• Proceedings of the Korean Society of Precision Engineering Conference
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• 1995.10a
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• pp.859-863
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• 1995

Presented in the paper are a review of sorting and buffering system(SBS), the design procedure of a SBS and an analytical model for the initial alternative generation. SBS is an automated material handling system in which incoming items of different part types are automatically sorted and buffered so that the processing machines can process the part in lots. SBSs play a key role in modern manufacturing systems ans are widely found in mass fabrication lines, packaging and palletizing, and disribution centers.

• Proceedings of the Korean Institute of Communication Sciences Conference
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• 2004.11a
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• pp.319-319
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• 2004

• Journal of electromagnetic engineering and science
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• v.12 no.2
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• pp.176-184
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• 2012

In this paper, the effects of a metal plane on the performance of a meandered slot RFID antenna are evaluated in a real environment, and 3 metal plane cases are considered (the most likely scenarios in which metal conductive materials are placed near the tag antenna). The metal plane effects can be categorized as matching degradation and antenna gain variation. First, matching degradation due to the antenna's induced mutual impedance is experimentally investigated. In addition, the gain variation is investigated to figure out the change in the radiation characteristics. With the derived antenna parameters, the read range is calculated with the Friis transmission equation and measured to analyze the effects of a metal plane on RFID system performance. The calculated and measured read range varies from 9.3 m to 19.1 m as the distance between the RFID antenna and the metal plane changes.

• Journal of the Semiconductor & Display Technology
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• v.18 no.1
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• pp.65-69
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• 2019

The cure properties of ethoxysilyl diglycidyl isocyanurate(Ethoxysilyl-DGIC) and ethylsilyl diglycidyl isocyanurate (Ethylsilyl-DGIC) epoxy resin systems with a phenol novolac hardener were investigated for anticipating fan out-wafer level package(FO-WLP) applications, comparing with ethoxysilyl diglycidyl ether of bisphenol-A(Ethoxysilyl-DGEBA) epoxy resin systems. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The isocyanurate type epoxy resin systems represented the higher cure conversion rates comparing with bisphenol-A type epoxy resin systems. The Ethoxysilyl-DGIC epoxy resin system showed the highest cure conversion rates than Ethylsilyl-DGIC and Ethoxysilyl-DGEBA epoxy resin systems. It can be figured out by kinetic parameter analysis that the highest conversion rates of Ethoxysilyl-DGIC epoxy resin system are caused by higher collision frequency factor. However, the cure conversion rate increases of the Ethylsilyl-DGEBA comparing with Ethoxysilyl-DGEBA are due to the lower activation energy of Ethylsilyl-DGIC. These higher cure conversion rates in the isocyanurate type epoxy resin systems could be explained by the improvements of reaction molecule movements according to the compact structure of isocyanurate epoxy resin.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.27-33
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• 2010

We have successfully demonstrated a high-pin-count and thin embedded-LSI package to realize next generation's mobile terminals. The following three design key points were applied: (i) Using Cu posts, (ii) Using the coreless structure, (iii) Using a Cu plate as the ground plane. In order to quantitatively determine the contribution of the three points, the five-stage process for reducing the number of metal layers is described by means of the electrical simulation. The point-(i) and (ii) are effective from the viewpoint of the power integrity (PI); that is, these points play important roles in reducing the number of metal layers, and especially the point-(ii) contributes at least twice as the point-(i). The point-(iii) is not effective in the PI, but has a few effects on the signal integrity (SI). For reducing the number of metal layers, we should, at first, pay attention whether the PI characteristics fulfill the specification, and then we should confirm the SI characteristics.

• Korean Journal of Microbiology
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• v.42 no.1
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• pp.62-66
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• 2006

To study the packaging mechanism of the bacteriophage P2-P4 system which is a useful experimental tool for the study of viral capsid assembly, we analyzed the DNA contents of P4 sid- mutant, P4 ash8 sid71's phage particles. Two kind of particles having different density were separated by the CsCl buoyant equilibrium density gradient experiment with fresh made stock of P4 ash8 sid71. The DNA from each particles was prepared and its conformations was analyzed by electrophoresis. Unexpectedly, both particles contain not only dimeric and trimeric but also monomeric P4 DNA.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.21 no.1
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• pp.41-47
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• 2015

The objective of this study was to evaluate quality properties including acid value (AV) and peroxide value (POV) of brown rice packaged with antioxidant allyl mercaptan sachet or oxygen scavenging sachet. To prepare the antioxidant allyl mercaptan sachet, allyl mercaptan was encapsulated by rice flour and put in small roll paper pouch. The oxygen scavenging sachet consists of diatomite, sodium L-ascorbate and activated carbon. The results of this study showed that antioxidant allyl mercaptan sachet had no antioxidant effect on deterioration of brown rice, but oxygen scavenging sachet effectively inhibited rancidity of brown rice. Therefore, the developed oxygen scavenging sachet can be effectively utilized in food packaging system for quality stability.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.3
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• pp.19-24
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• 2001

The lead frame, which is principal material used in semiconductor packaging, is required to be microscopic in leads and pitches to cope with miniaturization, thin film, large scale integrated. In addition, it is indispensable to eliminate residual stress and burrs occurring at manufacturing lead frames This thesis applied electrolytic abrasion in order to remove burrs and residual stress created during the stamp process. Electrolytic abrasion removed the burrs on the surface of lead frame. Removal of residual stress highly depends on the types of electrolyte solution. In case of perchloric system, electrolytic abrasion removed 23% of residual stress. Through removal of burrs and reducing residual stress, the reliability of lead frame was substantially improved.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.4
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• pp.55-59
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• 1999

One of lead free glass, Bi based solder glass is investigated for electronic packaging application. The melting temperature of glass about $550^{\circ}C$ at Bi based glass (70wt% $B_2O_3$ + l5wt%$B_2O_3$ + 8wt% $SiO_2$ + 2wt% $P_2O_5$ + 4wt% $A1_2O_3$ +lwt% ZnO) and varied with $P_2O_5$ content in this system. Crystallized glasses were obtainded after 1hr heat teratment at $450^{\circ}C$ with 10wt% of $P_2O_5$ addition. Much higher melting temperature was observed at $B_2O_3$ rich composition area.

• The monthly packaging world
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• s.240
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• pp.42-61
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• 2013

물류 표준화의 핵심은 수송, 보관, 포장, 상/하역, 정보/보안의 물류활동간의 호환성과 연계성의 확보이다. 국제표준 채택을 의무화하고 있는 WTO/TBT 협정을 차치하더라도 물류표준화의 정도는 국가의 물류경쟁력을 결정짓는 가장 중요한 척도라고 할 수 있다. 특히 한 중 일 3국의 경우 교역랑만 5조 3,236억불로 전 세계 교역량의 17.6%(2010년 기준), GDP 합계 12조3443억 달러로(2010년 기준) 세계전체 GDP 62조 9093억 달러 중 19.6%, 해운물동량은 전 세계 물동량의 60% 이상을 차지하고 있는 상황에서 물류경쟁력은 곧 국가경쟁력으로 보아도 무방하다. 아직도 국내에서는 물류분야 간 연계와 첨단정보기술이 결합된 현장중심의 융 복합 표준이 미비하고 대부분의 경우 해외국가들이 자신들의 입장대로 추진하거나 선점한 표준을 따라가기 바쁜 실정이었다. 스마트물류표준화는 이러한 현실에서 탈피하여 글로벌 물류표준을 선도하고 국내 현실에 적합한 현장물류표준을 반영하자는 취지에서 출발한다. 스마트물류는 i-ULS(Intelligent-Unified Logistics System) 체계, 즉 IT와 각 물류기술을 융합하여 표준화시키는 것은 물론 기존 표준을 산업현실에 맞게 반영해 나가는 것이 국가표준코디네이터로서의 주요한 목표가 되고 있다. 본 고는 전년도 스마트물류 표준화로드업에 작성된 표준화기술 중 산업체 설문을 통하여 10대 주요 표준화 트렌드를 선정하여 정리한 것이다. 10대 표준화 기술로는 순환물류포장시스템, 실시간 위치추적기술, 스마트컨테이너(Smart Freight Containers), 해상용 컨테이너 모니터링 시스템(CTMS), 글로벌 포장 표준모듈, 친환경물류 표준지표, 스마트물류 포장용기, 스마트그린물류센터(Passive Warehouse), 모바일 RFID 물류 적용 기술, Modal Shift(전환교통) 등이 선정되었다. 이번 4월호 특집에서는 10대 표준화 전략트렌드 가운데, 스마트물류에 대해 알아보도록 한다.