• Journal of Korean Society of Rural Planning
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• v.20 no.4
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• pp.157-164
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• 2014

This study clarified the correlation between the satisfaction of farm experience village visitors and the package design of farm specialty products and identified the factors to consider when improving the package design. It was found that the satisfaction with package design when purchasing farm specialty products affected the satisfaction of farm experience village visitors. In case of farm experience village visitors, they were more satisfied with the purchase when they were satisfied with the package design of farm specialty products they purchased. The results of analysis of correlation between the satisfaction of farm experience village visitors and the improvement of package design of farm specialty products showed that the important factors of package design are easiness of transport handling, easiness of storage, and functionality of packaging materials.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.2
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• pp.49-52
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• 2001

This paper presents product level considerations for multichip packaging as a cost effective alternative to single chip packaging in the design and manufacture of mobile telephony products. Important aspects include component functionality and complexity, acquisition and logistics costs, product modularity and integration. Multichip packaging offers unique solutions and significant system level cost savings in many applications including RF modules, digital matrix functions and product options such as security, data storage, voice recognition, etc.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.04a
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• pp.1-7
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• 2001

This paper presents product level considerations for multichip packaging as a cost effective alternative to single chip packaging in the design and manufacture of mobile telephony products. Important aspects include component functionality and complexity, acquisition and logistics costs, product modularity and integration. Multichip packaging offers unique solutions and significant system level cost savings in many applications including RF modules, digital matrix functions and product options such as security, data storage, voice recognition, etc.

• Journal of Korean Institute of Industrial Engineers
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• v.25 no.2
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• pp.173-183
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• 1999

The three design elements of automobile occupant packaging such as pedals, steering wheel, and seat are the most important factors to design an ergonomically sound layout for improving driving comfort and performance. The aim of the study is to find out coherent characteristics of the relationships among three design elements. For this purpose, Triangular Method is suggested. We extracted properties for determining the shape, size, and location of the triangle that is composed of Accelerated Heel Point, Steering Wheel Point, and Hip Point. An experiment was conducted at a seating buck in which the design elements are freely adjustable by the subject to investigate driver's preferred arrangement of three elements. Statistical analyses revealed that there was a subtle change in the shape of triangle according to different percentiles and that the significant difference was observed only for the size of the triangle. The results will be effectively applied to design a comfortable seat packaging layout.

• Journal of Institute of Control, Robotics and Systems
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• v.16 no.2
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• pp.172-176
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• 2010

Recently, LCD (Liquid Crystal Display) requires various technical challenges; high definition, high quality, big size, and low price. These demands more pixels in the fixed area of the LCD and very fine lead pitch of the driving IC which controls the pixels. Therefore, a new packaging technology is needed to meet such technical requirement. NCP (Non Conductive Paste) is one of the new packaging methods and has excellent characteristics to overcome the problems of the ACF (Anisotropic Conductive Film). In this paper, we analyzed the process of the NCP for COF (Chip on FPCB) and proposed the key design parameters of the NCP process. Through a series of experiments, we obtained the stable values of the design parameters for successful NCP process.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.4
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• pp.91-95
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• 2017

Package-On-Package (PoP) technology is developing toward smaller form factors with high-speed data transfer capabilities to cope with high DDR4x memory capacity. The common application processor (AP) used for PoP devices in smartphones has the bottom package as logic and the top package as memory, which requires both thermally and electrically enhanced functions. Therefore, it is imperative that PoP designs consider both thermal and power distribution network (PDN) issues. Stacked packages have poorer thermal dissipation than single packages. Since the bottom package usually has higher power consumption than the top package, the bottom package impacts the thermal budget of the top package (memory). This paper investigates the thermal and electrical characteristics of PoP designs, particularly the bottom package. Findings include that via and dense via-cluster volume have an important role to lower thermal resistance to the motherboard, which can be an effective way to manage chip hot spots and reduce the thermal impact on the memory package. A Cu block and dense via-cluster layout with an optimal location are proposed to drain the heat from the chip hot spots to motherboard which will enhance thermal and electrical performance at the design stage. The analytical thermal results can be used for design guidelines in 3D packaging.

• Journal of the Korean Professional Engineers Association
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• v.32 no.6
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• pp.55-59
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• 1999

It is very important moments to look revolutionary changes on the whole industries in the upcoming new millennium. Traditionally, packaging was differentiated from design, production, and quality test in improving productivity. Therefore packaging concept should be updated as the time changes. For the productivity improvement, Packaging should be regarded as the value added goods and changed with leading edge technologies to meet various market needs due to its complex faces based on econo-environmental nature.

• Journal of Distribution Science
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• v.20 no.8
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• pp.81-91
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• 2022

Purpose: The work aimed to integrate and distribute the knowledge of marketing and chemistry for product development, in which individual packaging from water hyacinth was ideal. Research design, data, and methodology: A customer perception was surveyed to guide the preparation process, and eco-packaging preparation followed the perception study. The satisfaction with the packaging using the 4Ps was determined. Results: 159 samples participated in the survey to establish their perceptions. They perceived that eco-packaging was a friendly environment with a score of 4.47. The uses of chemicals and water were less. The design for other functions than a normal function of packaging was preferred. The pulping was done using 3.0 M NaOH. The natural additives of carboxymethyl cellulose (defibering) and corn starch (adhesive) were desired. The paper was characterized according to The National Standard of Kraft paper and was equivalent to the liner board. The prototype of packaging was fabricated as individual packaging. The marketing mix was used to survey 200 samples. The satisfaction with the product was the maximum at 4.53, while the minimum was on price. The online channel was preferred to access the product. Conclusions: Water hyacinth could be added value as eco-packaging that the qualities of pulp were equal to the Kraft paper. Individual packaging from water hyacinth was satisfied.

• The monthly packaging world
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• no.7 s.183
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• pp.90-96
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• 2008

• The monthly packaging world
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• no.7 s.183
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• pp.70-75
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• 2008