• Proceedings of the KIEE Conference
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• 1999.11b
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• pp.297-299
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• 1999

The B-coefficient method is well-known and universally used method for its simplicity and computation speed. However, the B-coefficient method has a weak point of accuracy when it is applied to the ill-conditioned systems where generators produce excessive reactive power. This paper describes the developed module to be applied to commercial program package of calculating the penalty factors by Jacobian method. The effectiveness of the proposed program has been demonstrated using the IEEE 30 bus system.

• Journal of Welding and Joining
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• v.10 no.2
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• pp.32-42
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• 1992

A method of optimization of process parameters in Arc Welding has been discussed in this paper. The method of investigation is based on the numerical calculation of weld bead by a finite element method and non-linear optimization technique is applied to estimated the optimization process parameters from the numerical calculation. The common package program(ANSYS 4.4A) was used to obtain the process parameters for a thin plate arc welding (TIG, CO$_{2}$). The results on some test are satisfactory and the used method of this paper is a useful guide to the optimum welding condition.

• Proceedings of the KIEE Conference
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• 1998.07a
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• pp.209-213
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• 1998

In the paper, we present the design procedure and analysis the fundamental characteristics for Linear DC Motor(LDM) using permeance method and finite element method (FEM). Designed LDM is made of two permanent magnets, three iron core and armature windings. For the design of the LDM, first of all it is necessary to calculate the air gap flux density and thrust force, after that to determine core size, the numbers of winding turns, winding width, etc. To demonstrate the method of caculation yields the right results, we used Maxwell program package for computing magnetic fields. Finally we find that the proposed design procedure in this paper is effective to design of LDM.

• Journal of the Korean Society of Safety
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• v.11 no.4
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• pp.42-48
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• 1996

Since the fatigue phenomenon is characterized as a probability feature and test data cannot be easily collected number its small sample data are uncertain. Therefore, statistical evaluation methods should necessarily be introduced into data evaluation. With such a basic concept in mind, this study attempted to apply conventional statistical processing methods to the fatigue data and thereby present a new evaluation method in consideration of the fact that the fatigue test is usually performed within a limited number. That is a package evaluation method was adopted which co-realtes parameters between different levels of capacity in E-N or S-N level. So far fatigue limits have been found by means of stiarcase method. But it was also disclosed that this new method has its own disadvantage because limited frequencies are not duely considered.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2004.04a
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• pp.21-26
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• 2004

This research presents a modeling and a manufacturing method of insert type milling cutters such as face cutter, flat endmill and ball endmill. The methods introduced in this paper adopts the multi-tasking 5-axis machining that is increasing machining accuracy of holder and position accuracy of bolting points. So this can be used in the basic document of the total package program that involves modeling and manufacturing module in various insert cutters.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.10a
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• pp.139-143
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• 2001

In manufacturing process of semiconductor package, thermal stress owing to high temperature in moulding and bubbles generated in chip bonding process become main causes to producing void. Therefore, on this study we evaluated quantitatively void size by ultrasonic spectroscopy method which analyze the frequency of this received pulse using pulses with broad band frequency, and after destructive test we verified effectiveness of sizing void by ultrasonic spectroscopy as we find error degree between the real size of void and the sizing void by ultrasonic spectroscopy.

• Journal of the Korean Society for Precision Engineering
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• v.10 no.3
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• pp.182-190
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• 1993

In manufacturing process of semiconductor package, the thermal stress owing to high temperature in moulding and the bubbles generated in chip bonding process become main causes to produce void. On this study we evaluated quantitatively void size by use of ultrasonic spectroscopy method which analyze the reflective pulses with broad band frequency in frequency domain, and after destructive testing we verified effectiv- eness of sizing void by use of ultasonic spectroscopy.

• Journal of applied mathematics & informatics
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• v.6 no.2
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• pp.503-512
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• 1999

The purpose of this paper is to introduce the (Toeplitz) quadrature method for solving fredholm integral equations of the second kind with mildly singular kernels. We are presented some numerical examples for the computation of the error estimate using the MathCad package.

• Proceedings of the KIEE Conference
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• 1987.07b
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• pp.1065-1068
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• 1987

This study is to show the method of corresponding points-detection by sampling and normalizing. And it explains the procedures of the animation package which generate animation through the collation of image codes.

• 전기의세계
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• v.27 no.1
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• pp.56-63
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• 1978

A new method is suggested for the bus active power vs. line power flow sensibility bector, applying the Optimally-Ordered Triangular Factorization Technique, and new algorithms are derived for the optimum measures against overloaded lines and transformers resulting from contingency analysis. According to the algorithms an online-purpose FORTRAN computer program package is developed and tested or the actual 48-bus, 91-line power system with good results.