• Journal of Food Hygiene and Safety
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• v.20 no.4
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• pp.277-283
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• 2005

A plasticizer is a substance which is added to a material to improve its processability, flexibility and stratchability. Phthalates and adipates are the most frequently used plasticizers of poly(vinyl chloride) (PVC). However, they can migtate into food from PVC food packaging, and some of them are especially suspected as endocrine disruptors. In this study, Simultaneous analysis of 13 phthalates and 9 adipates were carried out by dual-column gas chromatography system equipped wi two FID detectors for rapid confirmation and quantification. The Proposed method was validated with > 0.993 of linearity in the ranges of 10-500 mg/l, < $3.5\%$ RSD of reproducability in 10 inter-days sample preparations, and > $98.1\%$ of recoveries for all the plasticizers. DEHA was detected in all the 3 PVC wraps at levels of 176.9-198.5mg/g. Among the 51 samples of PVC gaskets, the targeted plasticizers were detected in 41 samples. Of these plasticizer detected samples,40 contained DIDP at the levels of 157.3-374.7 mg/g and one contained DMP at the levels of 165.6 mg/g. Also, some plasticizers were detected in other packaging materials such as PET, PP, PE, Pulp. But it might be attributed to contamination in manufacturing.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.13 no.1
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• pp.25-28
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• 2007

Physical damage on fruits and vegetables caused by shock degrades the value of product in the fresh market. In order to design a product/package system to protect the product, the peak acceleration or G force to the product that causes shock damage needs to be determined. Shock cushion packaging is applied to protect goods of all kinds. It can be adapted in their shape to any product to be packed, so that its shock absorbing properties is determined by geometry of the product. The shape of a cushion can be adapted to the expected shock loads. To analyze the response properties of cushion materials for packaging of the pears for optimum packaging design during transportation, shock tests were carried out. Shock acceleration that is happened in pears were appeared very high by $25{\sim}30G$ in the input shock acceleration of 14.1618 G that was measured in transportation road. This means that the pears receive the shock acceleration more than maximum double itself and the damage by this can happen and the shock acceleration increase in case use PE tray cup and PE net in fruits, the use of corrugated fiberboard pad may become one method that it can reduce the damage by the shock in packaging of fruits.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.13 no.1
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• pp.19-23
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• 2007

Shock and vibration inputs are transmitted from the transporting vehicle through the packaging to the fruit. The vibration causes sustained bouncing of fruits against each other and the container wall. The steady state vibration input may cause serous fruit injury, and the damage is particularly severe if the fruits are bounced at its resonance frequency. The determination of the resonance frequencies of the fruits and vegetables may help the packaging designer to determine the proper packaging system providing adequate protection for the fruits, and to understand the complex interaction between the components of the fruits when they relate to expected transportation vibration inputs. To analyze the vibration properties of the apples for optimum packaging design during transportation, random vibration tests were carried out. In the random vibration test, the resonance frequency and PSD of the packaged freight of apples in the test were in the range of 82 to 97 Hz and 0.0013 to $0.0021G^2/Hz$ respectively and the resonance frequency and PSD of the packaged apples in the test were in the range of 13 to 71 Hz and 0.0143 to $0.0923G^2/Hz$.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.25 no.3
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• pp.125-130
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• 2019

Shock and vibration inputs are transmitted from the vehicle through the packaging to the fruit. Inside, these cause sustained bouncing of fruits against each other and container wall. These steady state vibration input may cause serous fruit injury, and this damage is particularly severe whenever the fruit inside the package is free to bounce, and is vibrated at its resonance frequency. The determination of the resonance frequencies of the fruit and vegetables may help the packaging designer to determine the proper packaging system providing adequate protection for the fruit, and to understand the complex interaction between the components of fruit when they relate to expected transportation vibration inputs. Instrumentation and technologies are described for determining the vibration response characteristics of the pears for exporting with frequency range from 10 to 200 Hz, sweep rate of 1 octave/min, sweep method of logarithmic up and down and acceleration levels of 0.2, 0.4, 0.6, 0.8 and 1.0 G considering the domestic transportation environment. The resonance frequency of the pears ranged from 49.04 to 87.16 Hz and the amplitude at resonance was between 0.96 and 4.02 G in test frequency band and acceleration level. The resonance frequency and amplitude at resonance frequency band of the pears decreased with the increase of the sample mass. The multiple nonlinear regression equations for predicting the resonance frequency of the pears were developed using the independent variables such as mass, input acceleration.

• Korean Journal of Optics and Photonics
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• v.11 no.3
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• pp.179-186
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• 2000

Optical coupling coefficients and misalignment tolerance of 155 Mbps optical transmitter module of passive alignment technology, to be usable in ATM system, B-NT (Broadband Network Termination) system, and 10 G transmission system for information super-highway networks, were calculated, compaired with it's engineer samples, and discussed. These engineer samples of -4.5 dBm maximum output power were packaged in the method of butt coupling of flat-fiber and tested reliability evaluation. Hence the cheap packaging method of optical transmitter module was researched. rched.

• Journal of the Korean Society for Precision Engineering
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• v.30 no.3
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• pp.349-355
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• 2013

Recent high oil price results in the development of energy saving technology such as LED lighting system. Street-lighting system using COH LED package can save energy because the heat dissipation through cupper base is better than conventional technology. Studies on manufacturing processes of lighting system are insufficient even though LED package design and its heat analysis have been studied. This study focuses on the problem and solution of manufacturing processes such as LED packaging process, optimized emission angle, and LED bar dimension for mechanical assembly. As a result, we established better manufacturing alternatives of LED packaging and street-lighting system with higher lighting efficiency of 84 lm/W, as well as good illumination intensity of 39.7 lux at 6 m from lighting source.

• Journal of the Semiconductor & Display Technology
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• v.4 no.2 s.11
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• pp.33-37
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• 2005

Bare-chip packaging becomes more popular along with the miniaturization of IT components. In this paper, we have studied flip-chip process, and developed automated bonding system. Among the several bonding method, NCP bonding is chosen and batch-type equipment is manufactured. The dual optics and vision system aligns the chip with the substrate. The bonding head equipped with temperature and force controllers bonds the chip. The system can be easily modified fer other bonding methods such as ACF.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.21 no.3
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• pp.97-106
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• 2015

Thermal deformation of packaging materials was observed in some ready-to-eat food products for microwave use. Therefore, the deformation patterns depending on packaging types and shapes of 9 domestic and 11 foreign products after microwave heating were investigated. Among the domestic and foreign products, thermal deformations of packaging material were observed in 5 and 8 samples, respectively. Besides, thermal deformation occurred on the lid and cup body of tray filled with a spicy chicken sauce after having microwaved where previously no deformation had been observed with other food types. No consistent results of thermal deformation were obtained by the analysis of salinity, brix, pH and viscosity of RTE products for microwave heating. However, thermal deformations of packages were less found in the packages used for the RTE foods contained very high or low viscosity than those with medium viscosity. Furthermore, the degree of thermal deformations was dependent on the food composition and shape as well as package type. In order to prevent the thermal deformation of packaging materials, therefore, technological advances and further studies are required to develop the heat-resistant packaging system and to improve the non-uniformity during microwave heating of RTE foods.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.22 no.1
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• pp.168-172
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• 2013

In 3D wafer-stacking technology, one of the major issues is wafer warpage. Especially, The important reason of warpage has been known due to CTE(Coefficient of Thermal Expansion) mismatch between materials. It was too hard to choose how to make the FE model for blanket structured wafer level 3D packaging, because the thickness of each layer in wafer level 3D packaging was too small (micro meter or nano meter scale) comparing with diameter of wafer (6 or 8 inches). In this study, the FE model using the shell element was selected and simulated by the ANSYS WorkBench to investigate effects of the CTE on the warpage. To verify the FE model, it was compared by experimental results.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.377-377
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• 2007

A simplified integration process including packaging is presented, which enables the realization of the portable fluorescence detection system. A fluorescence detection microchip system consisting of an integrated PIN photodiode, an organic light emitting diode (OLED) as the light source, an interference filter, and a microchannel was developed. The on-chip fluorescence detector fabricated by poly(dimethylsiloxane) (PDMS)-based packaging had thin-film structure. A silicon-based integrated PIN photo diode combined with an optical filter removed the background noise, which was produced by an excitation source, on the same substrate. The active area of the finger-type PIN photo diode was extended to obtain a higher detection sensitivity of fluorescence. The sensitivity and the limit of detection (LOD S/N = 3) of the system were $0.198\;nA/{\mu}M$ and $10\;{\mu}M$, respectively.