• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.10
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• pp.839-845
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• 2007

In this paper, a polishing pad has been analyzed in detail, to understand surface phenomena of polishing process. The polishing pad plays a key role in polishing process and is one of the important layer in polishing process, because it is a reaction layer of polishing[1]. Pad surface physical property is also ruled by pad profile. The profile and roughness of pad is controlled by different types of conditioning tool. Conditioning tool add mechanical force to pad, and make some roughness and profile. Formed pad surface will affect on polishing performance such as RR (Removal Rate) and uniformity in CMP Pad surface condition is changed by conditioning tool and dummy run and is stable at final. And this research, we want to reduce break-in and dummy polishing process by analysis of pad surface and artificial machining to make stable pad surface. The surface treatment or machining enables to control the surface of polishing pad. Therefore, this research intends to verify the effect of the buffing process on pad surface through analysis of the removal rate, friction force and temperature. In this research, urethane polishing pad which is named IC pad(Nitta-Haas Inc.) and has micro pore structure, is studied because, this type of pad is most conventional type.

• Journal of the Korean Society of Industry Convergence
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• v.23 no.6_2
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• pp.1051-1058
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• 2020

The chemical mechanical planarization (CMP) is a process of physically and chemically polishing the semiconductor substrate. The planarization quality of a substrate can be evaluated by the within wafer non-uniformity (WIWNU). In order to improve WIWNU, it is important to manage the pad profile. In this study, a device capable of non-contact measurement of the pad thickness profile was developed. From the measured pad profile, the profile of the pad surface and the groove was extracted using the envelope function, and the pad thickness profile was derived using the difference between each profile. Thickness profiles of various CMP pads were measured using the developed PMS and envelope function. In the case of IC series pads, regardless of the pad wear amount, the envelopes closely follow the pad surface and grooves, making it easy to calculate the pad thickness profile. In the case of the H80 series pad, the pad thickness profile was easy to derive because the pad with a small wear amount did not reveal deep pores on the pad surface. However, the pad with a large wear amount make errors in the lower envelope profile, because there are pores deeper than the grooves. By removing these deep pores through filtering, the pad flatness could be clearly confirmed. Through the developed PMS and the pad thickness profile calculation method using the envelope function, the pad life, the amount of wear and the pad flatness can be easily derived and used for various pad analysis.

• Tribology and Lubricants
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• v.37 no.3
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• pp.99-105
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• 2021

In this study, for a high-pressure turbine (HPT) of 800 MW class supercritical thermal-power plant, considering aerodynamic cross-coupling, we performed a rotordynamic logarithmic decrement (LogDec) stability analysis with various tilting pad journal bearing (TPJB) designs, which several steam turbine OEMs (original equipment manufacturers) currently apply in their supercritical and ultra-supercritical HPTs. We considered the following TPJB designs: 6-Pad load on pad (LOP)/load between pad (LBP), 5-Pad LOP/LBP, Hybrid 3-Pad LOP (lower 3-Pad tilting and upper 1-Pad fixed), and 5-Pad LBPs with the design variables of offset and preload. We used the API Level-I method for a LogDec stability analysis. Following results are summarized only in a standpoint of LogDec stability. The Hybrid 3-Pad LOP TPJBs most excellently outperform all the other TPJBs over nearly a full range of cross-coupled stiffness. In a high range of cross-coupled stiffness, both the 6-Pad LOP and 5-Pad LOP TPJBs may be recommended as a practical conservative bearing design approach for enhancing a rotordynamic stability of the HPT. As expected, in a high range of cross-coupled stiffness, the 6-Pad LBP TPJBs exhibit a better performance than the 5-Pad LBP TPJBs. However, contrary to one's expectation, notably, the 5-Pad LOP TPJBs exhibit a slightly better performance than the 6-Pad LOP TPJBs. Furthermore, we do not recommend any TPJB design efforts of either increasing a pad offset from 0.5 or a pad preload from 0 for the HPT in a standpoint of stability.

• Proceedings of the KSME Conference
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• 2004.11a
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• pp.1016-1021
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• 2004

The need for developing a mathematical model for pad-pivot friction in tilting pad proceeding bearings has been well-recognized, since previous experimental work about the performances of the bearings hypothesized that the friction in the bearings is closely related to their performances. Especially, the sliding friction between pad and pivot in the ball and socket type of the bearings can influence the performance of the bearing. We propose a mathematical model for pad-pivot friction in the ball and socket type, which considers the geometrics of the pad and pivot of the bearings, by assuming the sliding friction in the ball and socket bearing as Coulomb friction. By utilizing the proposed model for pad-pivot friction, we show the analysis of Reynolds equation and energy equation, which explain the thermo-hydrodynamic characteristics of tilting pad proceeding bearings, by taking into account the turbulence and inlet pressure building as well. The results of the study show that the performance of titling-pad proceeding bearings can be greatly influenced by the pad-pivot friction. In particular, we have shown that the analysis of the pad-pivot friction is useful to explain the static proceeding loci and the dynamic characteristics of the ball and socket type of the bearings. Furthermore, for a given operating condition, we can obtain various equilibrium states which satisfy the static equilibrium conditions, by considering the pad-pivot friction.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.5
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• pp.385-389
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• 2003

There are four main components of the CMP process: polishing pad, slurry, elastic supporter, and pad conditioner. The polishing pad is an essential component to the reproducibility of polishing uniformity in CMP process. However, the polishing pad in recently using metal CMP raised the several points of high cost caused by the increase of cycle time and the many usage of slurry. It is necessary to develop the novel polishing pad which would lead the cost reduction by the higher pad life-cycle, minimized cycle time and lower slurry usage. The characteristics of polishing pad were studied on the effects of different sets of the Polishing pad, which can be applied to metal chemical mechanical polishing process for global planarization of multilevel interconnection structure. The main purpose of this experiment is cost reduction by the increase of pad life-time, the decrease of cycle time and the lower usage of slurry through the specific hard porous structured pad design. It is confirmed that the novel polishing pad made the slurry usage decrease to 60% as well as the pad life-time increase twice with the 25% improvement of removal rate. The polishing time could be decreased and it also helped the cycle time to diminish. It can be expected that this results will help both the process throughput and the device yield to be improved.

• 한국HCI학회:학술대회논문집
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• 2009.02a
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• pp.240-244
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• 2009

In this paper, we present FloatingPad, a touch pad based device with better scrolling feature and more interaction styles than a traditional touch pad. When we interact with a real object like a picture or a book, we manipulate on the object, and we also move, rotate, and flip the object. We applied this idea into a touch pad. In FloatingPad, the touch pad is not fixed to the device. It is floating on the device; it can be slid on the device. Therefore a user can have additional degree of freedom of input by shifting and rotating the touch pad while having the traditional touch pad input. By using this technique, the interactivity of the touch pad can be augmented, and better scrolling feature can be provided by reducing clutching occurs on the position scrolling devices by using the movement of the touch pad as rate control. We implemented the prototype device and conducted a user study with three applications developed for FloatingPad.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2003.11a
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• pp.291-297
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• 2003

Fluid film tilting pad journal bearings are widely used for large steam turbines. However, bearing problems by pad fluttering, such as fatigue damage in the upper unloaded pad, the break of locking pins and the wear of pinholes etc., are frequently taken place in the actual steam turbines. The purpose of the present work is to investigate on the mechanism of pad fluttering and the prevention of pad fluttering with the variation of preload(m) in a tilting pad journal bearing. It is estimated that upper pad is easy to flutter because the film shape of upper pad is diverged one from the analysis of moment direction acting on pivot point. Effective preload range in order to be statically loaded pad under all operating conditions is suggested as m＞0.5. Also, as a bearing that can be prevented pad fluttering, design modified bearing is suggested. For the adjustment in actual steam turbines, bearing and rotor dynamic analysis are performed to identify bearing characteristics and to verify the reliability of rotor-bearing system.

• Journal of Fashion Business
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• v.26 no.3
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• pp.72-86
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• 2022

Volume-up pads are the most common and easiest way to make women with small breasts beautiful. In this study, to develop a volume-up brassiere pad with excellent wearing effects and appearance, 24 different types of volume-up pads commercially available in the online market were investigated and then 11 types were purchased. Among these eleven types, four pads (PAD1, PAD2, PAD3, PAD4) with distinct shapes and materials were selected through a pre-test. They were compared to the newly developed pad for research (PAD5). The results of the study follow. The results of evaluating appearance when wearing the developed pad (PAD5) were significantly higher than that of other pads, and the appearance evaluation score for the full-cup type pad was excellent. In the wearing satisfaction evaluation result, PAD5 showed generally excellent evaluation scores, and in the case of the touch, preference for the fabric material was higher than that of the silicon pad. In the evaluation of motion adaptability, the developed PAD5 showed generally excellent evaluation scores in all movements, indicating that the full-cup type pads had better motion adaptability than the partial-type pads.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.51 no.7
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• pp.311-315
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• 2002

Chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD), inter-level dielectric (ILD) layers of multi-layer interconnections. In this paper, we studied the characteristics of polishing pad, which can apply shallow trench isolation (STI)-CMP process for global planarization of multi-level interconnection structure. Also, we investigated the effects of different sets of polishing pad, such as soft and hard pad. As an experimental result, hard pad showed center-fast type, and soft pad showed edge-fast type. Totally, the defect level has shown little difference, however, the counts of scratch was detected less than 2 on JR111 pad. Through the above results, we can select optimum polishing pad, so we can expect the improvements of throughput and device yield.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.12
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• pp.1027-1033
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• 2007

In this research, the polishing pad for W CMP has been analyzed to understand stabilization of polishing performance. For stabilization of process, the polishing pad condition is one of important factors. The polishing pad plays a key role in polishing process, because it contact with reacted surface of wafer[1]. The physical property of pad surface is ruled by conditioning tool which makes roughness and profile of pad surface. Pad surface affects on polishing performance such as RR(Removal Rate) and uniformity in CMP. The stabilized pad surface has stable roughness. And its surface has high level of wettability which can increase the probability of abrasive adhesion on pad. The result of this research is that the reduction of break-in and dummy polishing process were achieved by artificial machining to make stable pad surface. In this research, urethane polishing pad which is named IC pad(Nitta-Haas Inc.) and has micro pore structure, is studied. Because, this type of pad is the most conventional type.