• 대한기계학회논문집A
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• 제28권9호
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• pp.1408-1414
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• 2004

The use of flip-chip technology has many advantages over other approaches for high-density electronic packaging. ACF (anisotropic conductive film) is one of the major flip-chip technologies, which has short chip-to-chip interconnection length, high productivity, and miniaturization of package. In this study, thermal fatigue lift of ACF bonding flip-chip package has been predicted. Elastic and thermal properties of ACF were measured by using DMA and TMA. Temperature dependent nonlinear hi-thermal analysis was conducted and the result was compared with Moire interferometer experiment. Calculated displacement field was well matched with experimental result. Thermal fatigue analysis was also conducted. The maximum shear strain occurs at the outmost located bump. Shear stress-strain curve was obtained to calculate fatigue life. Fatigue model for electronic adhesives was used to predict thermal fatigue life of ACF bonding flip-chip packaging. DOE (Design of Experiment) technique was used to find important design factors. The results show that PCB CTE (Coefficient of Thermal Expansion) and elastic modulus of ACF material are important material parameters. And as important design parameters, chip width, bump pitch and bump width were chose. 2$^{nd}$ DOE was conducted to obtain RSM equation far the choose 3 design parameter. The coefficient of determination ($R^2$) for the calculated RSM equation is 0.99934. Optimum design is conducted using the RSM equation. MMFD (Modified Method for feasible Direction) algorithm is used to optimum design. The optimum value for chip width, bump pitch and bump width were 7.87mm, 430$\mu$m, and 78$\mu$m, respectively. Approximately, 1400 cycles have been expected under optimum conditions. Reliability analysis was conducted to find out guideline for control range of design parameter. Sigma value was calculated with changing standard deviation of design variable. To acquire 6 sigma level thermal fatigue reliability, the Std. Deviation of design parameter should be controlled within 3% of average value.

• 전력전자학회논문지
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• 제10권5호
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• pp.481-487
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• 2005

제안한 유도가열 시스템은 증류탑 장치에 사용되는 특수충진체에 의한 열교환기술과 IH(Induction-Heating)전자유도가열용의 특수한 고주파 전력회로 기술을 응용한 차세대 가열방식이다. 특히 일체의 연소과정이 없다는 점에서 작업환경의 개선이 가능하며 본 기술은 IGBT대응의 고주파 인버터를 사용하여 상용교류로부터 수[kHz]의 고주파 교류를 발생시킬 수 있다. 본 논문에서는 절연체 용기 내에 특수 스텐레스 발열체부하를 수납하여 용기 외부의 고주파 공진형 인버터 접속의 워킹코일로부터 비접촉 상태로 전자유도 와전류를 구조체에 흘림으로서 발열하게 되는 새로운 유체가열방식을 제안한다. 그리고 5[kW]급 풀-브릿지 공진형 인버터 시스템과 공진부하의 동작해석, 특성분석 및 본 시스템을 이용한 고효율 스팀 발생장치의 개발과 시스템의 응용에 대해 논하였다.

• Journal of Welding and Joining
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• 제24권2호
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• pp.64-70
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• 2006

The 3-dimensional (3D) chip stacking technology is a leading technology to realize a high density and high performance system in package (SiP). There are several kinds of methods for chip stacking, but the stacking and interconnection through Cu filled through-hole via is considered to be one of the most advanced stacking technologies. Therefore, we studied the optimum process of through-hole via formation and Cu filling process for Si wafer stacking. Through-hole via was formed with DRIE (Deep Reactive ion Etching) and Cu filling was realized with the electroplating method. The optimized conditions for the via formation were RE coil power of 200 W, etch/passivation cycle time of 6.5 : 6 s and SF6 : C4F8 gas flow rate of 260 : 100 sccm. The reverse pulsed current of 1.5 A/dm2 was the most favorable condition for the Cu electroplating in the via. The Cu filled Si wafer was chemically and mechanically polished (CMP) for the following flip chip bumping technology.

• 한국포장학회지
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• 제26권2호
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• pp.61-69
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• 2020

As post-harvest processes of onions are carried by a 20 kg-net package which results in high-cost and low-efficiency, especially, the insufficient drying and physical damage of onions after harvesting leads to a huge second loss in storage, we had developed a low-cost, high-efficiency post-harvest bulk handling machinery system by collecting onions on a farm using ton-bags, drying with forced air circulation, and sorting/packaging. The post-harvest bulk handling machinery system consisted of 6 devices, and this study designed an automatic feed hopper with a feeding rate control device, an inclined belt conveyor with a two-step chute, and an automatic pallet unloading device for feeding onions into the sorting/packing line. This study also analyzed the performance and control of the total system. The device had 1-ton handling capacity, but the operational condition was set to increase the capacity. The three-step filling method of pallet by the velocity control of the inclined belt conveyor was applied in the post-harvest bulk handling machinery system for the prevention of physical damage. If one worker was set to operate the total system, the time required to complete one palletized load was approximately 5 minutes and 5 seconds. The calculated daily handling capacity was approximately 94 tons, when the daily actual working time was 8 hours. When the developed system was applied to the managerial size of 2,000 ton, the processing cost per ton of the system was decreased by 19.5%, compared with the existing 20 kg-net package-based handling. The developed post-harvest bulk handling machinery system would be a good substitute for the rapid decline and aging of rural labor.

• 대한인간공학회지
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• 제30권5호
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• pp.659-669
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• 2011

Objective: The aim of this study is to suggest a package layout guideline for low-floor bus by interview with passengers and observations of their behavior. Background: Increasing attention has been introduced the low-floor bus to be more suitable for use by transportation handicapped. Complex issues are involved in providing comfortable services to all people. We are going to suggest package layout guidelines for more comfortable and suitable travel to all people. Method: The two times of survey and video observation sessions were conducted on low-floor buses in Seoul; (1) a finding of potential issues in the first session, (2) a confirming of issues from the last session. Results: The three of major issues were founded in this study; (1) difficulties in supporting body when standing, (2) difficulties in sitting on front wheel pan seat, (3) difficulties in passing through the aisle. Conclusion: There were clear differences between public and transportation handicapped in using some tools which are used for support body such as roof hand rails, side hand rails, and hand rail rings. Some of design problems were founded to improve from the perspective of ergonomics and universal design. Such differences and design guidelines have to be considered in bus design as well as commercial vehicle. Application: The proposed design guidelines can be used to development of low-floor bus and other public transportations.

• 한국포장학회지
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• 제17권2호
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• pp.39-42
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• 2011

신선 편의가공된 절단양파제품의 적정 포장방법을 개발하고자 LDPE $30{\mu}m$, PD900과 PD941 필름을 이용한 수동형 MA 포장의 적용 가능성을 연구하였다. 포장필름을 달리하여 $1^{\circ}C$에서 38일간 저장하면서 포장내의 가스조성, 중량 손실, 부패율, 색도, 경도 등을 측정하였다. 기체 투과도가 낮은 PD900포장이 곰팡이 부패나 육안적인 품질손상 없이 38일 동안 저장되는 데에 무리가 없었고, 색택과 가용성 고형분 함량에서도 비교적 양호하였다.

• 마이크로전자및패키징학회지
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• 제25권4호
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• pp.41-45
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• 2018

패널 레벨 패키지(Panel Level Package)에서 공정 단계별로 발생하는 휨(warpage)에 대해 유한요소법을 이용하여 전산모사를 진행하였다. $5{\times}5mm^2$ 크기의 실리콘 칩이 총 221개가 포함된 $122.4{\times}93.6mm^2$ 크기의 패널에 대해서 (1) EMC 몰딩, (2) detach core 부착, (3) 가열, (4) 캐리어 분리, (5) 냉각의 5 단계에 대해서 해석을 수행하였으며, 캐리어와 detach core 소재로 유리와 FR4의 조합이 휨 현상에 미치는 영향을 조사하였다. 캐리어 및 detach core의 소재에 따라 공정 단계별로 휨의 경향이 다르게 나타나고 있으나, 최종적으로는 유리를 캐리어로 사용하는 경우에 detach core의 소재와 관계없이 FR4 캐리어에 비해 낮은 휨 값을 나타내었으며 유리 캐리어와 유리 detach core의 조합에서 가장 낮은 휨 값이 관찰되었다.

• 디지털융복합연구
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• 제19권1호
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• pp.373-378
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• 2021

본 연구는 밀키트(Meal Kit) 제품 정보의 사용자 경험 디자인 연구로서 구매자에게 필요한 제품 정보와 사용 편의성을 위한 필요사항을 도출하고 개선방안을 제안하는 데 목적이 있다. 밀키트 제품을 구매할 때 영양 섭취에 관한 정보 표기와 패키지 디자인, 환경에 관한 문제를 국내 밀키트 브랜드 피코크와 프레시지 2종을 비교 분석하였다. 연구방법으로는 1차로 문헌 연구와 선행연구를 통해 밀키트 제품 구매 요인 7가지 요소를 도출하여 설문 조사를 진행하였고, 2차로 30대 1인 가구 남녀 4명씩, 총 8명을 대상으로 심층 인터뷰를 진행하였다. 연구 결과, 구매자에게 만족을 주는 요인으로는 조리 과정, 음식, 맛/영양, 패키지, 편리성, 가격, 정보 순으로 나타났으며, 과대포장 또한 문제점으로 드러났다. 이를 통해 밀키트 제품의 개선사항 도출과 발전 방안을 제시할 수 있었다. 본 연구가 향후 1인 가구의 식생활개선과 밀키트 제품 개발에 도움을 줄 것으로 기대한다.

• 대한원격탐사학회지
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• 제37권3호
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• pp.567-575
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• 2021

고해상도 스테레오 위성영상에서 제공되는 초기 RPC의 보정과 이로부터 생성된 DEM 보정을 위해서는 지상기준점 획득이 선행되어야 한다. 기준점 획득은 현장답사와 GPS 측량, 지상기준점에 대응하는 영상좌표 독취 등을 수행해야 하는 매우 번거로운 작업이다. 그리고 접근이 힘들거나 불가능한 지역(갯벌, 극지대, 화산지대 등)에는 기준점 설치와 측정이 힘들기 때문에 이를 대체할 수 있는 방법이 필요하다. 이 연구에서 WorldView-2 위성영상과 초기 RPC로부터 제작된 DEM 보정을 위해 기준점의 지상좌표와 영상좌표 측량을 피하고 기 구축된 지상좌표 패키지만을 활용한 3차원 표면매칭 기법을 제안한다. 국토지리정보원 국토정보플랫폼에서 공공삼각점의 위치정보를 획득하고 제작된 DEM과 3차원 표면매칭을 실시하여 DEM을 보정하였다. 3차원 표면매칭으로 얻은 3축 이동과 회전량의 정확도를 평가하기 위하여 검사점으로 확인한 결과 평면오차는 2 m, 수직오차는 1 m 이내의 결과를 얻을 수 있었다.

• 식품과학과 산업
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• 제50권2호
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• pp.12-26
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• 2017

Processing steps such as washing and cutting, involved in preparing fresh-cut produce causes tissue damage, leading to rapid quality deterioration. Major defects of fresh-cut produce are discoloration, softening, off-odor development, and microbial growth. Packaging of fresh-cut produce has been changed to reduce these quality problems. Flexible packaging film is widely used to pack fresh-cut produce. Vacuum packaging was the popular packaging method in the beginning of fresh-cut industry in Korea. Vacuum packaging creates high $CO_2$ and low $O_2$ levels to control browning of fresh-cut produce. However, these conditions induce some visual defects and off-odor development. Discoloration problem was also found when fresh-cut produce was packaged with conventional packaging film or plastic tray. Modified atmosphere (MA) packaging is effective for prolonging shelf-life of fresh-cut produce by decreasing $O_2$ and increasing $CO_2$ concentration in the package. Retail MA packaging using different oxygen transmission rate (OTR) film and micro-perforated film has started to be applied to fresh-cut produce in Korea. Proper MA package design that provides optimum range of $O_2$ and $CO_2$ partial pressures is one of the major challenges in the industry. An initial package flushing with $N_2$ or an low $O_2$/high $CO_2$ atmosphere is also used to more rapidly establish steady-state MA condition. Film OTR and $O_2$ flushing affects the fermentative volatile production, off-odor development, electrolyte leakage, discoloration, $CO_2$ injury, microbial population of fresh-cut produce. There is also a demand for convenient packaging to attract consumers. Rigid fresh-cut produce container for retail market has increased since the packaging provides excellent protection from physical damage during transport. Rigid tray used as actual serving vessel for the consumer is increasing in Korea. The tray with flexible lid to wrap or seal fresh-cut produce is more and more gaining popularity. Further practical technology to control quality change and microbial growth for each fresh-cut product has been studied since various fresh-cut items were required. The fresh-cut industry also focuses on searching for more convenient and environmentally friendly packaging.