• Health Policy and Management
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• v.14 no.2
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• pp.34-57
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• 2004

Universal health insurance normally requires a basic benefit package, whose design intersects with almost all other aspects of the health insurance debate. Despite its central importance, basic benefit package has not received the analysis it deserves in Korea. The issue of how to decide which health services should be delivered and to whom has been a matter for consistent policy debate. Many industrialized countries observed in this study have been dealing explicitly or implicitly with the basic benefit package. The methods vary from having a specific positive list of services (Bismarkian countries) to the use of guidelines (Beveridgian countries). The purpose of this paper is to form the underlying principles and process for determining what is included or left out by getting accurate and representative responses from health-related personnel. Mail survey is used. Economic burden for treatment, seriousness of disease and urgency of treatment are ranked at the first three priorities. Services that had been suspended because of financial crisis in health insurance scheme in 2001 were selected as items which should firstly be expanded into coverage. Diagnostic test against heart disease and vaccination were also selected as items which should additionally belong to the list of covered services.

• Electrical & Electronic Materials
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• v.10 no.6
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• pp.519-527
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• 1997

The micro crack was occurred where the stress concentrated by the thermal stress which was induced during the cooling period after molding process or by the various reliability tests. In order to estimate the possibility of development from inside micro crack to outside fracture, the fracture toughness of EMC should be measured under the various applicable condition. But study was conducted very rarely for the above area. In order to provide a was to decide the fracture resistance of EMC (Epoxy Molding Compound) of plastic package which is produced by using transfer molding method, measuring fracture is studied. The specimens were made with various EMC material. The diverse combination of test conditions, such as different temperature, temperature /humidity conditions, different filler shapes, and post cure treatment, were tried to examine the effects of environmental condition on the fracture toughness. This study proposed a way which could improve the reliability of LOC(Lead On Chip) type package by comparing the measured $J_{IC}$ of EMC and the calculated J-integral value from FEM(Finite Element Method). The measured $K_{IC}$ value of EMC above glass transition temperature dropped sharply as the temperature increased. The $K_{IC}$ was observed to be higher before the post cure treatment than after the post cure treatment. The change of $J_{IC}$ was significant by time change. J-integral was calculated to have maximum value the angle of the direction of fracture at the lead tip was 0 degree in SOJ package and -30 degree in TSOP package. The results FEM simulation were well agreed with the results of measurement within 5% tolerance. The package crack was proved to be affected more by the structure than by the composing material of package. The structure and the composing material are the variables to reduce the package crack.ack.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.15 no.6
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• pp.82-87
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• 2006

Availability of defect test algorithm that recognizes exact and standardized defect information in order to fundamentally resolve generated defects in industrial sites by giving artificial intelligence to SAT(Scanning Acoustic Tomograph), which previously depended on operator's decision, to find various defect information in a semiconductor package, to decide defect pattern, to reduce personal errors and then to standardize the test process was verified. In order to apply the algorithm to the lately emerging Neural Network theory, various weights were used to derive results for performance advancement plans of the defect test algorithm that promises excellent field applicability.

• Journal of KIISE:Computing Practices and Letters
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• v.9 no.2
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• pp.123-132
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• 2003

The quality certification test is usually conducted by a certifying organization to determine and guarantee the quality of software after the software development phase, commonly without the actual source code, but with by going against the product's manual. In this paper, we implement a Manual-based Automatic Test data generating tool: MaT, the test technique based on manual, that automatizes producing the test data from analysis data of software package and manual. The input data of MaT are the result of the analysis of software and manual. We propose 'menu-based test analysis model' in order to generate the input data. We believe that the proposed technique and tool he]p improving quality and reliability of the software.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.12
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• pp.88-93
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• 2000

The reduction of the cushion material such as Expanded Polystyrene (EPS) is one of the urgent tasks of the package design process in home electrical appliances considering environmental protection. EPS reduction often causes the structural damage of products, which must be protected in the environment of transportation. CAE simulation can help the efficient package design with low material cost. The mechanical drop simulation of packaged product was performed with commercial FEM code and Taguchi approach was used partially to determine the dominant design parameters. As results of this study, about 20% reduction of EPS was accomplished in the monitor package design.

• Proceedings of the Korean Nuclear Society Conference
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• 2002.10a
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• pp.133.1-133
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• 2002

• Journal of the Korean Vacuum Society
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• v.13 no.3
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• pp.127-131
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• 2004

Package reliability test was conducted to investigate the effect of solder composition on the ball fatigue strength for BGA (Ball Grid Array) packaging. The test pieces are assembled using eutectic composition 63Sn/37Pb, 62Sn/36Pb/2Ag, and 63Sn/34.4Pb/2Ag/0.5Sb solder after pre-conditioning at MRT Lv 3 (Moisture Resistance Test Level) and then conducted under T/C (Temperature Cycle test). For each case, the ball shear strength was obtained and micro structure photos were taken. SEM (scanning electron microscope) and EDX (Energy Dispersive X-ray) were used to the analyze failure mechanism. The growth rate of Au-Sn intermetallic compound in Sn63Pb34.5Ag2Sb0.5 solder was slow when compared to 63Sn/37Pb solder and 62Sn/36Pb/2Ag solder. The degradation of shear strength of solder balls caused by solder composition was discussed.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.11
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• pp.1733-1740
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• 2010

The analysis of the dynamic behavior of the packaging of a drum washing machine has been carried out under the drop impact conditions. LS-DYNA software is used for performing the finite element analysis, and the validations are performed by comparing with the impact acceleration, effective stress and deformation of cushioned package with high-speed camera during free drop test. By analyzing the cushion characteristics and the design parameters of the original packaging, a packaging with an improved design is developed, and this design is validated on the basis of the results of the distribution test which consists of drop test, vibration test, stacking test, squeez test and so on. The drop impact simulation and analysis methods developed in this study can be adopted to successfully improve the cushioning provided by the packaging and to reduce the cost involved in developing new packaging for drum washing machines.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.4
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• pp.9-14
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• 2007

In this study, the thermal reliability on flip chip package with non-conductive pastes (NCPs) was evaluated under accelerated conditions. As the number of thermal shock cycle and the dwell time of temperature and humidity condition increased, the electrical resistance of the flip chip package with NCPs increased. These phenomenon was occurred by the crack between Au bump and Au bump and the delamination between chip or substrate and NCPs during the thermal shock and temperature and humidity tests. And the variation of electrical resistance during temperature and humidity test was larger than that during thermal shock test. Therefore it was identified that the flip chip package with NCPs was sensitive to environment with moisture.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.30 no.3
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• pp.30-38
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• 2016

In this research, a 6W white LED package with a Glass Remote Phosphor was developed to improve the life of an LED package. The Glass Remote Phosphor was fabricated by the Phosphor in Glass (PiG) method, wherein phosphor YAG:Ce was mixed with glass frit and then heat treated. A paste with 75wt.% of a phosphor substance and 25wt.% glass frit was coated on a glass substrate two times using the screen-printing technique and heat-treated at $800^{\circ}C$ ; this structure gave a luminous efficacy of 136.1lm/W, color rendering index of 74Ra, and color temperature of 5,342K, thus satisfying the requirements as a light source for lighting. Moreover, an IES LM-80 accelerated life test was conducted on the same LED package for 6,000h in order to estimate the L70 lifetime based on IES TM-21. The results showed guaranteed lifetimes of 213,000h at $55^{\circ}C$, 245,000h at $85^{\circ}C$, and 209,000h at $95^{\circ}C$.