• 월간포장계
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• 통권366호
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• pp.48-63
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• 2023

• 청정기술
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• 제22권1호
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• pp.45-52
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• 2016

This study reports on the modeling and simulation of heat transfer in packaging boxes used for vaccine shipping. Both water and n-tetradecane are used as primary insulation materials inside a multi-slab system. The one-dimensional model, which is a spherical model using a radius equivalent to the rectangular geometry of container, is applied in this study. N-tetradecane with low thermal diffusivity and proper phase transition temperature exhibits higher heat transfer resistance during both heating and cooling processes compared to water. Thus, n-tetradecane is a better candidate as an insulating material for packaging containers for vaccine shipping. Furthermore, the developed method can also become a rapid and economic tool for screening appropriate phase change materials used as insulation materials with suitable properties in logistics applications.

• Journal of Welding and Joining
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• 제31권3호
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• pp.11-16
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• 2013

Through-silicon-via (TSV) is a major technology in microelectronics for three dimensional high density packaging. The 3-dimensional TSV technology is applied to CMOS sensors, MEMS, HB-LED modules, stacked memories, power and analog, SIP and so on which can be employed to car electronics. The copper electroplating is widely used in the TSV filling process. In this paper, the various Cu filling methods using the control of the plating process were described in detail including recent studies. Via filling behavior by each method was also introduced.

• 대한본초학회지
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• 제24권1호
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• pp.9-14
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• 2009

Objectives : The purpose of this study is to investigate on storage characteristics of flavouring oriental medicine materials according to Packaging method(Aluminum package, PP). Methods : This experiments were carried out by field survey and storage characteristics were carried out by physicochemical determination. Results : Flavouring oriental medicine materials were used to in aluminum package to keep original flavour in Japan and Chinese by field and study survey. In view of this survey results, it is very desirable to use zipper Aluminum package in flavouring oriental medicine materials(Perilla perfrutescens var. acuta, Mentha arvensis L. var. piperascens malinvaud). Conclusions : This study results revealed that Aluminum package were superior to any other package method on the basis of keeping original flavour and to reduce microbial contamination in oriental medicine materials.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.30-30
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• 2007

현재 다양한 종류의 RF 통신 제품이 시장에 등장하면서 제품의 경쟁력 확보에 있어 소형화 정도가 중요한 이슈가 되고 있다. Passive Device는 RF Circuit을 제작할 때 많은 면적을 차지하고 있으며 이를 감소시키기 위해 여러 연구가 진행되고 있다. 가장 효과적인 방법으로 반도체 집적기술로 크기를 줄이는 방법이 있으나, 공정이 비싸고 제작 시간이 오래 걸려 제품개발 시간과 개발비용이 상승하게 된다. 반면에 SoP-L 공정은 PCB 제작에 이용되는 일반적인 재료와 공정을 사용하므로 개발 비용과 시간을 줄일 수 있다. SoP-L의 또 하나 장점은 다종 재료를 다층으로 구성할 수 있다는 점이다. 최근 chip-type의 Device를 PCB 기판 안에 내장하는 방법의 RF Circuit 소형화 연구가 많이 진행되고 있다. 본 연구에서는 SoP-L 공정으로 chip-type 수동소자를 PCB 기판 내에 함몰하여 수동소자회로를 구현, 분석하여 보았다. 수동소자회로는 880 MHz~960 MHz(GSM) 영역과 1.71 GHz~1.88 GHz(DCS) 영역을 나누는 Diplexer를 구성하였다. 1005 size의 chip 6개로 구현한 Diplexer를 표면실장과 함몰공정으로 제작하고 Network Analyzer로 측정하여 비교하였다. chip 표면실장으로 구현된 Diplexer는 GSM에서 최대 0.86 dB의 loss, DCS에서 최대 0.68 dB의 loss가 나타났다. 표면실장과 비교하였을 때 함몰공정의 Diplexer는 GSM 대역에서 약 0.5 dB의 추가 loss가 나타났으며 목표대역에서 0.6 GHz정도 내려갔다. 이 결과를 바탕으로 두 공정 간 차이점을 확인하고, 함몰공정으로 chip-type 수동소자를 사용하였을 때 고려해야 할 점을 분석하였다. 이를 바탕으로 SoP-L 함몰공정의 안정성을 높여서 이것을 이용한 회로의 소형화에 적용이 가능할 것으로 기대한다. 특히 능동소자의 DC Power Control에서 고용량의 수동소자를 이용할 때 집적도를 높일 수 있을 것이다.

• 한국포장학회지
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• 제11권1호
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• pp.17-24
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• 2005

During handling unitized products, they are subjected to a variety environmental hazards. Shock and vibration hazards are generally considered the most damaging of the environmental hazards on a product, and it may encounter while passing through the distribution environment. A major cause of shock damage to products is drops during manual handling. The increasing use of unitization on pallets has been resulted in a reduction in the manual handling of products and with it a reduction in the shock hazards. This has caused and increasing interest in research focused on vibration caused damage. the use of pallets as a base for unitizing loads, aids in the mechanical handling, transportation and storage of products. Besides aiding in the handling, transportation and storage of products, a pallet also acts on and interface between the packaged goods and the distribution environment. The determination of the impact deformation of the cushioning materials such as tray cup (polymeric foam) and corrugated fiberboard pad must be carried out to design the proper packaging system providing adequate protection for the fruit, and to understand the complex interaction between the components of fruit when they relate to expected transportation vibration inputs. In this study, the theoretical analysis of impact deformation for cushioning materials by dynamic vibration. The impact deformations of SW and DW corrugated fiberboard pad in acceleration amplitudes of 0.25 G-rms and 0.5 G-rms that were usually generated in transport vehicles during distribution environments were very small compare with the thickness of corrugated fiberboard pad. The maximum of vibration acceleration level of tray cup by vibration impact was about 3.2 G-rms. The theoretical allowable acceleration (G-factor) of the pear was 0.7102 G-rms, and the maximum dynamic deformation estimated within G-factor was about 1 mm.

• 마이크로전자및패키징학회지
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• 제25권4호
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• pp.9-15
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• 2018

This paper shows the principles and characteristics of the transient liquid phase (TLP) bonding technology for power modules packaging. The power module is semiconductor parts that change and manage power entering electronic devices, and demand is increasing due to the advent of the fourth industrial revolution. Higher operation temperatures and increasing current density are important for the performance of power modules. Conventional power modules using Si chip have reached the limit of theoretical performance development. In addition, their efficiency is reduced at high temperature because of the low properties of Si. Therefore, Si is changed to silicon carbide (SiC) and gallium nitride (GaN). Various methods of bonding have been studied, like Ag sintering and Sn-Au solder, to keep up with the development of chips, one of which is TLP bonding. TLP bonding has the advantages in price and junction temperature over other technologies. In this paper, TLP bonding using various materials and methods is introduced. In addition, new TLP technologies that are combined with other technologies such as metal powder mixing and ultrasonic technology are also reviewed.

• 한국포장학회지
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• 제13권2호
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• pp.75-78
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• 2007

Regulation of food packaging in Korea, Eurpoe and USA are surveyed. Food packaging manufacturer or converter has a responsibility to evaluate the safety of migration of harmful materials from typical finished packaging items. The 'overall migration limit' of all components from the packaging and 'specific migration limits(SML)' of monomers or additives are evaluated with food simulants, water, acetic acid, ethanol and n-heptane, based on the regulations of the countries. A substance not regulated has to be authorized with the technical data required, information on chemical identity, physical chemical and other properties, the intended use, migration studies and toxicological studies.

• 한국포장학회지
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• 제15권1호
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• pp.25-32
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• 2009

It is now widely recognized that the disposal of packaging waste is an increasing environmental concern. Recent interest in polymer waste management of packaging materials has added incentive to the research. Poly(vinyl alcohol) is a readily biodegradable water-soluble polymer. However, this polymer cannot be processed by conventional extrusion technologies because the melting point of PVA is close to its decomposition temperature. Therefore, PVA films have been mostly prepared by solvent casting from water. Applications of PVA include sizing, binders, fibers, and films for agricultural chemicals and hospital laundry bags. A better understanding of PVA films, which also play important roles in the degradation of plastics, will expand the usage of PVA. Composite films based on PVA generally exhibit better mechanical and thermal properties than pure PVA. The aim of this review article is to review types, formation, and properties of PVA films and PVA based composite films used in packaging related researches.

• 한국포장학회지
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• 제23권1호
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• pp.17-26
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• 2017

유럽의 포장 폐기물 통계를 다양한 관점에서 확인하기 위해서 Eurostat의 데이터베이스 중심으로 유럽의 포장 폐기물 발생 및 처리의 연도별 변화, 유럽 국가들의 재생률과 재활용률 목표 그리고 유럽 국가별 재활용률로 정리하여 분석하였다. 2005년부터 2013년까지 기간 동안의 모든 포장 폐기물 발생량에서 포장 재료 중 종이 및 판지가 가장 많이 생산되었음을 확인하였으며, 주요 포장 재료의 점유율 성장 추이에서는 대체적으로 포장 재료 간 일정한 추세를 확인하였다. 또한 유럽 연합 회원국들은 포장 폐기물 재생률과 재활용률 목표 지침을 제정하고 있는데, 2008년 이 지침이 제정된 후로 대부분의 EU 국가들이 잘 지키고 있었다. 마지막으로 Eurostat에서는 포장 폐기물의 양과 재활용된 양을 유리, 종이 및 판지, 금속, 플라스틱, 목재 등의 포장 재료별로 폐기물의 재활용 비율을 산출하고 있는데, 유럽의 전체 포장 폐기물의 재활용 비율의 경우 계속해서 증가하는 추세를 확인하였다. 이를 통해 EU 국가별로 포장 재료별 폐기물의 양과 재활용된 양을 비교 분석하고 이러한 추세 변화에 따른 GDP 감소와 경제적 슬럼프와 같은 포장 폐기물과 재활용에 따른 간접적인 영향력도 확인할 수 있었다.