• Asian-Australasian Journal of Animal Sciences
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• v.16 no.11
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• pp.1695-1700
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• 2003

A total of 30 pork loin sections were utilized to evaluate the effects of FIR ceramic sheet in PE and vacuum package on preserving the quality of chilled pork stored at 4 and $0^{\circ}C$. Based on meat color, results indicated that pork loin packaged in ceramic sheet and control treatment showed that the samples of the control treatment tended to darken gradually in comparison with the samples at 0 day, but FIR treatment had few changes. Among the total plate counts of sliced loin in PE and loin in vacuum package under different storage times at 4 and $0^{\circ}C$, results showed that FIR ceramic sheet package treatment had lower total plate counts and significant differences (p<0.05). In VBN value, both treatments tended to rise high with the increasing of storage time, but the FIR treatment was significantly lower (p<0.05) than the control treatment. Its results had a corresponding relationship with the total plate counts. Regarding the drip loss of sliced loin in PE and loin in vacuum package, it showed that FIR ceramic sheet package treatment had lower drip loss and significant differences (p<0.01). These results showed that the use of FIR ceramic sheet package, including PE and vacuum package, is an effective method of maintaining the quality of meat.

• Journal of the Semiconductor & Display Technology
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• v.19 no.1
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• pp.29-35
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• 2020

The cure characteristics of three kinds of naphthalene type epoxy resins(NET-OH, NET-MA, NET-Epoxy) with a 2-methyl imidazole(2MI) catalyst were investigated for preparing sheet epoxy molding compound(SEMC) for wafer level package(WLP) applications, comparing with diglycidyl ether of bisphenol-A(DGEBA) and 1,6-naphthalenediol diglycidyl ether(NE-16) epoxy resin. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The NET-OH epoxy resin represented an n-th order cure mechanism as like NE-16 and DGEBA epoxy resins, however, the NET-MA and NET-Epoxy resins showed an autocatalytic cure mechanism. The NET-OH and NET-Epoxy resins showed higher cure conversion rates than DGEBA and NE-16 epoxy resins, however, the lowest cure conversion rates can be seen in the NET-MA epoxy resin. Although the NETEpoxy and NET-MA epoxy resins represented higher cure reaction conversions comparing with DGEBA and NE-16 resins, the NET-OH showed the lowest cure reaction conversions. It can be figured out by kinetic parameter analysis that the lowest cure conversion rates of the NET-MA epoxy resin are caused by lower collision frequency factor, and the lowest cure reaction conversions of the NET-OH are due to the earlier network structures formation according to lowest critical cure conversion.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.41 no.8
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• pp.19-26
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• 2004

High performance packages must provide excellent transmission characteristics. In face-up ceramic packages, however, parasitic characteristics of bondwires are not negligible at millimeter-wave frequencies. Consequently, the electrical performance of ceramic packages is degraded. In をis paper, we propose a new millimeter-wave ceramic package feed-through having Embedded Metal Sheets (EMS). The package that contains double-bondwire interconnections is analyzed by the FEM (Finite Element Method) and measured from 20 to 50GHz. As a result, the proposed package having Embedded Metal Sheets (EMS) achieved 0.85dB, 0.4dB insertion loss improvement on the conventional and the double bondwires buried in epoxy ( $\varepsilon_{{\gamma}}$/ = 4) ceramic package respectively to 47GHz. This improved ceramic package will be useful for MMICs modules and small ceramic packages developments.amic packages developments.

• Journal of the Korean Society of Food Science and Nutrition
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• v.28 no.2
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• pp.429-437
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• 1999

A mathematical model was established for estimating changes in pressure and volume of permeable kimchi packages. The model comprises the CO2 gas production from kimchi and permeation of O2, CO2 and N2 through the permeable film or sheet. Using the developed model, the effects of various packaging variables on the pressure and volume changes were analyzed for rigid and flexible packag es of kimchi(3% salt content) at 15oC, and then effect of storage temperature was also looked into. In case of rigid pack of 400g, using the plastic sheet of high CO2 permeability and initial vacuumizing can help to relieve the problem of pressure build up. The lower fill weight can further reduce the pressure, but will result in higher packaging cost. For the flexible package of 3 kg, highly permeable films such as low density polyethylene(LDPE) and polypropylene can reduce the volume expansion. Higher ratio of CO2 permeability to O2 and N2 permeabilities are effective in reducing the volume expansion. Increased surface area cannot contribute to reduction of volume expansion for highly permeable flexible packages of kimchi. For the impermeable packages, pressure and volume at over ripening stage (acidity 1.0%) increase with decreased temperature, while those at optimum ripening stage(acidity 0.6%) change little with temperature. Pressure of permeable rigid LDPE package increases with tem perature at any ripening stage, and temperature affects the volume of flexible LDPE package very slightly. Experimental verification of the present results and package design with economical consid eration are needed as a next step for practical application.

• Journal of the Korean Magnetics Society
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• v.11 no.2
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• pp.50-57
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• 2001

Magnetic inductive probe was designed and assembled for sensing the residual stress developed in the ferromagnetic thin sheet. The residual stress measurement system with this probe could resolve the residual stresses developed in the sheet in terms of principal stress orientation, and magnitude of the principal stress. It was consumed that the obtained probe output voltage from the qualified ferromagnetic Fe-42Ni lead frame sheet and quality-rejected sheet is effectively determined using the developed device. The lead frame sheet which has accumulated a high level of residual stress always showed a distinctive stress distribution and magnitude compared with those of qualified lead frame sheet. Those differences were well resolved as functions of input current or used frequency.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.109-119
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• 2003

o In order to start SIP Project .Marketing (& ASIC team) should present biz planning, schedule, device/SIP specs., in SIP TFT prior to request SIP development for package development project. .In order to prevent (PCB) revision, test, burn-in, & quality strategy should be fixed by SIP TFT (PE/Test, QA) prior to request for PKG development. .Target product price/cost, package/ test cost should be delivered and reviewed. o Minimum Information for PCB Design, Package Size, and Cost .(Required) package form factor: size, height, type (BGA, QFP), Pin count/pitch .(Estimated) each die size including scribe lane .(Estimated) pad inform. : count, pitch, configuration(in-line/staggered), (open) size .(Estimated) each device (I/O & Core) power (especially for DRAM embedded SIP) .SIP Block diagram, and net-list using excel sheet format o Why is the initial evaluation important\ulcorner .The higher logic power resulted in spec. over of DRAM Tjmax. This caused business drop longrightarrow Thermal simulation of some SIP product is essential in the beginning stage of SIP business planning (or design) stage. (i.e., DRAM embedded SIP) .When SIP is developed using discrete packages, the I/O driver Capa. of each device may be so high for SIP. Since I/O driver capa. was optimized to discrete package and set board environment, this resulted in severe noise problem in SIP. longrightarrow In this case, the electrical performance of product (including PKG) should have been considered (simulated) in the beginning stage of business planning (or design).

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.185.2-185.2
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• 2014

We have studied the atomic and electronic structure of graphene nanoribbons (GNRs) on a hexagonal boron nitride (h-BN) sheet with intercalated atoms using first-principles calculations. The h-BN sheet is an insulator with the band gap about 6 eV and then it may a good candidate as a supporting dielectric substrate for graphene-based nanodevices. Especially, the h-BN sheet has the similar bond structure as graphene with a slightly longer lattice constant. For the computation, we use the Vienna ab initio simulation package (VASP). The generalized gradient approximation (GGA) in the form of the PBE-type parameterization is employed. The ions are described via the projector augmented wave potentials, and the cutoff energy for the plane-wave basis is set to 400 eV. To include weak van der Waals (vdW) interactions, we adopt the Grimme's DFT-D2 vdW correction based on a semi-empirical GGA-type theory. Our calculations reveal that the localized states appear at the zigzag edge of the GNR on the h-BN sheet due to the flat band of the zigzag edge at the Fermi level and the localized states rapidly decay into the bulk. The open-edged graphene with a large corrugation allows some space between graphene and h-BN sheet. Therefore, atoms or molecules can be intercalated between them. We have considered various types of atoms for intercalation. The atoms are initially placed at the edge of the GNR or inserted in between GNR and h-BN sheet to find the effect of intercalated atoms on the atomic and electronic structure of graphene. We find that the impurity atoms at the edge of GNR are more stable than in between GNR and h-BN sheet for all cases considered. The nickel atom has the lowest energy difference of ~0.2 eV, which means that it is relatively easy to intercalate the Ni atom in this structure. Finally, the magnetic properties of intercalated atoms between GNR and h-BN sheet are investigated.

• Journal of Software Assessment and Valuation
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• v.13 no.1
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• pp.15-21
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• 2017

Analyzing a software package which is consisted of big numbers of files takes enormous costs and time. Therefore, SPDX (Software Package Data Exchange) working group collaborate with Linux Foundation published a software information(metadata) specification: SPDX. On the first half of 2017, the specification contains seven chapters and 66 items, according to Ver 2.1 of SPDX spec. It prefers Tag/Value or RDF forms but also supports spreadsheet form. In this paper, we introduce SPDX parsing & validation tools to check the validity of SPDX document. We'll develop SPDX document generator to manage software package more efficiently for our next target.

• Journal of the Korean Ceramic Society
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• v.34 no.6
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• pp.601-610
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• 1997

In cofiring of multilayered alumina with tungsten, the change of camber with lamination condition was experimented and the effect of sintering shrinkage of alumina and tungsten was investigated. From the exact measurement of sintering shrinkage of tungsten thick film, as lamination pressure increased, the sintering shrinkage of alumina decreased but that of tungsten thick film was not changed. So it was though that the main factor which induced the sintering shrinkage difference between ceramics and metal with lamination condition was the change of sintering shrinkage of ceramics. In case of high lamination pressure, high green sheet density, the cofired specimen showed low camber due to low shrinkage difference between alumina and tungsten and there was a linear relation between camber and shrinkage difference. It was found that this shrinkage difference could change the thickness of tungsten film and the microstructure within via hole during cofiring.

• Journal of Wellness
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• v.6 no.1
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• pp.51-61
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• 2011

The purpose of this study was to identify the component factors of professional sport team brand equity and to empirically examine factors composed of it's brand equity. The subjects of this study was the group that spectator professional sport game. For those sheet, judged to be insincere and to be unsuitable for the purpose of this study, and were missing questions excluded. SPSS 13.0 for window statistics package and AMOS 5.0 for window statistics package were used for data analysis. The goodness of the model was confirmed by data analysis and then the hypotheses testing were conducted. The findings are as follows: Firstly, brand associations(rivalry, commitment, play, socialization, success, history) have a significant effect on brand loyalty. But brand mark didn't have a significant effect on brand loyalty. Secondly, brand awareness(identification, internalization) have a significant effect on brand loyalty.