• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.78-81
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• 2003

Polishing Processes are widely used in the glass, optical, die and semiconductor industry and are conventionally carried out using abrasive slurry and a polishing pad. But abrasive slurry process has a weak point that is high cost of handling of used slurry and hard controllability of slurry. Recently, some researches have attempted to solve these problems and one method is the development of a fixed abrasive pad. FAP has a couple of advantages including clean environment, lower CoC, easy controllability and higher form accuracy. But FAP also has a weak point that is need of dressing because of glazing and loading. The paper introduces the basic concept and fabrication technique of FAP using hydrophilic polymers with swelling characteristics in water and explains the self-conditioning phenomenon. Experimental results demonstrate to achieve nano surface roughness of soda lime glass for optical application

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 춘계학술대회 논문집
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• pp.854-857
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• 2000

Chemical Mechanical Polishing(CMP) has been accepted as one of the essential processes for VLSI fabrication. However, as the polishing process continues, pad pores get to be glazed by polishing residues, which hinder the supply of new slurry. This defect makes removal rate decrease with a number of polished wafer and the desired within-chip planarity, within wafer and wafer-to-wafer nonuniformity are unable to be achieved. So, pad conditioning is essential to overcome this defect. The eletroplated diamond grit disk is used as the conventional conditioner, And alumina long fiber, the .jet power of high pressure deionized water and vacuum compression are under investigation. But, these methods have the defects like scratches on wafer surface by out of diamond grits, subsidences of pad pores by over-conditioning, and the limits of conditioning effect. To improve these conditioning methods. this paper presents the Characteristics of Ultrasonic conditioning aided by cavitation.

• 산업기술연구
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• 제34권
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• pp.67-70
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• 2014

In this paper, we propose a diagnosis algorithm for 25.8kV $N_2$ insulated Pad-mounted Switchgear in oder to improve reliability by preventing of fault in advance. The proposed algorithm can diagnose the problems of Pad-mounted Switchgear such as gas leakage and VI(Vacuum Interrupter) trouble (contact abrasion, coil aging etc.) by using pressure sensor, stroke sensor and coil current sensor.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2005년도 추계학술대회 논문집 전기물성,응용부문
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• pp.148-150
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• 2005

Indium tin oxide (ITO) thin film was polished by chemical mechanical polishing (CMP) immediately after pad conditioning with the various conditioning temperatures by control of de-ionized water (DIW). Light transparent efficiency of ITO thin film was improved after CMP process after pad conditioning at the high temperature because the surface morphology was smoother by soften polishing pad and decreased particle size.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2000년도 춘계학술대회논문집A
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• pp.381-386
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• 2000

The brake force of drum brakes for commercial vehicles is applied by a s-cam. First of all the influence of the s-cam load angles and elastic modulus of the pad on the contact pressure distribution between pad and drum was checked by using 3 dimensional finite element model. In the second part, temperature and thermal stress analyses were carried out by an axisymmetric model with constant heat flux and pressure-proportional heat flux. In the case of temperature analysis the heat conduction from the interface to the pad and the drum was modeled using a thin soft film element, so artificial division of the generated heat flux between pad and drum is not necessary. The analysis was performed by ABAQUS/Standard code.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2000년도 춘계학술대회논문집 - 한국공작기계학회
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• pp.285-290
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• 2000

This paper was undertaken to do morphological analysis of wear debris for slipper-pad of hydrauric rotary acuator. The lubricating wear test was performed under different experimental conditions using the wear test device and wear specimens of the pin on disk type was rubbed in paraffinic base oil by three kinds of lubricating materials. varying applied load, sliding distance. The four shape parameters(50% volumetric diameter, aspect, roundness and reflectivity) are used showed that the four shape parameters of wear debris depend on a kind of the lubricating condition. It was capable of presuming wear volume for slipper-pad of hydrauric rotary acuator on driving time.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2004년도 추계학술대회 논문집
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• pp.445-450
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• 2004

Recently, many studies have been performed and good results have been reported in literature on the prediction of the brake disk temperature. However, study on the brake fluid temperature is rarely found despite of its importance. In this study, brake fluid temperature is predicted according to material property of brake piston. For the analysis, a typical disk-pad brake system is modeled including the brake disk, pad, caliper, piston and brake fluid. Vehicle deceleration, weight distribution by deceleration, disc-pad heat division and the cooling of brake components are considered in the analysis of heat transfer. Unsteady-state temperature distribution are analyzed by using the finite element method and numerical results are compared with the vehicle test data

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 추계학술대회 논문집 Vol.18
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• pp.358-359
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• 2005

Chemical mechanical polishing(CMP) process depends on a variety of variables. Especially, surface roughness of pad plays a key role in material removal in CMP in terms of transportation ability of pores and real contact area. The surface roughness is deteriorated with polishing time by applied pressure and relative velocity. In this reason, diamond conditioner has been used to maintain the roughness on the pad. The authors try to investigate the correlation between pad roughness and frictional behavior by comparing ex-situ conditioning with in-situ conditioning.

• KSTLE International Journal
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• 제5권1호
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• pp.32-35
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• 2004

The purpose of this study is to investigate the effects of the structure and mechanical properties of laser-processed pads on their polishing behavior such as their removal rate and WIWNU (within wafer non-uniformity) during the chemical mechanical planarization (CMP) process. The holes on the pad acted as the reservoir of slurry particles and enhanced the removal rate. Without grooves, no effective removal of wafers was possible. When the length of the circular-type grooves was increased, higher removal rates and lower wafer non-uniformity were measured. The removal rate and non-uniformity linearly increased as the elastic modulus of the top pad increased. Higher removal rates and lower non-uniformity were measured as the hardness of the pad increased.

• 한국소음진동공학회논문집
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• 제23권8호
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• pp.717-724
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• 2013

The present study provides the numerical results in association with caliper stiffness and friction curve. From the numerical results, it is concluded that the pad vibration modes with dominant displacement in rotation direction is sensitive in the flutter instability. Particularly, the pad rigid mode is shown to become the squeal mode when the caliper stiffness is introduced in brake squeal model. Therefore, the caliper contact stiffness between the pad and caliper is expected to contribute to the squeal modes of the brake pad.