• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.21-21
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• 2003

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.1261-1262
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• 2013

• Safety and Health at Work
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• v.13 no.2
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• pp.235-239
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• 2022

Background: The purpose of present study was to determine the effectiveness of training program based on job stress management in NEDSA and line staff. Methods: The study method of this study was quantitative and quasi-experimental research Methods: From the statistical population (all employees of the NEDSA and line staff in 2020-2021), 30 of these people were selected by judgmental sampling method and considering the inclusion and exclusion criteria. The participants were first matched based on age and education and were randomly divided into experimental and control groups. First, pre-test was taken from both groups (Job Stress Questionnaire). The experimental group was presented with a job stress management training package and no protocol was presented in the control group. After the sessions, post-test was received from both groups (experimental and control). After two months, a follow-up test was performed. Results: The results were entered into SPSS-24 software and analyzed. The results of repeated measure showed high effectiveness of the job stress management package (researcher-made). The results showed that the job stress management training package showed 67.5% effectiveness and also the training effect of job stress management training was stable for two months (follow-up). Conclusion: Based on these results, Training program based on stress management can be effective in military staff.

• Journal of the Semiconductor & Display Technology
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• v.21 no.1
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• pp.148-154
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• 2022

As the 4th industrial age approaches, the demand for semiconductors is increasing enough to be used in all electronic devices. At the same time, semiconductor technology is also developing day by day, leading to ultraprecision and low power consumption. Semiconductors that keep getting smaller generate heat because the energy density increases, and the generated heat changes the shape of the semiconductor package, so it is important to manage. The temperature change is not only self-heating of the semiconductor package, but also heat generated by external damage. If the package is deformed, it is necessary to manage it because functional problems and performance degradation such as damage occur. The package burn in test in the post-process of semiconductor production is a process that tests the durability and function of the package in a high-temperature environment, and heat dissipation performance can be evaluated. In this paper, we intend to review a new material formulation that can improve the performance of the adapter, which is one of the parts of the test socket used in the burn-in test. It was confirmed what characteristics the basic base showed when polyamide, a high-molecular material, and alumina, which had high thermal conductivity, were mixed for each magnification. In this study, functional evaluation was also carried out by injecting an adapter, a part of the test socket, at the same time as the specimen was manufactured. Verification of stiffness such as tensile strength and flexural strength by mixing ratio, performance evaluation such as thermal conductivity, and manufacturing of a dummy device also confirmed warpage. As a result, it was confirmed that the thermal stability was excellent. Through this study, it is thought that it can be used as basic data for the development of materials for burn-in sockets in the future.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2004.05a
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• pp.177-182
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• 2004

Electronic products are subjected to many different types of shock environment. As the Optical Disc Drive (ODD) market grows, the number of failures related to shock increases. Therefore, it is necessary to improve the performance of cushion package as well as the product design. Cushion materials such as expanded polystyrene are often used to protect electronic products from shock environment. In this paper, the drop analysis of the cushion package f3r optical disc drives was carried out with the explicit method of LS-DYNA and verified by the drop test. For the optimization of package, response surface approximation model was created using central composite design. As a result, cushioning performance was improved under the critical condition and practical design guidelines of cushion package were suggested.

• Proceedings of the Korean Radioactive Waste Society Conference
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• 2005.11a
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• pp.339-347
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• 2005

A type IP-2 transport package should prevent a loss or dispersal of the radioactive contents and a more than $20\%$ increase in the maximum radiation level at any external surface of the package when it were subjected to the drop test under the normal conditions of transport. If a shielding thickness of IP-2 transport package is thick, a bolted lid type may prevent a loss or dispersal of the radioactive contents than the door type of ISO containers which are generally used as a type IP-2 transport package. In this paper, to evaluate the effect of drop directions on the bolt tension and the coherence of a bolt, the drop tests of preliminary small model are tested and evaluated for seven directions before the drop test of a type IP-2 transport package with a bolted lid type under the normal conditions of transport. Seven drop directions which are a bottom-vertical drop, a lid-vortical drop. a horizontal drop and four corner drops have been carried out. Using a force sensor, the bolt tension during the drop impact is measured. The coherence of bolt is evaluated by the difference between the fastening torque of bolt before a drop test and the unfastening torque of bolt after a drop impact.

• Journal of the Korean Society for Nondestructive Testing
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• v.21 no.6
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• pp.598-606
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• 2001

Recently, semiconductor packages trend to be thinner, which makes difficult to detect defects therein. A preconditioning test is generally performed to evaluate the reliability of semiconductor packages. The test procedure includes two scanning acoustic microscope (SAM) tests at the beginning and end of the entire test, in order to help detect physical defects such as delaminations and package cracks. In particular, of primary concern are package cracks and delaminations caused by moisture absorbed under ambient conditions. This paper discusses the failure mechanism associated with the moisture absorbed and encapsulated in semiconductors, and the use SAM to detect failures such as tracks and delaminations grown during the preconditioning test.

• Journal of Distribution Science
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• v.22 no.4
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• pp.37-46
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• 2024

Purpose: Social media influencers (SMIs) have become significant sources of information influencing their followers' purchase intentions; few studies have been published on the effect of the number of followers and package tour prices on followers' purchase intention within the Vietnam travel industry utilizing naïve theories. This study examined the relationship between the number of followers and purchase intention and tested the moderating role of package tour price. Research Design, data and methodology: A 2 (number of followers: high vs. medium) × 2 (package tour price: high vs. low) between-subjects factorial design was used. 395 Vietnamese students (114 men, 281 women; M_age = 19.99, SD_age = 1.25) from Thuongmai University participated in the study. ANOVA and PROCESS MARCO were used to test hypotheses. Results: Findings indicate that participants show a higher purchase intention for SMIs with a higher number of followers than those with a medium one. When the package tour price is high, participants with a medium number of followers show a greater purchase intention than those with a high one. Conclusion: This recommendsthat tourism managers collaborate with SMIs with a high number of followers when the package tour price is low and with SMIs with medium ones when the package tour price is high.

• Particle and aerosol research
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• v.9 no.4
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• pp.253-260
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• 2013

For a vertical atmospheric aerosol distribution measurement, a very compact and light particle sampling package is developed. This package includes a compact optical particle counter (Hy-OPC), a light and small condensation particle counter (Hy-CPC), sensors (GPS, wind velocity, temperature, humidity), and a communication and system control board. This package is attached to He balloon and the altitude is controlled by a winch. Using this system the vertical particle size distribution was measured. The test results showed that the ground base atmospheric particle measurement result may be a lot different from that high above the ground.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.3
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• pp.853-858
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• 2010

DRAM package substrate has been demonstrated using a thick alumina layer produced by aluminum anodization process. To apply a transmission-based design methodology, 2 dimensional electromagnetic simulation is performed. The design parameters including signal line width/spacing and alumina's thickness are optimized based on the simulation analysis and are verified with the fabrication and the measurement of the test patterns on the anodic alumina substrate. DDR2 DRAM package is chosen as a design vehicle. Aluminum anodization technique has been applied successfully to fabricate new DRAM package substrate.