmission loss factor when the diameters of silica particles in coating materials changed. It is understood that the effect of the soundproof performance is different due to the change of hybrid method and the size of silica particles. Fillers occupying appropriate positions and with optimum size may achieve a better effect in soundproof performance. The effect of the particle content on the soundproof performance is confirmed, but there is a limit for the addition of the fillers. The optimization of silica content for the improvement of the sound insulation effect is important. It is observed that nano-particles will have better effect on the high soundproof performance. The sound insulation effect has been understood through a comparison between the experimental and analytical results. It is confirmed that the time-domain finite wave analysis (PZFlex) is effective for the prediction and design of soundproof performance materials. Both experimental and analytical results indicate that the developed materials have advantages in lightweight, flexibility, other mechanical properties and excellent soundproof performance.