한국가시화정보학회:학술대회논문집
- 한국가시화정보학회 2004년도 추계학술대회 논문집
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- Pages.48-51
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- 2004
PIV를 이용한 Chemical Mechanical Polishing 공정 중의 연마용액 유동흐름 측정
Visualization of the Slurry Flow-Field during Chemical Mechanical Polishing by PIV
- 발행 : 2004.11.01
초록
Chemical Mechanical Polishing(CMP) is popularly used in production of semiconductor because of large area polishing ability probability of improvement for more integrated circuit. However, present CMP processing causes some non-uniformity errors which can be critical for highly integrated circuit. Previous studies predict that flow-field of slurry during CMP can create non-uniformity, but no quantitative measurement has conducted. In this study, using PIV, slurry velocity flow-field during CMP is measured by changing the ratio of RPM of pad and carrier with tuned PIV system adequate for small room in CMP machine and Cabot's non-groove pad Epad-A100. The result show that velocity of slurry is majorly determined by pad-rpm and the ratio of between carrier and pad rpm make some changes in streamlines.
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