• Title/Summary/Keyword: packaging system

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The Price Sensitivity for Industrial Products from A Group Buying System at School Foodservices : An Application of Price Sensitivity Measurement Technique (PSM 기법을 적용한 학교급식 공동구매 공산품의 가격민감도 분석 연구)

  • Lee, SeoHee;Lee, Hojin;Sohn, ChunYoung;Ham, Sunny
    • Journal of Korea Society of Digital Industry and Information Management
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    • v.16 no.2
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    • pp.117-128
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    • 2020
  • The aim of this study was to examine price sensitivity of industrial products purchased via a group buying system and how industrial products for a group buying system differ from general industrial products, and then identify the major factors in selecting products and the important determinants in purchasing industrial products for school foodservices. The survey was conducted with 250 dietitians (teachers) in Gyeonggi-do Province, who were using industrial products for a group buying system and general industrial products. A paired t-test showed a difference in satisfaction between industrial products for a group buying system and general industrial products by factors, while statistically significant differences were found for red pepper paste, fermented soybean paste and soy sauce in all nine satisfaction factors, including product quality, packaging state, labeling, hygiene, item diversity, specification diversity, price appropriateness and supply. Moreover, analyzing price sensitivity for industrial products for a group buying system, using the PSM method with respect to the issue of high price, showed that the respondents considered that the current unit purchase prices were high for all items investigated. This study suggests that schools would purchase more industrial products for a group buying system, when the pricing of the products are considered with the purchase intention of dietitians (teachers).

Application of Edible Films to Food System Packaging (식품 포장재에 대한 가식성 필름의 응용성에 관한 연구)

  • Chun, Dong-Ho;Park, Jang-Woo
    • KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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    • v.5 no.1
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    • pp.6-12
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    • 1999
  • This study was conducted to investigate the application of edible films to Raymyun soup packaging. The sorption isotherm curve and BET monolayer moisture content of Raymyun soup were estimated as a basic experiment. Also, the mechanical properties, water vapor permeability, and solubility of the films were investigated. Methylcellulose, sodium caseinate, and K-carrageenan films were used as edible films and glycerol and polyethylene glycol(MW 400) were used as plasticizers. In case tensile strength, methylcellulose films was 68.56 MPa and sodium caseinate film was 7.11 MPa. The elongations of sodium caseinate, methylcellulose, and K-carrageenan film were 115.41%, 23.79% and 0.60%, respectively. The water vapor permeabilties values of methylcellulose, sodium caseinate, and K-carrageenan film between 50% and 70% RH were $0.25-0.38ng{\cdot}m/m^2{\cdot}sec{\cdot}Pa,\;0.62-0.84ng{\cdot}m/m^2{\cdot}sec{\cdot}Pa\;and\;0.31-0.55ng{\cdot}m/m^2{\cdot}sec{\cdot}Pa$, respectively. For the solubility of films, sodium caseinate film showed the highest solubility and methylcellulose film showed the lowest solubility.

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Sorption Characteristics of Binary Mixture of Corn Starch- Soy Protein Isolates in Plastic film Packaging (Plastic필름 포장에 따른 옥수수 전분과 분리 대두단백질의 이성분 혼합물의 흡습특성)

  • Kim, Duck-Woong;Woo, Sang-Gyu
    • Journal of the Korean Society of Food Science and Nutrition
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    • v.17 no.3
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    • pp.191-197
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    • 1988
  • Sorption properties of corn starch(CS) and Soy protein isolates(SPI) in plastic films packaging were investigates for binary system. The mixture were sealed in plastic films of low density polyethylene(LDPE), oriented polypropylene(OPP) and LDPE/OPP coated film and packaging effect on the changes of moisture sorption during storage at $40^{\circ}C$ were studied. The following results were obtained. The water vapor permeability of material films was $32.6g/m^2/24hrs(below\;g)$ for 0.02mm LDPE film, 14.01g for 0.04mm LDPE film, 7.30g for 0.02mm OPP film, 3.37g for 0.04mm OPP film and 4.869 for 0.02mm LDPE/0.02 mm OPP confine film at $40^{\cire}C$ 90%RH, therefore the OPP film was more effective than LDPE film on the resistance of relative humidity. And the OPP film packaging sealed mixture of food samples was also more elective then LDPE film, having same thickness for increase of water vapor permeability during storage at $40^{\cire}C$. A general increase in sorption rate was found more in SPI than CS in the packaged mixtures.

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Environmental Impact Assessment of EPS Box for Fresh Food in Korea and Europe (한국과 유럽의 신선식품용 EPS박스에 대한 전과정 환경영향평가)

  • SY, Kim;CHAROENSRI, KORAKOT;YJ, Shin;HJ, Park
    • KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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    • v.28 no.3
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    • pp.201-210
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    • 2022
  • Expanded polystyrene (EPS) is the most commonly used fresh food refrigeration insulation in Korea and Europe. Moreover, as the use of disposable packaging materials has increased significantly along with non-face-to-face delivery services since the COVID-19 crisis, social issues related to waste disposal are also being raised. Therefore, in this study, the life cycle of EPS boxes for fresh food is focused on the factors that have a large difference between incineration and landfill including recycling in Europe and Korea in the disposal process after use, and raw materials and energy in the manufacturing process, which account for a large portion of the environmental impact value. We tried to compare the environmental impact of evaluation. Overall, the raw material production stage, box manufacturing stage, and packaging stage have similar processes in Europe and Korea, but unlike Europe, Korea, which lacks landfills and incineration facilities, has focused on expanding the recycling rate. It was necessary to do an environmental impact assessment. Data affecting the environment were derived based on 2019 and 2020 data for Korea and 2017 and 2020 data for Europe. In order to predict the future environmental impact assessment, assumptions about the disposal rate in 2025 and 2030 were introduced and evaluated. As a result of this study, it was found that the raw material production stage of EPS boxes, which have similar processes in both Korea and Europe, has the greatest effect on the global warming effect of Korean EPS boxes. However, Korea, which has a relatively high recycling rate in the disposal process compared to incineration and landfill, showed better environmental performance than Europe in most impact indicators except freshwater eutrophication. In particular, Korea has increased the overall recycling rate compared to Europe by replacing various recyclable materials such as building materials and sundries with XPS (extruded polystyrene) recycled materials. In conclusion, it was found that increasing the recycling rate rather than incinerating and landfilling EPS boxes for fresh food in the domestic EPS industry has relatively less environmental load compared to Europe.

Development of Energy Harvesting Hybrid system consisted of Electrochromic Device and Dye-Sensitized Solar Cell using Nano Particle Deposition System (나노 입자 적층 시스템(NPDS)을 이용한 염료 감응 태양전지 - 전기 변색 통합 소자 및 에너지 하베스팅 시스템에 대한 연구)

  • Kim, Kwangmin;Kim, Hyungsub;Choi, Dahyun;Lee, Minji;Park, Yunchan;Chu, Wonshik;Chun, Dooman;Lee, Caroline Sunyong
    • Journal of the Microelectronics and Packaging Society
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    • v.23 no.2
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    • pp.65-71
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    • 2016
  • In this study, Antimony Tin Oxide (ATO) ion storage layer and $TiO_2$ working electrode were fabricated using Nano Particle Deposition System. NPDS is the cutting-edge technology among the dry deposition methods. Accelerated particles are deposited on the substrate through the nozzle using NPDS. The thicknesses for coated layers were measured and layer's morphology was acquired using SEM. The fabricated electrochromic cell's transmittance was measured using UV-Visible spectrometer and power source at 630 nm. As a result, the integrated electrochromic/DSSC hybrid system was successfully fabricated as an energy harvesting system. The fabricated electrochromic cell was self-operated using DSSC as a power source. In conclusion, the electrochromic cell was operated for 500 cycles, with 49% of maximum transmittance change. Also the photovoltaic efficiency for DSSC was measured to be 2.55% while the electrochromic cell on the integrated system had resulted in 26% of maximum transmittance change.

Characteristic Comparison of Brushless Motor Type for EPS System (전동식 조향장치용 영구자석형 브러시리스 모터의 타입별 특성 비교)

  • Lee, Min-Hwan;Kim, Il-Yong;Lee, Choong-Sung
    • Transactions of the Korean Society of Automotive Engineers
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    • v.20 no.1
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    • pp.53-60
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    • 2012
  • As enforced by the regulation on the improving fuel efficiency and increased the demand on green technology, many interests are focused on electric vehicles and hybrid vehicles. Thus the technology development in electrification of vehicle operation system, including steering and braking field, is actively progressive. Especially electric power steering substitutes for hydraulic power steering rapidly in the market, which is more complex and bigger in packaging volume compared with electric power steering system. The core component in electric power steering system is a motor, which is required to be silent and powerful to guarantee required system performance. Brushless synchronous motors are widely used and many variations of the motors are introduced in the market, while the performance of each type is not well defined or studied for electric power steering system. In this paper, recent developments in brushless synchronous motor are reviewed and compared applying finite element analysis in electromagnetic field. As results, each characteristic of different types of brushless synchronous motors is compared and summarized for optimized selection in electric power steering system.

Reliability Assessment of Low-Power Processor Packages for Supercomputers (슈퍼컴퓨터에 사용되는 저전력 프로세서 패키지의 신뢰성 평가)

  • Park, Ju-Young;Kwon, Daeil;Nam, Dukyun
    • Journal of the Microelectronics and Packaging Society
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    • v.23 no.2
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    • pp.37-42
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    • 2016
  • While datacenter operation cost increases with electricity price rise, many researchers study low-power processor based supercomputers to reduce power consumption of datacenters. Reliability of low-power processors for supercomputers can be of concern since the reliability of many low-power processors are assessed based on mobile use conditions. This paper assessed the reliability of low-power processor packages based on supercomputer use conditions. Temperature cycling was determined as a critical failure cause of low-power processor packages through literature surveys and failure mode, effect and criticality analysis. The package temperature was measured at multiple processor load conditions to examine the relationship between processor load and package temperature. A physics-of-failure reliability model associated with temperature cycling predicted the expected lifetime of low-power processors to be less than 3 years. Recommendations to improve the lifetime of low-power processors were presented based on the experimental results.

Preparation and Characterization of Bi based frit for Ag Electrode in PDP Application (PDP용 Ag전극 페이스트의 Bi계 프릿 제조 및 특성)

  • 김형수;최정철;이병옥;최승철
    • Journal of the Microelectronics and Packaging Society
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    • v.10 no.4
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    • pp.47-52
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    • 2003
  • A new type of Bi based glass frit was developed for Ag paste in PDP applications and its properties are compared with the commercially used Pb based glass frit. After optimization of the properties of Bi based frits for PDP application such as the softening temperature and the coefficient of thermal expansion (C.T.E), the screen printed electrodes prepared with the Bi based fit contained Ag paste were characterized. In $Bi_2O_3-B_2O_3-Al_2O_3$ glass system with the more than 50% of $Bi_2O_3$, the softening temperature, the thermal expansion coefficient and the line resistivity was 400∼$480^{\circ}C$, 7.31∼$10.02\times 10^{-6}/^{\circ}C$> and 4.1∼4.8$\Omega$ respectively. Properties of the Bi based frits are comparable with the Pb based frits. A printability and an uniformity of the Bi based frits were excellent in screen printed Ag eletrode. The Bi based frit system is an excellent candidate material for Pb free and Alkali free frit in PDP applications.

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Cu Thickness Effects on Bonding Characteristics in Cu-Cu Direct Bonds (Cu 두께에 따른 Cu-Cu 열 압착 웨이퍼 접합부의 접합 특성 평가)

  • Kim, Jae-Won;Jeong, Myeong-Hyeok;Carmak, Erkan;Kim, Bioh;Matthias, Thorsten;Lee, Hak-Joo;Hyun, Seung-Min;Park, Young-Bae
    • Journal of the Microelectronics and Packaging Society
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    • v.17 no.4
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    • pp.61-66
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    • 2010
  • Cu-Cu thermo-compression bonding process was successfully developed as functions of the deposited Cu thickness and $Ar+H_2$ forming gas annealing conditions before and after bonding step in order to find the low temperature bonding conditions of 3-D integrated technology where the interfacial toughness was measured by 4-point bending test. Pre-annealing with $Ar+H_2$ gas at $300^{\circ}C$ is effective to achieve enough interfacial adhesion energy irrespective of Cu film thickness. Successful Cu-Cu bonding process achieved in this study results in delamination at $Ta/SiO_2$ interface rather than Cu/Cu interface.

Wideband Characterization of Double Bondwires Ribbon for Millimeter-Wave Packaging (밀리미터파 대역 패키징을 위한 이중 본드와이어와 리본의 광대역 특성)

  • Kim, Jin-Yang;Chang, Dong-Pil;Yom, In-Bok;Lee, Hai-Young
    • Journal of the Institute of Electronics Engineers of Korea TC
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    • v.38 no.7
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    • pp.7-13
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    • 2001
  • The wirebonding is a common interconnection technique for modern microwave devices because of rather simple and reliable processes involved. At millimeter-wave frequencies, however, the bondwire parasitics are significant and consequently limit the external performance of packaged devices. In this paper, we represent wideband characterization of multiple bondwires and ribbon in a frequency range from 20 to 35 GHz. From these results, the double bondwire shows very small insertion loss less than 0.55 dB up to 35 GHz and its performance is comparable to that of the ribbon in the millimeter-wave frequencies. Therefore, the wirebonding is very suitable for millimeter wave packaging in terms of performance and manufacturing cost.

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