• Title/Summary/Keyword: package materials

Search Result 623, Processing Time 0.031 seconds

Comparison of temperature measurements methods to investigate the causes of deformation of packaging materials during microwave heating (전자레인지의 가열조리 시 포장재의 열변형 원인 규명을 위한 온도 측정 방법 비교)

  • Yoon, Chan Suk;Lee, Hwa Shin;Pfeiffer, Thomas;Cho, Ah Reum;Moon, Sang Kwon;Lee, Keun Taik
    • Food Science and Preservation
    • /
    • v.23 no.3
    • /
    • pp.422-431
    • /
    • 2016
  • To investigate the causes of the thermal deformations of packaging materials when microwave-heating ready-to-eat sauce products packaged in stand-up pouches, patterns of temperature changes were determined using an infra-red thermal imaging camera, a thermo-sensitive tape, and a fiver-optic thermometer. The temperature distributions of spicy chicken sauce and Indian curry samples in a stand-up pouch were found to be uneven during micrewave heating. A sharp increase in the temperature was detected, especially above the filling layers and in the corners of sealing layers of the package. The temperature measurements using an infra-red thermal imaging camera are restricted to the surface, and therefore might underestimate the actual temperature. Using a thermo-sensitive tape, temperature up to $200^{\circ}C$ were measured in the spicy chicken sauce sample showing package deformation. When the temperature is measured using a fiber-optic thermometer, it is crucial to have precise sensor performance to accurately measure the temperature in a narrow hot-spot area of the package. In this experiment, the fiber-optic thermometer was attached to a GaAs crystal sensor, which obtained more sensitive and accurate temperature measurements than those by a convectional sensor.

Quality Characteristics of Small Package Kimchi according to Packing Material and Storage Temperature (포장재와 저장온도에 따른 소포장 김치의 품질특성)

  • Park, Hye-Young;Ahn, Ji-A;Seo, Hae-Jung;Choi, Hye-Sun
    • Korean journal of food and cookery science
    • /
    • v.27 no.1
    • /
    • pp.63-73
    • /
    • 2011
  • Cabbage (Baechu) Kimchi in its truncated form was placed in four different packing materials, Ny/PE/LLDP, OPP/AL/PE, PP and PET, and quality changes were observed during storage. Changes in pH and total acidity showed an x-shaped cross-curve as pH decreased and total acidity increased during storage. PP tray showed the slowest change at $5^{\circ}C$ with time. The pH was initially 6.25, but decreased to 4.12~4.16 at 20 days, and total acidity showed a 4 to 4.8-fold increase after 20 days of storage compared to the initial value. During storage at $5^{\circ}C$, total bacterial count and lactic acid bacterial count rapidly increased after 4 days. The total bacterial quantity decreased after a period of time and there were differences according to packaging material; OPP/AL/PE packaging showed the most dramatic decrease. Change in microbial count mostly followed a similar pattern to that of total acidity for all packaging materials. Changes in the color of Kimchi liquid, when examined by color index in $L{\cdot}b$/a form, rapidly decreased over time, similar to pH. Small Ny/PE/PP and OPP/AL/PE packages of Kimchi were examined for changes in free volume inside the packaging. After 13 days of storage at $5^{\circ}C$, the volume was 243 mL, but storage at $20^{\circ}C$ resulted in a volume of 372 mL, a more than 1.5-fold increase in free volume. There were changes in the quality characteristics of small package Kimchi according to storage temperature and packaging material, and large changes in pH, total acidity, and microbial count were evident upon storage at $5^{\circ}C$ for 8 days, which was the optimum palatability period. Mostly, PP treatment showed the slowest quality changes upon storage at $5^{\circ}C$. However, due to small package Kimchi's fast consumption system, the appropriate choice of packaging material must consider the product's turnover ratio. Further, the varieties of small package Kimchi should be diversified according to different consumer preferences by offering Kimchi with different maturity levels. Further, since the leading consumer base ranges in age from the teens to thirties, the development of various products targeting such consumers is necessary.

Grain Aging and Sensory Changes influenced by Milling and Packaging in Rice Storage (저장미 도정과 포장에 따른 고미화 및 식미 변화)

  • Lee, Ho-Jin;Kim, Tae-Hoon;Jeon, Woo-Bang
    • KOREAN JOURNAL OF CROP SCIENCE
    • /
    • v.36 no.3
    • /
    • pp.266-270
    • /
    • 1991
  • Storage in the form of brown or milled rice saves space and cut cost rather than storage of rough rice, the common way of grain storage in Korea. But, brown or milled rice may be more susceptable to grain aging and sensory change than rough rice. Rice stored in government warehouse for 20 months after harvest was hulled into brown or milled rice and packaged with kraft paper bag (paper package), polyprophylen (PP package), and polyethylene (PE package). Then, after those rice packages were stored under room condition for one year, we investigated germinability, fat acidity, and sensory change to determine milling and packaging effects. Germinability of rough and brown rice was decreased significantly after long-term storge. In germination rate, Chucheong cultivar was lower than Milyang #23, brown rice was lower than rough rice, but there was no differences within packaging materials. TTC test which had a significant correlation with germinability can be used as a handy procedure for predicting grain germination. Fat acidity was increased as the order of rough < milled < brown rice in terms of milling, and PP < paper < PE package in terms of packaging materials. Especially, storage of brown rice increased fat acidity above 30 mg KOH, indicating one of characteristics of grain aging. To prevent from high fat acidity it was necessary to store in forms of rough grain with paper or PP packaging and milled rice with paper, or PP, or PE packaging. In sensory test of stored grain, eating quality in brown rice was the worst because of acidification of fatty acid. Also, eating quality of stored grain became worse as fat acidity increased.

  • PDF

Disassembly of the Package/PCB on Wasted LED Light and their Characterizations (LED 조명 모듈에 장착된 패키지/PCB의 분리 및 특성)

  • Seunghyun Kim;Ha Bich Trinh;Taehun Son;Jaeryeong Lee
    • Resources Recycling
    • /
    • v.32 no.6
    • /
    • pp.3-9
    • /
    • 2023
  • Separation of LED packages from PCBs and analysis of the adhesive components was conducted to enhance the recycling potential of LED modules. LED package was separated from PCBs using heat treatment under optimal conditions: temperature of above 250 ℃ and time of 20 minutes. The separation equipment can be established using a hot air injector with controlling the rotational speed of the internal screw. The separation efficiency of each type of substrate (aluminum and glass fiber) was investigated with the thickness range of the adhesive materials (0.25-0.30 and 0.30-0.35 mm). Under the optimal conditions, the efficiency can reach to 97.5% for both types of substrates with adhesive materials of thickness 0.25~0.30mm. Characterization of the residual adhesive substances from the separated LED package and PCB using microwave digestion and ICP analysis showed that the residue contained of 95% of Sn, less than 5% of Cu and Ag.

V-Band filter using Multilayer MCM-D Technology (MCM-D 공정기술을 이용한 V-BAND FILTER 구현에 관한 연구)

  • Yoo Chan-Sei;Song Sang-Sub;Part Jong-Chul;Kang Nam-Kee;Cha Jong-Bum;Seo Kwang-Seok
    • Journal of the Institute of Electronics Engineers of Korea SD
    • /
    • v.43 no.9 s.351
    • /
    • pp.64-68
    • /
    • 2006
  • Novel system-on-package (SOP) - D technology to improve the mechanical and thermal properties of a MCM-D substrate was suggested. Based on this investigation, the two types of band pass filters for the V-band application with unique structure were designed and implemented using 2-metals, 3-BCB layers. The first type using distributed resonator had the insertion loss below 2.6 dB at 55 GHz and group delay was below 0.06 ns. For the second type with edge coupled structure, the insertion loss and group delay were 3 dB and 0.1 ns, respectively. Suggested MCM-D substrate with band pass filter can be used to evaluate mm-Wave system including flip-chip bonded MMIC.

Intermetallic Formation between Sn-Ag based Solder Bump and Ni Pad in BGA Package (BGA 패키지에서 Sn-Ag계 솔더범프와 Ni pad 사이에 형성된 금속간화합물의 분석)

  • Yang, Seung-Taek;Chung, Yoon;Kim, Young-Ho
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.9 no.2
    • /
    • pp.1-9
    • /
    • 2002
  • The intermetallic formation between Sn-Ag-(Cu) solders and metal pads in a real BGA package was characterized using SEM, EDS, and XRD. The intermetallic phase formed in the interface between Sn-Ag-Cu and Au/Ni/Cu pad is likely to be ternary compound of $(Cu,Ni)_6Sn_5$ from EDS analysis High concentration of Cu was observed in the solder/Ni interface. XRD analysis confirmed that $\eta -Cu_6 Sn_5$ type was intermetallic phase formed in the interface between Cu containing solders and Ni substrates and $Ni_3$Sn_4$ intermetallic was formed in the Sn-Ag solder/Ni interface. The thickness of intermetallic phase increased with the reflow times and Cu concentration in solder.

  • PDF

A Study on Low Residue Flux for Improving Flip Chip Non-wet and Reliability (Flip Chip Non-wet 개선 및 신뢰성 향상을 위한 Low Residue Flux 구현 방안 연구)

  • Lee, Hyunsuk;Kim, Minseok;Kim, Taehoon;Moon, Kiill
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.28 no.2
    • /
    • pp.45-50
    • /
    • 2021
  • As the difficulty of flip chip products increases, there is a growing interest in the material of flux, which is safe from the solder wetting and reliability. In the case of no clean flux, there is merit in terms of process efficiency because there is no cleaning process. But Cu migration and delamination can be occurred if the residue remains after the reflow process. In this study, major element materials, solvent and activator, are changed and confirmed effect of non-wet and reliability in the package environment. Stability of materials were secured through storage stability evaluation, and we found out non-wet zero materials through the application of two types of solvent and activator with different boiling point and the increase of activator content. After reliability test, no delamination was found in the plane analysis, which secured the final composition of low residue flux.

Study about decreasing methods of printing ink solvents residue amounts on plastic food package materials (플라스틱 포장재의 잔존 인쇄 용제 감소 방안)

  • An, Duek-Jun;Cho, Hoon-Il
    • KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
    • /
    • v.10 no.1
    • /
    • pp.1-6
    • /
    • 2004
  • Amount of residual ink solvent on the packaging materials from Korea, Japan and Europe was measured and compared. The amount of packaging materials from Korea was much higher than that of Japan and Europe. To reduce the residual amounts of ink solvent, aging condition of printed packaging materials including aging time and temperature was modified and evaluated. Aging with high temperature and short time ($60^{\circ}C$ and 24 hours) was more effective for reduction of residual amount of ink solvent than that with low temperature and long time. To find out change of reduction pattern of residual amount of solvent according to plastic packaging material, several monolayer and multilayer packaging materials were selected. Among the monolayer packaging materials, the amount of EVOH and PET was lower than that of polyolefin plastic film including PE and PP. PP/EVOH/PET among the selected multilayer film showed the lowest amount of residual ink solvent on food packaging materials. Result of this research revealed that the residual amount of ink solvent can be reduced by proper selection of aging condition with and by appropriate application of mutilayer plastic film.

  • PDF

Optimization of extrusion process for long-length multi-filaments of BSCCO 2223 superconductor tape (고온초전도 BSCC02223 장선재 제조를 위한 압출공정의 최적화)

  • Cho, Ki-Hyun;Choi, Jong-Ung;Yoo, Jim-Moo;Ko, Jae-Woong;Kim, Hai-Doo
    • 한국초전도학회:학술대회논문집
    • /
    • v.10
    • /
    • pp.230-235
    • /
    • 2000
  • The extrusion process for long-length multi-filaments of BSCCO 2223 superconductor tape has been investigated with aids of Finite Element Method and experimental inspection. Since the arrangement of filaments in matrix material has characteristic of rotational symmetry, a 2-dimensional commercial FEM package, DEFORM-2D, was adopted to simulate extrusion process with different variables such as hardness of sheath material, lengths of each filament and arrangement. From the FEM analysis, since the inner filaments move faster than the outer one, distribution of filaments is needed to be optimized. In the case of pure Ag matrix, undesirable non-uniform distribution of filament was obtained due to low hardness of sheath material. Dummy sample(brass (sheath) and talc powder(filament)), however, which has relatively high hardness of sheath material, had been produced with desirable results. Therefore, it is necessary to optimize hardness of sheath material, extrusion temperature and billet design.

  • PDF

Analysis of Chinese and Japanese consumers' preference for Korean home meal replacement product package design using conjoint analysis (컨조인트 분석을 활용한 중국과 일본 소비자의 한식 가정식사대용식 패키지 디자인 선호 분석)

  • You, Seon Young;Lee, Min A
    • Journal of Nutrition and Health
    • /
    • v.51 no.5
    • /
    • pp.480-487
    • /
    • 2018
  • Purpose: The study examined the Chinese and Japanese consumers' preference for Korean home meal replacement (HMR) product package designs using conjoint analysis. Methods: The questionnaire survey was completed by 270 consumers living in Beijing, China and Osaka, Japan, over the age of 20 years old, who had previously purchased or consumed a Korean HMR. Based on the attributes and levels within each attribute related to the Korean HMR product package design, 54 profiles were constructed. Of the 54 profiles, 11 combinations were selected using an orthogonal design, and the participants were asked to rank the 11 combinations in order of preference from top to bottom. Results: The relative importance of the Korean HMR product package design attributes were analyzed. Chinese consumers regarded illustration, ingestion form, concept, and brand name, in that order, to be most important. In the case of Japanese consumers, illustration, concept, ingestion form, and brand name, in that order, were most important. For the illustration attributes, in order of importance, Chinese consumers preferred raw materials, characters, and celebrities, and Japanese consumers preferred characters, raw materials, and celebrities. For the concept attributes, Chinese consumers favored, witty, traditional Korean, and modern concepts, whereas Japanese consumers favored witty, modern, and then traditional Korean concepts. For the ingestion form attributes, both Chinese and Japanese consumers preferred Ready To Eat (RTE), followed by Ready To Heat (RTH), and then Ready To Cook (RTC). For the brand name attributes, both Chinese and Japanese consumers preferred the localized brand name over the Korean brand name. Conclusion: Differences in the relative importance of Korean HMR product package design attributes were observed among Chinese and Japanese consumers, and there were differences in preference according to the levels within each attribute. These results are expected to provide useful basic data to assist in the future development of differentiated HMR package designs and marketing strategies to meet consumer needs in the market for Korean HMR in China and Japan.