• Title/Summary/Keyword: packaging materials

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Implementation of V-Band Filter using MCM-D Technology (MCM-D 기판 공정 기술을 이용한 V-Band Filter 구현)

  • Yoo, Chan-Sei;Song, Sang-Sub;Park, Jong-Chul;Seo, Kwang-Seok
    • Proceedings of the IEEK Conference
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    • 2006.06a
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    • pp.169-170
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    • 2006

  • A band pass filter for the V-band application with unique circuit and structure was designed and implemented using 2-metals, 3-BCB layers. In the mean while the effective electrical conductivity of metal layer was extracted and its value was $4{\times}10^7S/m$. The insertion loss of band pass filter at 60 GHz was 3.0 dB and group delay was below 0.1 ns.

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Development of Textile Metal Matrix Composites for Electronic Packaging (전자 패키징용 직조형 금속복합재료 개발)

  • 이상관;김진봉;홍순형
    • Proceedings of the Korean Society For Composite Materials Conference
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    • 2000.11a
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    • pp.183-186
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    • 2000

  • A new textile metal matrix composite fur electronic packaging was developed and characterized. The thermal management materials consist of a plain woven carbon fabric as reinforcement and pure aluminum as matrix. The finite element method has been utilized in the analysis of thermal stress between the constituent components of packaging. The prototype part was manufactured by the liquid pressurizing method. The composite has CTE values of 4 to $5{\times}10^{-6}\;^{\circ}C^{-1}$10 in the range of $25^{\circ}C$ ~ 175$^{\circ}C$, resulting in good agreement with electronic materials such as Si and GaAs.

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Utilization of Carbon Nanotubes for New Interconnect Materials in Electronic Packaging (전자 패키징 Interconnect 소재로의 카본 나노튜브의 활용)

  • Lee, Jong-Hyun
    • Journal of the Microelectronics and Packaging Society
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    • v.16 no.3
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    • pp.1-10
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    • 2009

  • Carbon nanotube(CNT)s have been considered as one of the most unique materials due to the their superior mechanical, thermal and electrical properties. Therefore, numerous studies have been performed for the utilization of CNTs. This review article focuses on the recent research trends on the utilization of CNTs for new interconnect materials in electronics packaging. Major contents mentioned are the direct interconnection technology using CNTs and the main properties of polymer/CNTs composite materials. This article is aimed at the reviewing of important results from the recent studies and providing the straightforward understanding of the results through the mutual analysis and a industrial viewpoint.

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A Study on the Safety of Food Packaging Materials from the Perspective of the Circular Economy (순환경제 관점에서 본 플라스틱 식품포장재 재활용의 안전성에 관한 고찰)

  • 김미경
    • KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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    • v.27 no.3
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    • pp.149-158
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    • 2021

  • Advances in food packaging play an important role in keeping food manufacturing and food supply safe. Food packaging facilitates the storage, handling, transportation and preservation of food, and also contributes to the minimization of food waste. On the other hand, food packaging materials have high production volumes, short usage times, and accelerate the occurrence of environmental problems related to waste. The circular economy has already been introduced to pursue sustainability through resource conservation and recycling, and to reduce waste and carbon emissions. By activating an eco-friendly economic system that minimizes resource depletion and environmental pollution, reducing, reusing, recycling and redesigning the goals of the circular economy will reduce the impact of food packaging on the environment. This review focused on the safety aspects of recycled food packaging as recycling is currently considered an important means of packaging waste management. Assessing the safety of recycled packaging is very important because recycling can increase the levels of potentially hazardous chemicals in packaging and in the food after they are migrated. Various food packaging materials such as plastic, paper and cardboard, aluminum, steel, and multi-material multi-layers packaging are commonly used, but only the recycling safety of plastic food packaging materials, which is the most used and has a significant increase in post-use problem, is discussed in this review.

  • https://doi.org/10.20909/kopast.2021.27.3.149 인용 PDF KSCI