• Title/Summary/Keyword: pad

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STI-CMP 공정의 질화막 잔존물 및 패드 산화막 손상에 대한 연구 (A Study on the Nitride Residue and Pad Oxide Damage of Shallow Trench Isolation(STI)-Chemical Mechanical Polishing(CMP) Process)

  • 이우선;서용진;김상용;장의구
    • 대한전기학회논문지:전기물성ㆍ응용부문C
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    • 제50권9호
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    • pp.438-443
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    • 2001
  • In the shallow trench isolation(STI)-chemical mechanical polishing(CMP) process, the key issues are the optimized thickness control, within-wafer-non-uniformity, and the possible defects such as pad oxide damage and nitride residue. The defect like nitride residue and silicon (or pad oxide) damage after STI-CMP process were discussed to accomplish its optimum process condition. To understand its optimum process condition, overall STI related processes including reverse moat etch, trench etch, STI fill and STI-CMP were discussed. Consequently, we could conclude that law trench depth and high CMP thickness can cause nitride residue, and high trench depth and over-polishing can cause silicon damage.

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유도가열에 의한 Sn-3.5Ag 솔더 범프의 접합 특성에 관한 기초연구 (Joining characteristics of Sn-3.5Ag solder bump by induction heating)

  • 최준기;방희선;;방한서
    • 대한용접접합학회:학술대회논문집
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    • 대한용접접합학회 2006년 추계학술발표대회 개요집
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    • pp.181-183
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    • 2006
  • This paper studies the mechanical behaviors of Sn-3.5Ag solder joint against substrate(such as Au/Ni/Cu, Au/cu, Ni/Cu and Cu pad) after induction heating, a new soldering method. It was found that the solder bump formation depends on the time and current of the induction heating system. Also the heating value of the solder bump were found to vary with respect to the thermal conductivity of the pads on the substrate. In case of Au/Ni/Cu pad and Au/Cu pad, solder bump's shear strength were high for the heating time of $1.5{\sim}2sec$. For Ni/Cu pad, solder bump's shear strength were found to increase with time increment.

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고속철도 교량의 동적거동에 미치는 탄성받침의 영향 (The Effects of Elastomer-Bearing on the Dynamic Behaviors of Bridge for KHSR)

  • 곽종원;김병석
    • 한국지진공학회논문집
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    • 제3권3호
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    • pp.1-8
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    • 1999
  • 현재 시공 중에 있는 경부고속철도의 교량은 2경간 연속인 경우에 중앙교각에는 pot 받침이 설치되고 양끝단의 교각에는 pad 받침이 설치되고 있으나 기존의 고속주행하는 철도에 의한 교량의 동해석에서는 이러한 지점조건이 고려되지 않은 상태에서 이루어져다 본 논문의 목적은 이러한 지점조건의 상이성에 따른 교량의 거동파악에 있으며 이를 위하여 본 연구에서는 이러한 지지점에사용된 탄성받침이 교량의 동적 거동에 미치는 영향에 관하여 연구하였다.

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지진시에 교량의 탄성 받침을 표현하는 범용 연결 유한 요소 모델의 유도식 (Derivation of General Link Finite Element Equation representing Pad Shoe in Bridge under Earthquake)

  • 정대열
    • 한국전산구조공학회:학술대회논문집
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    • 한국전산구조공학회 1999년도 봄 학술발표회 논문집
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    • pp.226-233
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    • 1999
  • When we numerically model the bridge under seismic condition, the full model combining the super-structure and the sub-structure is considered for the more accurate results than the separate model. In this case, the super-structure is connected with the sub-structure by the elastic pad shoe that is difficult to model, because it has the three translational elastic stiffness and the three rotational elastic stiffness. The two-node General Link element is derived in finite element equation representing such a pad shoe, and it is verified by comparing the one General Link element model with the corresponding three legacy spring element model. It is easy to model the pad shoe, if the General Link finite element is used. And the seismic analysis result of the bridge full model structure, which is modeled with the General Link element, has been compared with the one of the separate model structure. The present study gives. more conservative result than that of the separate model, which does not consider the dynamic behaviour of the sub-structure.

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콘크리트 원주형 공시체의 압축강도 시험을 위한 Unbonded Cap의 사용 (Use of Unbonded Caps in Determination of Compressive Strength of Hardened Concrete Cylinders)

  • 심재원;안태송
    • 한국콘크리트학회:학술대회논문집
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    • 한국콘크리트학회 2000년도 가을 학술발표회논문집(I)
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    • pp.161-166
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    • 2000
  • To save efforts for capping in the compressive strength tests of concrete, unbonded capping system has been standardized by ASTM C 1231 and AS 1012.9, respectively. These standards, however, do not sufficiently give a full detail of accessories such as steel retaining cap and rubber pad, especially hardness of rubber. Hence, without testing for sizes of steel retaining cap and rubber pad, tests for the quality control of rubber pads were conducted in detail according to Japanese studies. Based on tests, the range of hardness for rubber pad by the compressive strength(200~ 400kgf/$\textrm{cm}^2$) of concrete has been proposed and the guideline of reuses of a rubber pad is described.

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친환경행위가 월경곤란증에 미치는 영향 (Impact of Pro-environmental Behavior on Dysmenorrhea)

  • 김현경
    • 대한간호학회지
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    • 제41권2호
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    • pp.236-244
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    • 2011
  • Purpose: In this study the impact of pro-environmental behavior, well-being oriented behavior, and use of cloth menstrual pads on dysmenorrhea in Korean female adults was examined according to the theory of reasoned action. Methods: A cross-sectional study was conducted with 195 Korean female adults. Data were collected from June to August, 2010 using self-report questionnaires. Data were analyzed using t-test, one-way ANOVA, Pearson correlation coefficients, multiple regression, and logit regression with STATA 10.0. Results: Pro-environmental behavior explained 48% of well-being oriented behavior. Well-being oriented behavior explained 10% of cloth pad use. Use of cloth pad explained 4% of dysmenorrhea and 5% of menstrual pain. The path through well-being oriented behavior had a significant effect from pro-environmental behavior to cloth pad use. Conclusion: Use of cloth pad was significantly related with well-being oriented behavior, pro-environmental behavior, social influence, dysmenorrhea, and menstrual pain. The results of this study suggest that pro-environmental strategies can help health care providers diminish clients' menstrual symptoms. Nursing intervention can support pro-environmental behavioral strategies.

유한요소법을 이용한 궤도용 고무패드의 마모 예측 및 설계에 관한 연구 (Design Study on the Wear Enhanced of Rubber Pad of Track Assembly with Finite Element Method)

  • 이경호;노근래;이영신
    • 한국군사과학기술학회지
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    • 제11권5호
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    • pp.107-115
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    • 2008
  • In this paper, we have proposed a wear growth prediction method on the surface of rubber pad of track assembly installed in high-speed battle tank i.e. the automatic model updating code interfacing with commercial finite element simulation software. Also, simple and resonable geometrical, material finite element model was established to be easily updated based on the empirical threshold value of contact pressure on the contact surface. From the iterative model update and analysis results, we discovered a weak point on rubber pad surface and suggested a new design concept for improving the wear performance of track assembly.

Signal Analysis of Motor Current for End Point Detection in the Chemical Mechanical Polishing of Shallow Trench Isolation with Reverse Moat Structure

  • Park, Chang-Jun;Kim, Sang-Yong;Seo, Yong-Jin
    • KIEE International Transactions on Electrophysics and Applications
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    • 제2C권5호
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    • pp.262-267
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    • 2002
  • In this paper, we first studied the factors affecting the motor current (MC) signal, which was strongly affected by the systematic hardware noises depending on polishing such as pad conditioning and arm oscillation of platen and recipe, head motor. Next, we studied the end point detection (EPD) for the chemical mechanical polishing (CMP) process of shallow trench isolation (STI) with reverse moat structure. The MC signal showed a high amplitude peak in the fore part caused by the reverse meal. pattern. We also found that the EP could not be detected properly and reproducibly due to the pad conditioning effect, especially when conventional low selectivity slurry was used. Even when there was no pad conditioning effect, the EPD method could not be applied, since the measured end points were always the same due to the characteristics of the reverse moat structure with an open nitride layer.

CMP 패드의 Groove 특성 (The Characteristics of CMP Polishing Pad)

  • 김철복;박성우;김상용;이우선;장의구;서용진
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
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    • pp.715-718
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    • 2004
  • In this paper, we studied the characteristics of new polishing pad, which can apply W-CMP process for global planarization of multi-level interconnection structure. The hardness and density were measured as a function of groove pattern. Also, we compared the pore size through the SEM photograph. Finally, we investigated the CMP characteristics with five different kind of groove pattern sample. Through the above results, we can select optimum groove pattern, so we can expect to begin home product of polishing pad.

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PIV를 이용한 Chemical Mechanical Polishing 공정 중의 연마용액 유동흐름 측정 (Visualization of the Slurry Flow-Field during Chemical Mechanical Polishing by PIV)

  • 신상희;김문기;윤영빈;고영호
    • 한국가시화정보학회:학술대회논문집
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    • 한국가시화정보학회 2004년도 추계학술대회 논문집
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    • pp.48-51
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    • 2004
  • Chemical Mechanical Polishing(CMP) is popularly used in production of semiconductor because of large area polishing ability probability of improvement for more integrated circuit. However, present CMP processing causes some non-uniformity errors which can be critical for highly integrated circuit. Previous studies predict that flow-field of slurry during CMP can create non-uniformity, but no quantitative measurement has conducted. In this study, using PIV, slurry velocity flow-field during CMP is measured by changing the ratio of RPM of pad and carrier with tuned PIV system adequate for small room in CMP machine and Cabot's non-groove pad Epad-A100. The result show that velocity of slurry is majorly determined by pad-rpm and the ratio of between carrier and pad rpm make some changes in streamlines.

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