• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.19 no.2
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• pp.61-65
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• 2013

Modified atmosphere (MA) of reduced $O_2$ and elevated $CO_2$ concentrations has been used for keeping the quality of fresh produce and extending the shelf life. As a way to attain the beneficial MA package around the produce, a gas diffusion tube or perforation can be attached onto the container and controlled on real time in its opening/closing responding to $O_2$ and $CO_2$ concentrations measured by gas sensors. The timely-controlled opening of the gas diffusion tube can work in harmony with the produce respiration and help to create the desired MA. By use of the mathematical modeling, the effect of tube dimension on the controlled container atmosphere was figured out in this study. Spinach and king oyster mushroom were used as typical commodities for designing the model container system (0.35 and 0.9 kg in 13 L, respectively) because of their respiration characteristics and the optimal MA condition ($O_2$ 7~10%/$CO_2$ 5~10% for spinach; $O_2$ 2~5%/$CO_2$ 10~15% for mushroom). With a control logic for the gas composition to stay as close as possible to optimum MA window without invading injurious low $O_2$ and/or high $CO_2$ concentrations, the atmosphere of the sensor-controlled container could stay at its lower $O_2$ boundary or upper $CO_2$ limit under certain tube dimensional conditions. There were found to be the ranges of the tube diameter and length allowing the beneficial MA. The desired range of the tube dimension for spinach consisted of combinations of larger diameter and shorter length in the window of 0.3~2 cm diameter and 0.2~10 cm length. Similarly, that for king oyster mushroom was combinations of larger diameter and shorter length in the window of 0.9~2 cm diameter and 0.2~3 cm in length. Clear picture on generally affordable tube dimension range may be formulated by further study on a wide variety of commodity and pack conditions.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.1 s.34
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• pp.65-71
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• 2005

At present, Electronic industries push ahead to eliminate the Pb(Lead) -a hazardous material-from all products. Especially, we have performed to select the optimum standard composition of lead free alloy for the application to products for about 3 years from 2000. These days, we have the chance for applying to the mass-production. This project constructed the system for applying the lead free solders on consumer electronic products, which is one of the major products of the LG Electronics. To select the lead free solders with corresponding to the product features, we have passed through the test and applied with Sn-3.0Ag-0.5Cu alloy system to our products, and for the application to the high melting temperature composition, we secured the thermal resistance of the many parts and substrate and optimized the processing conditions. We have operated the temperature cycling test and the high temperature storage test under the standards to confirm the reliability of the products. On these samples, we considered the consequence of our decision by the operating test. For the long life time of the product, we have operated the temperature cycling test at $-45^{\circ}C\;-\;+125^{\circ}C$, 1 cycle/hour, 1000 cycles. Also we have tested the tin whisker growth about lead free plating on lead finish. We have analyzed with the SEM, EDS and any other equipment for confirming the failure mode at the joint and the tin whisker growth on lead free finish.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.2
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• pp.47-51
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• 2013

Chemical mechanical polishing (CMP) has become one of the key processes in wafer level stacking technology for 3D stacked IC. In this study, two-step CMP process was proposed to polish $Cu/SiO_2$ hybrid bonding surface, that is, Cu CMP was followed by $SiO_2$ CMP to minimize Cu dishing. As a result, Cu dishing was reduced down to $100{\sim}200{\AA}$ after $SiO_2$ CMP and surface roughness was also improved. The bonding interface showed no noticeable dishing or interface line, implying high bonding strength.

• Journal of the Korean Society for Precision Engineering
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• v.30 no.9
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• pp.893-899
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• 2013

Recently, the requirement of automation in the cell production system is increasing due to a decrease of skilled workers who are the key point of a cell production system. This paper proposes a dual-arm robot designed and implemented with consideration of being applied to a cell production line of cellular phone. A specification was derived from the analysis of production process and the consideration of configuration for human-robot cooperation. Design and implementation results of the proposed dual-arm robot were suggested and the feasibility was verified through the demonstration of the proposed robot in some of packaging job of cellular phone.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.3
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• pp.43-47
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• 2018

In this study, we fabricated transparent resistive strain sensor by embedding silver nanowire in polydimethylsiloxane (PDMS) substrate to sense the finger bending motion electrically. Using bluetooth as wireless data transfer system, strain data was transferred to computer and smart phone application enabling near field communication. Additionally, we made a program translating resistance change by finger motion strain to save images and confirmed that it worked at application and computer.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.89-94
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• 2019

Glass base sealant is required as a ceramic-ceramic joining material between α-alumina insulation cap and β-alumina electrolyte tube in the development of NaS battery cell package for electrical energy storage system. The fabrication of glass frit by thermal quenching method, phase analysis, particle size analysis, coefficient of thermal expansion and surface roughness according to the glass compositions were analyzed for the fabrication of glass sealing paste for ceramic-ceramic joining. Also, a new evaluation method of the adhesion strength of glass sealant at the small area in ceramic-ceramic joining component was proposed using conventional Dage bond tester that was used to measure the adhesion of solder ball joint.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.17 no.2
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• pp.33-37
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• 2011

Real time control logic of microbial shelf life of a perishable food, seasoned pork meat has been formulated which exploits monitoring of $CO_2$ concentration of the package. The potential of the proposed logic was examined for storage at dynamic temperature conditions. The start of increase in $CO_2$ production rate from the food or rate of package $CO_2$ concentration change was found to coincide with the point of microbial quality limit and could be used as an index of microbial shelf life determination. This also corresponded to lag time of $CO_2$ concentration change or time for the $CO_2$ concentration to reach a certain value. The application potential of the proposed logic was confirmed for a sensor system to measure on real time and transmit the $CO_2$ concentration wireless to the computer system.

• Journal of the Korean Society of Food Science and Nutrition
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• v.33 no.5
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• pp.917-920
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• 2004

The migration potential of volatile organic solvents widely employed in the printing process of food packaging was investigated by using a closed experimental system, which contained a food sample and a paper sheet spiked with the contaminant solvents. The studied organic compounds included toluene and p,m,o-xylene which are relatively highly volatile. Typical food samples of caramel, beef jerky and butter were selected based on their chemical composition and were assigned to the migration system at 10, 25 and 4$0^{\circ}C$. The equilibrated migration level was very high with almost complete transfer in the butter with high fat, while caramel of high carbohydrate content and beef jerky of high protein showed migration degree of 37∼56% and 37∼77%, respectively. Temperature did significantly influence the migration on beef jerky with higher level at higher temperature. There was no difference in the migration level among the solvents.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.41-45
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• 2018

We have simulated the process induced warpage for panel level package using finite element method. Silicon chips of $5{\times}5mm^2$ were redistributed on $122.4{\times}93.6mm^2$ size panel and the total number of redistributed chips was 221. The warpage at each process step, for example, (1) EMC molding, (2) attachment of detach core, (3) heating, (4) removal of a carrier, and (5) cooling was simulated using ANSYS and the effects of detach core and carrier materials on the warpage were investigated. The warpage behaved complexly depending on the materials for the detach core and carrier. However, glass carrier showed the lower warpage than FR4 carrier regardless of detach core material, and the minimum warpage was observed when the glass was used for the detach core and carrier at the same time.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.4
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• pp.1-10
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• 2020

This paper reviews the recent development of electronic textile technology, mainly focusing on chip-textile bonding. Before the chip-textile bonding, a circuit on the textile should be prepared to supply the electrical power and signal to the chip mounted on the fabrics. Either embroidery with conductive yarn or screen-printing with the conductive paste can be applied to implement the circuit on the fabrics depending on the circuit density and resolution. Next, chip-textile bonding can be performed. There are two choices for chip-textile bonding: fixed connection methods such as soldering, ACF/NCA, embroidery, crimping, and secondly removable connection methods like a hook, magnet, zipper. Following the chip-textile bonding process, the chip on the textile is generally encapsulated using PDMS to ensure reliability like water-proof.