• 한국포장학회지
• /
• 제14권2호
• /
• pp.53-56
• /
• 2008

Polyvinylchloride(PVC) is variously used to produce food packaging, wrap film, sealing compound of drinking bottle cap. Safety of these PVC food package is controlled by Food Code, PVC regulation. This study was carried out researches on manufacture process, physical, chemical properties and monomer(CAS No., common name, molecular structure) of PVC to help the understanding of PVC material. Also, this study helps us the understanding of regulation through researches on the foundation of PVC regulation, the purpose of test and the comment of test method. It is considered that these informations of material properties and explanations of test method are very useful to PVC producers, users and analyzers of them.

• 전기학회논문지
• /
• 제57권12호
• /
• pp.2228-2233
• /
• 2008

This research paper aims to establish a test process of the AFE SiP chip. It measured the sensitivity, current consumption and power consumption both on the evaluation socket board and Catalyst load board. As a result, the sensitivity became deteriorated with an average of 0.2[dBm] at the channel 62 only, the current consumption increased to an average of 0.57[mA] and the power consumption increased to an average of 1.76[mW], But all characteristics incomes the tolerance of the measurement, it also keeps almost the same level. Therefore this design of the test process improved a valid design.

• Corrosion Science and Technology
• /
• 제18권4호
• /
• pp.117-120
• /
• 2019

Considering the tendency of development of electrification vehicles, development and verification of new evaluation technology is needed because of new technology applications. Recently, as the battery package is set outdoors of an electric vehicle, such vehicles are exposed to corrosive environments. Among major components connected to the battery package, rust prevention of high-voltage cables and connectors is considered the most important issue. For example, if corrosion of high voltage cable connectors occurs, the corrosion durability assessment of using an electric vehicle will be different from general environmental corrosion phenomena. The purpose of this study is to investigate the corrosion mechanism of high voltage cable connectors of an electric vehicle under various driving environments (road surface vibration, corrosion environment, current conduction by stray current, etc.) and develop an optimal rust prevention solution. To improve our parts test method, we have proposed a realistic test method to reproduce actual electric vehicle corrosion issues based on the principle test.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2012년도 춘계학술대회 논문집
• /
• pp.843-844
• /
• 2012

• 대한기계학회논문집A
• /
• 제28권4호
• /
• pp.435-442
• /
• 2004

This paper presents a hermetic MEMS on-chip package bonded by a closed-loop AuSn solder-line. We design three different package specimens, including a substrate heated specimen without interconnection-line (SHX), a substrate heated specimen with interconnection-line (SHI) and a locally heated specimen with interconnection-line (LHI). Pressurized helium leak test has been carried out for hermetic seal evaluation in addition to the critical pressure test for bonding strength measurement. Substrate heating method (SHX, SHI) requires the bonding time of 40min. at 400min, while local heating method (LHI) requires 4 min. at the heating power of 6.76W. In the hermetic seal test. SHX, SHI and LHI show the leak rates of 5.4$\pm$6.7${\times}$$^{-10}$ mbar-l/s, 13.5$\pm$9.8${\times}$$^{-10}$ mbar-l/s and 18.5$\pm$9.9${\times}$$^{-10}$ mbar-l/s, respectively, for an identical package chamber volume of 6.89$\pm$0.2${\times}$$^{-10}$. In the critical pressure test, no fracture is found in the bonded specimens up to the applied pressure of 1$\pm$0.1MPa, resulting in the minimum bonding strength of 3.53$\pm$0.07MPa. We find that the present on-chip packaging using a closed AuSn solder-line shows strong potential for hermetic MEMS packaging with interconnection-line due to the hermetic seal performance and the shorter bonding time for mass production.

• 대한금속재료학회지
• /
• 제46권2호
• /
• pp.80-87
• /
• 2008

Many researches related to the reliability of Pb-free solder joints with PCB (printed circuit board) surface finish under thermal or vibration stresses are in progress, because the electronics is operating in hash environment. Therefore, it is necessary to assess Pb-free solder joints life with PCB surface finish under thermal and mechanical stresses. We have investigated 4-points bending fatigue lifetime of Pb-free solder joints with OSP (organic solderability preservative) and ENIG (electroless nickel and immersion gold) surface finish. To predict the bending fatigue life of Sn-3.0Ag-0.5Cu solder joints, we use the test coupons mounted 192 BGA (ball grid array) package to be added the thermal stress by conducting thermal shock test, 500, 1,000, 1,500 and 2,000 cycles, respectively. An 4-point bending test is performed in force controlling mode. It is considered that as a failure when the resistance of daisy-chain circuit of test coupons reaches more than $1,000{\Omega}$. Finally, we obtained the solder joints fatigue life with OSP and ENIG surface finish using by Weibull probability distribution.

• 월간포장계
• /
• 통권206호
• /
• pp.70-75
• /
• 2010

• 방사성폐기물학회지
• /
• 제5권3호
• /
• pp.199-212
• /
• 2007

IP-2형 운반용기는 정상운반조건에서의 자유낙하시험 및 적층시험을 수행한 후에 운반내용물의 분산 및 유실이 없어야 하며 외부표면에서의 방사선량률이 20%이상 증가할 수 있는 차폐능력의 상실이 없어야 한다. 본 연구에서는 두꺼운 철판을 구조재로 사용하며 볼트체결방식의 뚜껑을 가진 IP-2형 운반용기에 대한 구조 안전성을 평가하기 위한 해석적인 방안을 제안하였다. 해석적인 방법을 통하여 원자력발전소에서 발생된 방사성폐기물 드럼을 폐기물 처리시설에서 임시저장고까지 운반하기 위한 두 종류의 IP-2형 방사성폐기물 운반용기에 대하여 자유낙하조건에서 운반내용물의 분산 및 유실과 차폐손실이 없음을 확인하였다. 자유낙하조건에서 운반내용물의 분산 및 유실을 평가하기 위하여 최대 볼트단면 평균응력값과 최대 뚜껑열림량을 볼트의 인장강도와 뚜껑부에 존재하는 단차와 비교 평가하였다. 또한 최대 차폐두께 감소량을 이용하여 차폐손실을 평가하였다. 자유낙하조건에 대한 동적충돌해석을 검증하고 구조 안전성을 시험적으로 평가하기 위하여 자유낙하시험을 다양한 방향으로 실시하였다. 자유낙하시험에서는 운반내용물의 분산 및 유실은 볼트체결방식의 뚜껑에서 볼트의 파손 및 플랜지의 변형 등을 검사하여 평가하였으며, 차폐손실은 초음파 두께 측정기를 이용한 차폐두께를 측정하여 평가하였다. 해석에 대한 검증을 위하여 시험에서 취득한 변형률과 가속도를 동일한 위치에서 얻어진 해석결과와 비교하였다. 해석결과는 시험결과에 비하여 보수적인 결과를 보여주므로 해석에서 입증한 IP-2형 방사성폐기물 운반용기의 안전성은 보수적인 결과이다. 마지막으로 유한요소해석을 통하여 적층조건에 대한 IP-2형 방사성폐기물 운반용기는 안전함을 입증하였다.

• 대한기계학회논문집
• /
• 제6권4호
• /
• pp.384-389
• /
• 1982

It is necessary that machine tool structures should be designed so that they will cause a minimum chance of machining chatter. In order to do this, a computer program package is developed utilizing Finite Element Method, modal flexibility and energy balance method. Validity of the program package is verified through computer simulation analysis and impulse test of a simplified machine tool structure.

• International Journal of Industrial Entomology and Biomaterials
• /
• 제3권2호
• /
• pp.135-139
• /
• 2001

Experiments were held in Egypt to test a new Package of practices for commercial cocoon production, including adding secondary macro and micronutrients to the mulberry garden, disease free rearing regime, low temperature rearing in young instars and natural mounting fur silkworms. This package for seed silkworm rearing lead to increase in fecundity by 67-121eggs (15.12-26.22%) and yield of standard boxes per 1 parent egg boxes by 57-58 egg boxes(48.33-51.66%) respectively in comparison th the traditional cocoon production technology.