• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.22 no.3
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• pp.79-84
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• 2016

A kimchi container actively controlling $CO_2$ concentration by timely flushing of $CO_2$ gas was structured and tested in its capability and effectiveness because high $CO_2$ concentration enhances the sensory flavor of the product. The inlet and outlet valves of $CO_2$ gas were programmed to open and close allowing synchronous vent/$CO_2$ flush according to the requirements of its dissolution in the contained kimchi. During the chilled storage, the headspace of container could be maintained at desired high $CO_2$ concentration providing the preferred kimchi in sensory quality compared to control of the conventional container. However, there was no significant difference between the high $CO_2$ container and control (container simply closed with air) in kimchi quality attributes of pH, titratable acidity, total viable bacterial count, Lactobacillus sp. count and Leuconostoc sp. count. The flow rate and time interval of $CO_2$ flushing need to be adjusted considering the kimchi amount, headspace volume and ripening time. The designed system has potential to be applied in refrigerator appliances in homes and food service industry.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.48 no.3
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• pp.66-72
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• 2016

The applicability of rice husk fiber as a raw material for eco-friendly pulp mold was evaluated in this study. The higher demand of environmental friendly packaging material resulted in the more interest for the natural fiber based pulp mold. The rice husk which is an abundant agricultural byproduct in Asia could be defiberized by an alkaline digestion process. The changes in the pulp mold making process and the properties of pulp mold by the addition of the rice husk were investigated. The addition of rice husk fiber to the pulp mold made with OCC or UBKP resulted in the increase in drainage at the pulp mold forming process. In case of UBKP pulp mold, the addition of rice husk fiber increased the drying efficiency after pulp mold forming since the structure of pulp mold became more bulkier by the addition of the rice husk fiber. Those results showed the rice husk fiber could be applied to the pulp mold manufacturing as one of the eco-friendly natural fiber resources.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.2 s.31
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• pp.43-47
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• 2004

A coupler or divider is a microwave passive component used for power coupling or dividing. Regarding the trend of current telecommunication systems monolithic integration of passive components is highly desirable. In this study by the LTCC(Low temperature co-fired ceramics) technology a 2012 size type dual band coupler with multi-layer structure was fabricated. To achieve the desired coupling values for both DCS and EGSM bands, broad side coupled patterns were used with multi-layer structure. Its characteristics such as coupling, insertion loss, isolation and directivity values were measured and compared with simulation results.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.2
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• pp.11-15
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• 2011

Heat transfer equation is first reviewed and then governing equation of moisture diffusion. Analogy scheme is applied to analysis the moisture absorption problem of polymers. It make possible to numerically analyze the diffusion problem for single medium by using commercial finite element code if it is under the isothermal loading condition. It is extended to special multimaterial system by introducing pressure ratio function, whose moisture characteristics of materials are proportional to temperature only. The weight changes of silicon-nonconductive-polymer joint model due to moisture absorption is measured and been very close to the numerical results as for single media with boundary condition with zero concentration, but yields numerical errors as for multisystem media.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.3
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• pp.1-6
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• 2014

The demand for fine-pitch devices is increasing due to an increase in I/O pin count, a reduction in power consumption, and a miniaturization of chip and package. In addition non-scalability of Cu pillar/Sn cap or Pb-free solder structure for fine-pitch interconnection leads to the development of bumpless interconnection system. Few bumpless interconnect systems such as BBUL technology, SAB technology, SAM technology, Cu-toCu thermocompression technology, and WOW's bumpless technology using an adhesive have been reviewed in this paper: The key requirements for Cu bumpless technology are the planarization, contamination-free surface, and surface activation.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.35 no.2
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• pp.33-38
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• 2003

In order to design the high strength corrugated fiberboard containers for agricultural products that can be used for the cold chain system, a large number of individual boxes were placed in various humidity environments at two different temperature of 5 and $20^{\circ}C$. The results indicated that temperature changes do not effect on physical strength of corrugated fiberboard containers as much as humidity changes did. The main conclusion from this study was that compression strength of corrugated fiberboard containers dropped significantly at high humidity condition, but the rates varied depending on the number of walls, temperature, and perimeter of containers. The packaging designer must consider the corrugated fiberboard boxes are also greatly affected by dimensional variations such as the length versus width ratio. Based on this study, water-resistant board would not be necessary if the ambient relative humidity does not reach to a critical point, 85 percent in the cold chain system. However, the designer must count for the unexpected fluctuation of rotative humidity resulting in severe loss of the compression strength of corrugated fiberboard container.

• Korean Journal of Community Nutrition
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• v.6 no.5
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• pp.837-847
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• 2001

The main purposes of this study were to survey and assess the current situation surrounding solid waste generation in school foodservices, to identify and evaluate the measures(reduction and recycling programs) taken by the foodservices for waste disposal, and to suggest appropriate reform measures to improve the current status, especially in terms of environmental preservation. Questionnaires on solid waste management practices were mailed to 206 school foodservice dietitians in the Kyungbuk region : a 64.0%(N = 130) response rate was obtained. While there are food waste and packaging waste generated from the foodservice operations, about a third(34.1%) of the foodservice operations were responsible for the disposal of both the food wastes and packaging wastes. About 90% of school foodservice managers were responsible for managing solid wastes. The primary recycling methods of leftovers generated from the school food service operations were livestock feed(76.0%). About 60.0% of school foodservice managers conducted the food waste reduction program. The performance by the foodservice managers in reducing the food waste was not satisfactory in several fields, such as developing environmentally friendly menus or abiding by the standard recipe, etc. In addition, the government assistance system was not properly working in the food service management. In conclusion, we should focus on increasing the performance in reducing the food waste by the foodservice managers, strengthening and facilitating the government assistance system for the food waste management and to develop education methods and education materials for food waste management.

• Journal of the Optical Society of Korea
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• v.13 no.4
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• pp.434-438
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• 2009

In this paper, a 12.5-Gb/s optical transmitter is implemented using 0.13-${\mu}m$ CMOS technology. The optical transmitter that we constructed compensates temperature effects of VCSEL (Vertical cavity surface emitting laser) using auto-power control (APC) and auto-modulation control (AMC). An external monitoring photodiode (MPD) detects optical power and modulation. The proposed APC and AMC demonstrate 5$\sim$20-mA of bias-current control and 5$\sim$20-mA of modulation-current control, respectively. To enhance the bandwidth of the optical transmitter, an active feedback amplifier with negative capacitance compensation is exploited. The whole chip consumes only 140.4-mW of DC power at a single 1.8-V supply under the maximum modulation and bias currents, and occupies the area of 1280-${\mu}m$ by 330-${\mu}m$ excluding bonding pads.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2004.05a
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• pp.70-73
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• 2004

The packaging of the integrated circuits requires knowledge of ceramics and metals to accommodate the fabrication of modules that are used to construct subsystems and entire systems from extremely small components. Composite ceramics (Al$_2$O$_3$-SiO$_2$) were tested for substrates. A stress analysis was conducted for a linear work-hardening metal cylinder embedded in an infinite ceramic matrix. The bond between the metal and ceramic was established at high temperature and stresses developed during cooling to room temperature. The calculations showed that the stresses depend on the mismatch in thermal expansion, the elastic properties, and the yield strength and work hardening rate of the metal. Experimental measurements of the surface stresses have also been made on a Cu/Al$_2$O$_3$-SiO$_2$ceramic system, using an indentation technique. A comparison revealed that the calculated stresses were appreciably larger than the measured surface stresses, indicating an important difference between the bulk and surface residual stresses. However, it was also shown that porosity in the metal could plastically expand and permit substantial dilatational relaxation of the residual stresses. Conversely it was noted that pore clusters were capable of initiating ductile rupture, by means of a plastic instability, in the presence of appreciable tri-axiality. The role of ceramics for packaging of microelectronics will continue to be extremely challenging.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.11a
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• pp.308-312
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• 2003

The packaging of the integrated circuits requires knowledge of ceramics and metals to accommodate the fabrication of modules that are used to construct subsystems and entire systems from extremely small components. Composite ceramics ($Al_2O_3-SiO_2$) were tested for substrates. A stress analysis was conducted for a linear work-hardening metal cylinder embedded in an infinite ceramic matrix. The bond between the metal and ceramic was established at high temperature and stresses developed during cooling to room temperature. The calculations showed that the stresses depend on the mismatch in thermal expansion, the elastic properties, and the yield strength and work hardening rate of the metal. Experimental measurements of the surface stresses have also been made on a $Cu/Al_2O_3-SiO_2$ ceramic system, using an indentation technique. A comparison revealed that the calculated stresses were appreciably larger than the measured surface stresses, indicating an important difference between the bulk and surface residual stresses. However, it was also shown that porosity in the metal could plastically expand and permit substantial dilatational relaxation of the residual stresses. Conversely it was noted that pore clusters were capable of initiating ductile rupture, by means of a plastic instability, in the presence of appreciable tri-axiality. The role of ceramics for packaging of microelectronics will continue to be extremely challenging.