Journal of the Institute of Electronics Engineers of Korea TC (대한전자공학회논문지TC)

The Institute of Electronics and Information Engineers (대한전자공학회)
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Wideband Characterization of Double Bondwires Ribbon for Millimeter-Wave Packaging

밀리미터파 대역 패키징을 위한 이중 본드와이어와 리본의 광대역 특성

  • Kim, Jin-Yang (Department of Electronics Engineering, Ajou University) ;
  • Chang, Dong-Pil (Satellite Communication System Dept., Electronics and Telecommunication Research Institute) ;
  • Yom, In-Bok (Satellite Communication System Dept., Electronics and Telecommunication Research Institute) ;
  • Lee, Hai-Young (Department of Electronics Engineering, Ajou University)
  • 김진양 (아주대학교 전자공학부) ;
  • 장동필 (한국전자통신연구원 위성 RF 부품 연구팀) ;
  • 염인복 (한국전자통신연구원 위성 RF 부품 연구팀) ;
  • 이해영 (아주대학교 전자공학부)
  • Published : 2001.07.25
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Abstract

The wirebonding is a common interconnection technique for modern microwave devices because of rather simple and reliable processes involved. At millimeter-wave frequencies, however, the bondwire parasitics are significant and consequently limit the external performance of packaged devices. In this paper, we represent wideband characterization of multiple bondwires and ribbon in a frequency range from 20 to 35 GHz. From these results, the double bondwire shows very small insertion loss less than 0.55 dB up to 35 GHz and its performance is comparable to that of the ribbon in the millimeter-wave frequencies. Therefore, the wirebonding is very suitable for millimeter wave packaging in terms of performance and manufacturing cost.

와이어본딩 기법은 공정이 쉽고 신뢰성이 우수하기 때문에 현재의 초고주파 회로 제작에 가장 일반적으로 사용되는 접속선 기술이다. 그러나, 밀리미터파 대역의 높은 주파수에서는 본드와이어에 의한 기생특성이 크게 증가하며, 이러한 기생특성은 시스템 전체의 성능에 큰 제한을 가져온다. 본 논문에서는 $20{\sim}35$ GHz의 광대역에서 본드와이어의 전송특성을 해석하고 측정하였으며, 그 견과를 리본의 특성과 비교하였다. 측정 및 비교 결과 이중 본드와이어 구조를 사용함으로써 35 GHz 까지 0.55 dB 이내의 작은 삽입 손실특성을 얻을 수 있었으며, 측정 주파수 전 대역에 걸쳐 리본과 거의 같은 특성을 나타내었다. 따라서 다중 와이어본딩 기법이 성능과 공정 측면에서 리본보다 밀리미터파 대역용 패키징에 더욱 적합함을 확인하였다.

Keywords

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