• 마이크로전자및패키징학회지
• /
• 제14권4호
• /
• pp.9-14
• /
• 2007

본 연구에서는 가속화 조건에서의 비전도성 접착제가 사용된 플립칩 패키지의 열적 신뢰성에 관하여 평가하였다. 실리콘 칩에 $17{\mu}m$두께의 Au 범프를 형성하고 무전해 Ni/Au 도금과 Cu 패드의 두께가 각각 $5{\mu}m$와 $25{\mu}m$로 형성된 연성 기판을 사용하여 플립칩 패키지를 형성하였다. 유리전이온도가 $72^{\circ}C$인 비전도성 접착제를 사용하여 플립칩을 접합시킨 후 열충격 시험과 항온항습 시험을 실시하였다. 열충격 싸이클과 항온항습 유지 시간이 증가할수록 플립칩 패키지의 전기 저항이 증가하는 것을 확인할 수 있었다. 이는 Au 범프와 Au 범프 사이의 균열, 칩과 비전도성 접착제 또는 기판과 비전도성 접착제 사이의 층간 분리에 의한 것으로 사료된다. 또한 항온항습 하에서의 전기 저항의 변화가 열충격하에서 보다 큰 것을 확인할 수 있었다. 따라서 비전도성 접착제가 사용된 플립칩 패키지는 온도보다 습기에 더욱 민감하다는 것을 알 수 있었다.

• Transactions on Electrical and Electronic Materials
• /
• 제18권2호
• /
• pp.59-61
• /
• 2017

This research was analyzed thermal characteristics that was appointed disadvantage when smart LED driver ICs was packaged and we applied extracted thermal characteristics for optimal layout design. We confirmed reliability of smart LED driver ICs package without additional heat sink. If the package is not heat sink, we are possible to minimize package. For extracting thermal loss due to overshoot current, we increased driver current by two and three times. As a result of experiment, we obtained 22 mW and 49.5 mW thermal loss. And we obtained optimal data of 350 mA driver current. It is important to distance between power MOSFET and driver ICs. If the distance was increased, the temperature of package was decreased. And so we obtained optimal data of 3.7 mm distance between power MOSFET and driver ICs. Finally, we fabricated real package and we analyzed the electrical characteristics. We obtained constant 35 V output voltage and 80% efficiency.

• Food Science and Biotechnology
• /
• 제18권1호
• /
• pp.73-78
• /
• 2009

Processed meatball products were packaged in a passive package without oxygen scavenger as 1 control and 3 active packages of which have PP-based oxygen scavenger master batch materials (OSMB) of 40, 80, and 100%(w/w) in the middle layer and stored at 23 and $30^{\circ}C$ up to 9 months. Quality changes of packaged products were evaluated by measuring the oxygen concentration of the headspace in containers, thiobarbituric acid (TBA), color, and flavor. The oxygen concentration of the package having 100% OSMB was lower than those of 40 and 80%. The color changes and TBA values of the meat ball in the package containing 100% OSMB were the least among the treatments. Using principal component analysis (PCA), the control showed more flavor change than the packages containing oxygen scavenger. As a result, all active packages could extend the shelf life of the meatball products compared with that of the passive package.

• 센서학회지
• /
• 제25권3호
• /
• pp.173-177
• /
• 2016

Tape casting ceramics technology has been adopted for the fabrication of solid state electrochemical $CO_2$ sensors and the packaging substrates. The fabricated $CO_2$ sensors exhibit a fast response and a good recovery with the almost theoretical sensitivity of 37 mV/decade, corresponding to a sensor operating temperature of 373 K. The two packaging methods, the wire bonding package and the surface- mounted on the ceramic package, were compared with respect to their power consumption and mass production feasibility. In terms of the ease of fabrication, the surface mount packaging technology is superior to the wire bonding technology but its power consumption is approximately twice that of the wired package.

• 한국재료학회지
• /
• 제22권11호
• /
• pp.587-590
• /
• 2012

Recently, the demand for the miniaturization of package substrates has been increasing. Technical innovation has occurred to move package substrate manufacturing steps into CMP applications. Electroplated copper filled trenches on the substrate need to be planarized for multi-level wires of less than $10{\mu}m$. This paper introduces a chemical mechanical planarization (CMP) process as a new package substrate manufacturing step. The purpose of this study is to investigate the effect of surfactant on the dishing and erosion of Cu patterns with the lines and spaces of around $10/10{\mu}m$ used for advanced package substrates. The use of a conventional Cu slurry without surfactant led to problems, including severe erosion of $0.58{\mu}m$ in Cu patterns smaller than $4/6{\mu}m$ and deep dishing of $4.2{\mu}m$ in Cu patterns larger than $14/16{\mu}m$. However, experimental results showed that the friction force during Cu CMP changed to lower value, and that dishing and erosion became smaller simultaneously as the surfactant concentration became higher. Finally, it was possible to realize more globally planarized Cu patterns with erosion ranges of $0.22{\mu}m$ to $0.35{\mu}m$ and dishing ranges of $0.37{\mu}m$ to $0.69{\mu}m$ by using 3 wt% concentration of surfactant.

• 패션비즈니스
• /
• 제27권2호
• /
• pp.108-123
• /
• 2023

Recent increase of eco-conscious trends and pleasure from Do It Yourself (DIY) activities have led to a surge in sales of package products bundling together clothing patterns and raw materials. However, a well-structured market system is yet to be established. We surveyed 460 women with sewing as a hobby who had purchased these DIY clothing pattern packages. The survey revealed that majority of respondents had their hobby for over five years. Choosing the right fabric to match clothing patterns presented a common challenge. Most participants owned a sewing machine and an overlocker, with price being the primary concern when purchasing a package. For guidance during the sewing process, participants preferred print materials featuring real-life images. Those with less sewing experience leaned towards video tutorials. Items of interest or those commonly created included blouses, shirts, and dresses. Desire for further learning in sewing and pattern-making was prominent, with a clear preference for online classes. Several strategies are recommended to enhance the appeal of DIY clothing package products, including broadening range of packages that incorporate fabric, offering supplementary educational resources to improve users' skills, implementing affordable pricing structures, supplying comprehensive creation guidelines, and making available design modification guides. These considerations could significantly boost customer satisfaction. This research intends to lay groundwork for understanding DIY clothing creation market, ultimately fostering production of highly desirable products. Insights of this study will prove instrumental in refining product development and devising effective marketing tactics, leading to a more rewarding consumer experience.

• 대한금속재료학회지
• /
• 제48권11호
• /
• pp.1035-1040
• /
• 2010

The research efforts on GaN-based light-emitting diodes (LEDs) keep increasing due to their significant impact on the illumination industry. Surface mount technology (SMT) is widely used to mount the LED packages for practical application. In surface mount soldering both the device body and leads are intentionally heated by a reflow process. We studied on the effects of multiple reflows on microstructural variation and joint strength of the solder joints between the LED package and the substrate. In this study, Pb-free Sn-3.0Ag-0.5Cu solder and a finished pad with organic solderability preservatives (OSP) were employed. A $Cu_6Sn_5$ intermetallic compound (IMC) layer was formed during the multiple reflows, and the thickness of the IMC layerincreased with an increasing number of reflows. The shear force decreased after three reflows. From the observation of the fracture surface after a shear test, partially brittle fractures were observed after five reflows.

• 디자인학연구
• /
• 제21권
• /
• pp.139-147
• /
• 1997

본 연구는 우리의 일상 생활에서 물건을 보호하며 이를 용기에 담아 운반하는 것과 넓은 의미의 포장은 인류의 역사와 더불어 시작된 지혜이며 인간의 삶의 질을 향상시킨다는 하나의 행위이다. 산업발달과 국민경제의 고도성장과 수출증대에 따라 포장산업은 국내외적으로 대량유통체제가 요청되고 있으며 이러한 유통체제에 적응키 위해 제품의 생산에서 소비에 이르는 유통과정을 일관하는 매체로서 중요한 산업이 되어가고 있다. 그러나 산업발달에 따른 다양해지는 제품과 포장의 급증으로 배출되는 포장 폐기물은 심각한 사회문제가 되고 있다. 그러므로 제품의 보호, 운송, 보관에 적합하게 하면서도 기능적으로 편리하게 하고 내용물을 소모한 뒤의 포장 폐기물 처리 문제에까지 고려하는 것이 오늘날의 문제이다. 따라서 일반소비자들은 환경 적으로 건전하다고 판단되는 제품을 구매하거나 재활용함으로써 일차적인 환경보존에 기여할 수 있어야 한다. 그러므로 본 논문은 포장의 1차용도의 개념에서 벗어나 2차용도인 재활용을 위한 새로운 포장기능을 널리 인식시키고 앞으로 디자인방향의 개선점을 고려해 봄에 있다.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
• /
• pp.79-84
• /
• 2002

The bottom-leaded plastic(BLP) packages have attracted substantial attention since its appearance in the electronic industry. Since the solder materials have relatively low creep resistance and are susceptible to low cycle fatigue, the life of the solder joints under the thermal loading is a critical issue for the reliability The represent study established a finite element model for the analysis of the solder joint reliability under thermal cyclic loading. An elasto-plastic constitutive relation was adopted for solder materials in the modeling and analysis. A 28-pin BLP assembly is modeled to investigate the effects of various epoxy molding compound, leadframe materials on solder joint reliability. The fatigue life of solder joint is estimated by the modified Coffin-Hanson equation. The two coefficients in the equation are also determined. A new design for lead is also evaluated by using finite element analysis. Parametric studies have been conducted to investigate the dependence of solder joint fatigue life on various package materials.

• 한국표면공학회지
• /
• 제56권1호
• /
• pp.77-83
• /
• 2023

The reliability of leadframe-based semiconductor package depends on the adhesion between metal and epoxy molding compound (EMC). In this study, the Ag surface was electrochemically treated in a solution containing silanes in order to improve the adhesion between Ag and epoxy substrate. After electrochemical treatment, the thin silane layer was deposited on the Ag surface, whereby the peel strength between Ag and epoxy substrate was clearly improved. The improvement of peel strength depended on the functional group of silane, implying the chemical linkage between Ag and epoxy.