• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.75-80
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• 2013

According to advance of electronic packaging technology, electronic package becomes smaller. Miniaturization of package causes the temperature rise of package. This can degrade life of electronic device and generate the failure of electronic system. In this study, we proposed a new semi-embedded structure with micro pattern for maximizing heat dissipation. A proposed structure showed the characteristics which have maximum temperature lower than $20^{\circ}C$ compared with conventional structure. And also, in view of thermal stress and strain, our structure showed a remarkably low value compared with other ones. We expect that the new structure proposed in this work can be applied to an flip-chip package of the future.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.11a
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• pp.195-198
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• 2002

현재의 광통신, 이동통신 및 디지털 시대에서는 보다 소형화되고, 대용량의 데이터 저장 및 다기능 소자에 대한 요구가 많아지고 있다. 이러한 전자 산업 환경에서 MEMS 소자는 여러 요구조건을 만족시킬 수 있는 특징을 갖추고 있으며 실제 소자의 제작에 있어서 MEMS 소자를 이용하여 여러 물리 및 화학 센서 및 Actuator 제작에 응용이 되어지고 있고 Optical switch, Gyroscope, 적외선 어레이 센서, 가속도 센서, 위치 센서 등 여러 분야에서 실용화가 진행되어지고 있다. MEMS 구조물의 packaging 방법에 있어서는 내부 MEMS 소자의 동작을 위한 외부 환경으로부터의 보호를 위하여 Hermetic sealing에 대한 요구를 만족시켜야 한다. 본 발표에서는 이와 같은 MEMS device의 진공 패키지를 구현함에 있어서 기판 내부에 수동소자를 실장할 수 있는 LTCC 기술을 이용하여 진공 패키징하는 방법에 대하여 소개한다. 본 기술을 이용하는 경우 기존의 Hermetic sealing 이외에 향후 적층 기판 내부에 수동소자를 내장시켜 배선 길이 및 노이즈 성분을 감소시켜 더욱 전기적 성능을 향상시킬 수 있는 장점이 있게된다. 본 논문에서는 LTCC 기판을 이용하여 패키징 시킨 후, 내부 진공도에 영향을 줄 수 있는 계면들에서의 시간에 따른 진공도 변화의 특성치를 측정하여 LTCC 기판의 Hermetic sealing 특성에 관하여 조사하였다.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.11 no.1
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• pp.1-10
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• 2005

Paper angle, environment friendly packaging material, has been mainly used as an edge protector. But, we have perceived its application to package design of heavy product such as strength reinforcement or unit load system (ULS) in the future. Above all, understanding of buckling behavior for angle itself and compression strength and quality standard have to be accomplished for the paper angle to be used for this purpose. The purpose of this study was to elucidate the buckling behavior through theoretical and finite element analysis, and to develop compression strength model by compression test for symetric and asymetric paper angle. Based on the result of theoretical and finite element analysis, increasing rate of buckling of asymmetric paper angle was higher as applied load level was bigger and/or the length of angle was longer than that of symmetric paper angle. Decreasing rate of minimum principal moment of inertia was remarkably increased as the extent of asymmetric angle is bigger, and buckling orientation of angle was open direction near the small web. Increasing rate of maximum compression strength (MCS) for thickness of angle was smaller as the web size was bigger in symmetric angle. MCS of asymmetric angle of $43{\times}57$ and $33{\times}67$ was decreased $15{\sim}18%$ and $65{\sim}78%$, and change of buckling was increased $12{\sim}13%$ and $62{\sim}66%$, respectively.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.23 no.1
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• pp.1-7
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• 2017

The recognition rate of RFID system is made a big difference by the selection of tag type and performance of reader, packing materials and the attachment location of tag and the recognition of angle according to the above factors. Water content is the most effective factor among the various elements that affected to the recognition of RFID as the center. Therefore, the purpose of this study was to measure the RFID recognition rate per water content, the distance recognition rate of RFID tag, the RFID tag and the recognition rate by contact area. In analysis of recognition rate according to water content, 100% of recognition was possible when food product contained 0~25% moisture. However, when water content was over than 30%, recognition rate was declined less than 95%. The recognition rate between RFID tag according to water content was higher when distance was over than 0.3 cm. In the recognition rate about the contact area of RFID tag according to water content, the recognition rate was declined when the contact area becomes wider.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.1
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• pp.11-21
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• 1999

For microelectronic packaging application, the crystallizable glass powder in CaO-$A1_2O_3-SiO_2-B_2O_3$system was mixed with various amounts of alumina inclusions (\approx 4 $\mu \textrm{m}$), and its sintering behavior, crystallization behavior, and dielectric constant were examined in terms of vol% of alumina and the reaction between the alumina and the glass. Sintering of the CASB glass powder alone at $900^{\circ}C$ resulted in full densification (99.5%). Sintering of alumina-filled composite at $900^{\circ}C$ also resulted in a substantial denslfication higher than 97% of theoretical density, In this case, the maximum volume percent of alumina should be less than 40%. XRD analysis revealed that there was a partial dissolution of alumina into the glass. This alumina dissolution, however, did not show the particle growth and shape accommodation. Therefore, the sintering of both the pure glans and the alumina-filled composite was mainly achieved by the viscous flow and the redistribution of the glass. Alumina dissolution accelerated the crystallization initiation time at $1000^{\circ}C$ and hindered the densification of the glass. Dielectric constants of both the alumina-filled glass and the glass-ceramic composites were increased with increasing alumina content and followed rule of mixture. In case of the glass-ceramic matrix composites showed relatively lower dielectric constant than the glass matrix composite. Furthermore, as alumina content increased, crystallization behavior of the glass was changed due to the reaction between the glass and the alumina. As alumina reacted with the glass matrix, the major crystallized phase was shifted from wollastonite to gehlenite. In this system, alumina dissolution strongly depended on the particle size: When the particle size of alumina was increased to 15 $\mu\textrm{m}$, no sign of dissolution was observed and the major crystallized phase was wollastonite.

• Journal of Biosystems Engineering
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• v.39 no.3
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• pp.194-204
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• 2014

Purpose: The aim of this study was to develop long-term storage technology for Chinese cabbage in order to extend the period of availability of freshly harvested products. The scope of the paper deals with the use of a cooler with a remote monitoring and control interface in conjunction with use of packaging film. Methods: A cooler with a real time monitoring system was designed as a low-temperature storage facility to control temperature and relative humidity (RH). The effects of storage in high-density polyethylene (HDPE) plastic boxes, 3% chitosan dipping solution, polypropylene film (PEF) with perforations, and mesh packaging bags on physiological responses were investigated. The optimal storage temperature and humidity for 120 days were below $0.5^{\circ}C$ and 90%, respectively. Physiological and biochemical features of cabbage quality were also analyzed: weight loss, texture, and sugar salinity, chlorophyll, reducing sugar, and vitamin C contents. Results: The cooler with a remote monitoring and control interface could be operated by an HMI program. A $0.5^{\circ}C$ temperature and 90% humidity could be remotely controlled within the cooler for 120 days. Postharvest freshness of Chinese cabbages could be maintained up to 120 days depending on the packaging method and operation of the remote monitoring system. In particular, wrapping the cabbages in PEF with perforations resulted in a less than a 5% deterioration in quality. This study provides evidence for efficient performance of plastic films in minimizing post-harvest deterioration and maintaining overall quality of cabbages stored under precise low-temperature conditions with remote monitoring and a control interface. Conclusions: Packaging with a modified plastic film and storage in a precisely controlled cooler with a remote monitoring and control interface could slow down the physiological factors that cause adverse quality changes and thereby increase the shelf life of Chinese cabbage.

• Korean Journal of Veterinary Service
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• v.36 no.4
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• pp.291-296
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• 2013

The purpose of this study was to determine food safety practices and procedures based on Hazard Analysis Critical Control Point (HACCP) system and to suggest more effective method of HACCP implementation in meat packaging industry in Korea. We used the non-compliance rate of each evaluation item to compare the weak points of prerequisite requirements and HACCP. The prerequisite items related to facility, equipment, and tools showed inadequate level of requirements or unsanitary conditions for proper HACCP operation. A lack of understanding of sanitation standard operation procedures was identified as a fundamental barrier to HACCP implementation. High rate of non-compliance in HACCP items compared to prerequisite requirements signify that small businesses have potential difficulties of applying HACCP due to lack of technical expertise, financial resources for prerequisite requirements, and available personnel to prepare and operate HACCP plan. Also we suggest to revise and minimize current critical control points (CCPs). Time-temperature control of cold-storage rooms for carcasses and final products could be performed by control points of prerequisite requirements. As the occurrence frequency getting lower, metal detector should be replaced by intensified training of sanitary handling and safety procedure. This will be more effective and preventive measures against physical contaminants including metal particles. In conclusion, control point of prerequisite requirement may replace CCP in the plant with simple processing line and no heating process such as meat packaging industry.

• KSII Transactions on Internet and Information Systems (TIIS)
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• v.14 no.7
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• pp.2938-2956
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• 2020

Objective image quality assessment (IQA) models have been developed by effective features to imitate the characteristics of human visual system (HVS). Actually, HVS is extremely sensitive to color degradation and complex texture changes. In this paper, we firstly reveal that many existing full reference image quality assessment (FR-IQA) methods can hardly measure the image quality with contrast and masking texture changes. To solve this problem, considering texture masking effect, we proposed a novel FR-IQA method, called Texture and Color Quality Index (TCQI). The proposed method considers both in the masking effect texture and color visual perceptual threshold, which adopts three kinds of features to reflect masking texture, color difference and structural information. Furthermore, random forest (RF) is used to address the drawbacks of existing pooling technologies. Compared with other traditional learning-based tools (support vector regression and neural network), RF can achieve the better prediction performance. Experiments conducted on five large-scale databases demonstrate that our approach is highly consistent with subjective perception, outperforms twelve the state-of-the-art IQA models in terms of prediction accuracy and keeps a moderate computational complexity. The cross database validation also validates our approach achieves the ability to maintain high robustness.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.59-64
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• 2021

System-in-package (SIP) technology using heterogeneous integration is becoming the key of next-generation semiconductor packaging technology, and the development of low temperature Cu bonding is very important for high-performance and fine-pitch SIP interconnects. In this study the low temperature Cu bonding and the anti-oxidation effect of copper using porous Ag nanolayer were investigated. It has been found that Cu diffuses into Ag faster than Ag diffuses into Cu at the temperatures from 100℃ to 200℃, indicating that solid state diffusion bonding of copper is possible at low temperatures. Cu bonding using Ag nanolayer was carried out at 200℃, and the shear strength after bonding was measured to be 23.27 MPa.

• Journal of Ceramic Processing Research
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• v.19 no.6
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• pp.504-508
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• 2018

Diopside is a ceramic material with excellent physical and chemical properties. However, when it is applied as an LED packaging material, heat dissipation of the LED element is not sufficient due to its relatively lower thermal conductivity, which may cause degradation of the LED function. In this study, glass-ceramics based on a $ZrO_2-CaO-MgO-SiO_2$ system, in which diopside is the main crystal phase, were prepared by heat-treating the glass, which was composed of zircon ($ZrO_2-SiO_2$) powders and diopside ($CaO-MgO-2SiO_2$) powders. The possibility of using the glass-ceramics as a packaging material for LEDs was then investigated by analyzing the density, shrinkage, thermal conductivity, and phases generated according to the amount of zircon powder added. The density and shrinkage of specimens decreased slightly and then increased again with the amount of $ZrO_2-SiO_2$ added within a range of 0~0.38 mol. Even though the crystal phase of zircon does not appear in the $ZrO_2-CaO-MgO-SiO_2$ system, the glass containing 0.38 mol zircon powder showed the highest thermal conductivity, 1.85 W/mK, among the specimens fabricated in this study: this value was about 23% higher than that of pure diopside. It was found that the thermal conductivity of the glass-ceramics based on a $ZrO_2-CaO-MgO-SiO_2$ system was closely related to the density, but not to the phase type. Zirconia ($ZrO_2$), a component oxide of zircon, plays an important role in increasing the density of the specimen. Furthermore the thermal conductivity of glass-ceramics based on a $ZrO_2-CaO-MgO-SiO_2$ system showed a nearly linear relationship with thermal diffusivity.