• Journal of Digital Contents Society
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• v.12 no.2
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• pp.225-232
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• 2011

is an innovative creation, accommodating characteristics of various genres and media, ranging from elements of media aesthetics to visual aesthetics and games. Although it takes a form of a book, it exceeds stereotypes seen in paperbacks or eBooks. Because of such differentiated characteristics of this appBook (which is provided in the form of app), it induce users(readers) to conduct interactional activity. This study will mainly discuss about the formation of discourse of app based digital novel in a media aesthetic point of view. Considering the mutual relation between property of media and contents of stories, it is desirable to accommodate the mutuality of understanding between the digital media and formation discourse in creating stories.

• 제어로봇시스템학회:학술대회논문집
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• 2004.08a
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• pp.1966-1971
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• 2004

As the remote sensing satellite technology grows, the acquisition of accurate attitude and position information of the satellite has become more and more important. Due to the data processing limitation of the on-board orbit propagator and attitude determination algorithm, it is required to develop much more accurate orbit and attitude determination, which are so called POD (precision orbit determination) and PAD (precision attitude determination) techniques. The sensor and attitude dynamics simulation takes a great part in developing a PAD algorithm for two reasons: 1. when a PAD algorithm is developed before the launch, realistic sensor data are not available, and 2. reference attitude data are necessary for the performance verification of a PAD algorithm. A realistic attitude dynamics and sensor (IRU and star tracker) outputs simulation considering their physical characteristics are presented in this paper, which is planned to be used for a PAD algorithm development, test and performance verification.

• Proceedings of the KSME Conference
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• 2001.06c
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• pp.281-286
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• 2001

Tilting pad journal bearings have been widely used in a high speed rotating machinery, such as steam turbines and gas turbines, owing to their inherent stability characteristics. However, some peculiar fatigue failure in the babbitt metal due to spragging has been continuously occurred at the leading edge of the upper pads. The spragging is defined as the pad vibration initiated on the upper unloaded pads in a tilting pad journal bearing. This paper describes both several kinds of bearing failure related with spragging and the theoretical investigation on the prevention of the spragging phenomenon using the variation of preload. Results show that positive preload(m>0.5) assures all pads remain statically loaded under all operating conditions. For the change of design parameter to prevent spragging, thermo-hydrodynamic lubrication and rotor dynamic analysis were performed to verify temperature limitation on bearing and vibration problems on rotor bearing system.

• Journal of Physiology & Pathology in Korean Medicine
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• v.18 no.4
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• pp.1014-1020
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• 2004

The study was designed to investigate the effects of Palmul-Tang(PMT) on the change of cerebral hemodynamics [regional cerebral blood flow(rCBF), pial arterial diameter(PAD) and mean arterial blood pressure(MABP)] in normal and cerebral ischemic rats. The change of rCBF and MABP were determinated by laser-doppler flowmetry(LDF), and the change of PAD was determinated by video-microscopy. The results in normal rats were as follows ; PMT significantly increased rCBF and PAD in a dose-dependent, and PMT increased MABP in a dose-dependent. This results were suggested that PMT significantly increased rCBF by dilating PAD. The results in cerebral ischemic rats were as follows ; Both rCBF and PAD were significantly and stably increased by PMT(10㎎/㎏, i.p.) during the period of cerebral reperfusion, which contrasted with the findings of rapid and marked increase in control group. The present authors thought that PMT had an anti-ischemic effect through the improvement of cerebral hemodynamics.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.300-301
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• 2006

We studied about new module technology to solve warpage problems that produce bending of cell in the LCD (Liquid crystal display). Characteristics of cell gap and glass bending of applying heat Panel's PAD part and cell at various temperature was investigated. When applies heat and compresses PAD party only in case of compressing COG(Chip on Glass), uniformity of cell gap that happen by glass bending by temperature of these compressing COG In the PAD party is decreased. However, in case of compress COG. glass bending of applying heat Panel's PAD part and cell at various temperature produced 20um. But, uniformity of cell gap was not decreased. Therefore, it is considered that applying heat Panel's PAD part and cell could decrease uniformity of cell gap and bending of glass.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.1117-1120
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• 2001

Chemical mechanical planarization(CMP) has emerged as the planarization technique of choice in both front-end and back-end integrated circuit manufacturing. Conventional CMP process utilize a polyurethane polishing pad and liquid chemical slurry containing abrasive particles. There have been serious problems in CMP in terms of repeatability and defects in patterned wafers. Since IBM's official announcement on Copper Dual Damascene(Cu2D) technology, the semiconductor world has been engaged in a Cu2D race. Today, even after~3years of extensive R&D work, the End-of-Line(EOL) yields are still too low to allow the transition of technology to manufacturing. One of the reasons behind this is the myriad of defects associated with Cu technology. Especially, dishing and erosion defects increase the resistance because they decrease the interconnection section area, and ultimately reduce the lifetime of the semiconductor. Methods to reduce dishing & erosion have recently been interface hardness of the pad, optimization of the pattern structure as dummy patterns. Dishing & erosion are initially generated an uneven pressure distribution in the materials. These defects are accelerated by free abrasive and chemical etching. Therefore, it is known that dishing & erosion can be reduced by minimizing the abrasive concentration. Minimizing the abrasive concentration by using Ce$O_2$ is the best solution for reducing dishing & erosion and for removal rate. This paper introduce dishing & erosion generating mechanism and a method for developing a semi-rigid abrasive pad to minimize dishing & erosion during CMP.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.731-734
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• 2004

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. Polishing pads play a key role in CMP, which has been recognized as a critical step to improve the topography of wafers for semiconductor fabrication. It is investigated the performance of $SiO_2-CMP$ process using commercial silica slurry as a pad conditioning temperature increased after CMP process. This study also showed the change of SEM images in the pore geometry on the CMP pad surface after use with a different pad conditioning temperature.

• Journal of the Korean Institute of Telematics and Electronics
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• v.26 no.5
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• pp.117-126
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• 1989

In this paper, a new placement algorithm for gate array lay out design is proposed. The proposed algorithm can treat the variable-sized macrocells and by considering the I/Q pad locations, the routing between I/Q pads and the internal region of a chip can be automated effectively. The algorithm is composed of 3 parts. which are initial partitioning, initial placement and placement improvement. In the initial placement phase, a given circuit is partitioned into 5 sub-circuits, by clustering method with considers connectivities of cells not only with I/Q pads but also with related partitioned groups is used repeatedly to assign a unique position to each cell. In the placement improvement phase, the concept of probabilistic wiring density is introduced, and cell moving algorithm is proposed to make the density in a chip even.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.10 no.4
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• pp.7-13
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• 2001

This Study is to investigate the influence of weld residual stresses on the fatigue crack growth behaviors in pressure ves-sel reinforcement. In order to perform this study, the automatically welded specimens are prepared. The material is ASTM A516 grade 60 steel used in pressure vessel mainly. For pad-on-plate of skip welding continuous welding and PWHT specimen, fatigue crack initiation is generally initiat-ed at weld starting and end toe zone, and ruptured at weld starting toe zone, Fatigue life if pad-on-plate continuous speci-men is increased more than that of pad-on-plate skip fillet welding specimene about 85% under low load, about 20% under high load, and decreased than that of two-pad continuous welding specimen about 85%. In da/dN-$\Delta$ Κ curve under low load, pad-on-plate skip fillet welding specimen showed retardation on the initial crack, and the fatigue crack growth rate at the low region of $\Delta$Κ greater specimene E(3.8{\times}10^{-6}$mm/cycle). And the fatigue life of welding specimen was smaller than that of PWHT specimen.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.8 s.173
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• pp.27-33
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• 2005

Polishing pads play an important role in chemical mechanical polishing(CMP) which has recently been recognized at the most effective method to achieve global planarization. In this paper, we have investigated CMP characteristics as a change of groove density of polishing pads. The parameter $(K_n)$ is proposed to estimate groove density of pad. The $K_n$ is defined as groove area divided by pitch area. As the groove density value increased, removal rate increased to some point and then gradually saturated in case of increasing the groove density excessively. In addition Within wafer non-uniformity(WIWNU) worse as groove density increased excessively, although WIWNU improved as groove density increased. Also the uniformity of temperature of pad surface decreased as the groove density increased. It was because that the cooling effect increased as groove density increased. In other words, increasing the groove density which means the apparent contact area of pad has influence on amount of discharge of slurry during polishing process.