• 디지털콘텐츠학회 논문지
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• 제12권2호
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• pp.225-232
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• 2011

는 책의 형태를 띠고 있지만 인쇄책이나 전자북(eBook)에서 보였던 '책'이라는 고정관념의 틀에서 벗어나 매체미학적 요소, 영상미학적 요소, 게임적 요소에 이르기까지 다양한 장르와 매체의 특성을 수용하고 있는 혁신적인 창조물이다. 앱(App)의 형식으로 구현된 앱북(AppBook)의 경우 기존의 인쇄책이나 전자책과는 차별화된 매체적 특성으로 사용자(독자)와의 상호작용성을 이끌어내고 있다. 본고에서는 매체의 특성과 내용의 관계를 다루는 매체미학적 시각에서 앱북 기반의 디지털소설 담화생성을 살펴본다. 매체특성이 텍스트의 내용과 관련을 맺으면서 매체에 따라 텍스트가 변형된다는 것을 염두에 둔다면, 창작과정에 있어서 이야기와 담화의 생성 방향 또한 디지털 매체와의 호흡을 수용하는 것이 바람직하다.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2004년도 ICCAS
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• pp.1966-1971
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• 2004

As the remote sensing satellite technology grows, the acquisition of accurate attitude and position information of the satellite has become more and more important. Due to the data processing limitation of the on-board orbit propagator and attitude determination algorithm, it is required to develop much more accurate orbit and attitude determination, which are so called POD (precision orbit determination) and PAD (precision attitude determination) techniques. The sensor and attitude dynamics simulation takes a great part in developing a PAD algorithm for two reasons: 1. when a PAD algorithm is developed before the launch, realistic sensor data are not available, and 2. reference attitude data are necessary for the performance verification of a PAD algorithm. A realistic attitude dynamics and sensor (IRU and star tracker) outputs simulation considering their physical characteristics are presented in this paper, which is planned to be used for a PAD algorithm development, test and performance verification.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2001년도 춘계학술대회논문집C
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• pp.281-286
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• 2001

Tilting pad journal bearings have been widely used in a high speed rotating machinery, such as steam turbines and gas turbines, owing to their inherent stability characteristics. However, some peculiar fatigue failure in the babbitt metal due to spragging has been continuously occurred at the leading edge of the upper pads. The spragging is defined as the pad vibration initiated on the upper unloaded pads in a tilting pad journal bearing. This paper describes both several kinds of bearing failure related with spragging and the theoretical investigation on the prevention of the spragging phenomenon using the variation of preload. Results show that positive preload(m>0.5) assures all pads remain statically loaded under all operating conditions. For the change of design parameter to prevent spragging, thermo-hydrodynamic lubrication and rotor dynamic analysis were performed to verify temperature limitation on bearing and vibration problems on rotor bearing system.

• 동의생리병리학회지
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• 제18권4호
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• pp.1014-1020
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• 2004

The study was designed to investigate the effects of Palmul-Tang(PMT) on the change of cerebral hemodynamics [regional cerebral blood flow(rCBF), pial arterial diameter(PAD) and mean arterial blood pressure(MABP)] in normal and cerebral ischemic rats. The change of rCBF and MABP were determinated by laser-doppler flowmetry(LDF), and the change of PAD was determinated by video-microscopy. The results in normal rats were as follows ; PMT significantly increased rCBF and PAD in a dose-dependent, and PMT increased MABP in a dose-dependent. This results were suggested that PMT significantly increased rCBF by dilating PAD. The results in cerebral ischemic rats were as follows ; Both rCBF and PAD were significantly and stably increased by PMT(10㎎/㎏, i.p.) during the period of cerebral reperfusion, which contrasted with the findings of rapid and marked increase in control group. The present authors thought that PMT had an anti-ischemic effect through the improvement of cerebral hemodynamics.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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• pp.300-301
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• 2006

We studied about new module technology to solve warpage problems that produce bending of cell in the LCD (Liquid crystal display). Characteristics of cell gap and glass bending of applying heat Panel's PAD part and cell at various temperature was investigated. When applies heat and compresses PAD party only in case of compressing COG(Chip on Glass), uniformity of cell gap that happen by glass bending by temperature of these compressing COG In the PAD party is decreased. However, in case of compress COG. glass bending of applying heat Panel's PAD part and cell at various temperature produced 20um. But, uniformity of cell gap was not decreased. Therefore, it is considered that applying heat Panel's PAD part and cell could decrease uniformity of cell gap and bending of glass.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2001년도 춘계학술대회 논문집
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• pp.1117-1120
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• 2001

Chemical mechanical planarization(CMP) has emerged as the planarization technique of choice in both front-end and back-end integrated circuit manufacturing. Conventional CMP process utilize a polyurethane polishing pad and liquid chemical slurry containing abrasive particles. There have been serious problems in CMP in terms of repeatability and defects in patterned wafers. Since IBM's official announcement on Copper Dual Damascene(Cu2D) technology, the semiconductor world has been engaged in a Cu2D race. Today, even after~3years of extensive R&D work, the End-of-Line(EOL) yields are still too low to allow the transition of technology to manufacturing. One of the reasons behind this is the myriad of defects associated with Cu technology. Especially, dishing and erosion defects increase the resistance because they decrease the interconnection section area, and ultimately reduce the lifetime of the semiconductor. Methods to reduce dishing & erosion have recently been interface hardness of the pad, optimization of the pattern structure as dummy patterns. Dishing & erosion are initially generated an uneven pressure distribution in the materials. These defects are accelerated by free abrasive and chemical etching. Therefore, it is known that dishing & erosion can be reduced by minimizing the abrasive concentration. Minimizing the abrasive concentration by using Ce$O_2$ is the best solution for reducing dishing & erosion and for removal rate. This paper introduce dishing & erosion generating mechanism and a method for developing a semi-rigid abrasive pad to minimize dishing & erosion during CMP.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
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• pp.731-734
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• 2004

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. Polishing pads play a key role in CMP, which has been recognized as a critical step to improve the topography of wafers for semiconductor fabrication. It is investigated the performance of $SiO_2-CMP$ process using commercial silica slurry as a pad conditioning temperature increased after CMP process. This study also showed the change of SEM images in the pore geometry on the CMP pad surface after use with a different pad conditioning temperature.

• 대한전자공학회논문지
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• 제26권5호
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• pp.117-126
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• 1989

본 논문에서는 게이트 어레이 방식의 레이아웃 설계를 위한 새로운 배치 알고리듬을 제안한다. 제안된 배치 알고리듬은 서로 크기가 다른 마크로셀을 처리할 수 있으며, I/Q pad의 위치를 고려함으로써 칩의 내부 영역과 I/Q pad간의 배선을 효율적으로 자동화한다. 알고리듬은 초기 분할, 초기 배치 개선의 3단계로 구성된다. 초기 분할 단계에서는 각 I/Q pad의 위치를 고려하여 clustering에 의해 전체 회로를 5그룹으로 분할한다. 초기 배치 단계에서는 각 I/Q pad 및 주변 그룹과의 연결도를 고려한 clustering/min-cut 분할에 의해 각 셀의 위치를 할당한다. 또한, 배치 개선에서는 확률적 배선 밀도 함수를 도입하여 칩내의 배선 밀도를 균일화하기 위한 셀 이동 알고리듬을 제안한다.

• 한국공작기계학회논문집
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• 제10권4호
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• pp.7-13
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• 2001

This Study is to investigate the influence of weld residual stresses on the fatigue crack growth behaviors in pressure ves-sel reinforcement. In order to perform this study, the automatically welded specimens are prepared. The material is ASTM A516 grade 60 steel used in pressure vessel mainly. For pad-on-plate of skip welding continuous welding and PWHT specimen, fatigue crack initiation is generally initiat-ed at weld starting and end toe zone, and ruptured at weld starting toe zone, Fatigue life if pad-on-plate continuous speci-men is increased more than that of pad-on-plate skip fillet welding specimene about 85% under low load, about 20% under high load, and decreased than that of two-pad continuous welding specimen about 85%. In da/dN-$\Delta$ Κ curve under low load, pad-on-plate skip fillet welding specimen showed retardation on the initial crack, and the fatigue crack growth rate at the low region of $\Delta$Κ greater specimene E(3.8{\times}10^{-6}$mm/cycle). And the fatigue life of welding specimen was smaller than that of PWHT specimen.

• 한국정밀공학회지
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• 제22권8호
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• pp.27-33
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• 2005

Polishing pads play an important role in chemical mechanical polishing(CMP) which has recently been recognized at the most effective method to achieve global planarization. In this paper, we have investigated CMP characteristics as a change of groove density of polishing pads. The parameter $(K_n)$ is proposed to estimate groove density of pad. The $K_n$ is defined as groove area divided by pitch area. As the groove density value increased, removal rate increased to some point and then gradually saturated in case of increasing the groove density excessively. In addition Within wafer non-uniformity(WIWNU) worse as groove density increased excessively, although WIWNU improved as groove density increased. Also the uniformity of temperature of pad surface decreased as the groove density increased. It was because that the cooling effect increased as groove density increased. In other words, increasing the groove density which means the apparent contact area of pad has influence on amount of discharge of slurry during polishing process.