• Coupled systems mechanics
• /
• v.8 no.4
• /
• pp.299-313
• /
• 2019

The paper represents computer modeling of the deformed state of physically nonlinear transversally isotropic bodies with hole. In order to describe the anisotropy of the mechanical properties of transversally-isotropic materials a structurally phenomenological model has been used. This model allows representing the initial material in the form of the coupled isotropic materials: the basic material (binder) considered from the positions of continuum mechanics and the fiber material oriented along the anisotropy direction of the original material. It is assumed that the fibers perceive only the axial tensile-compression forces and are deformed together with the base material. To solve the problems of the theory of plasticity, simplified theories of small elastoplastic deformation have been used for a transversely-isotropic body, developed by B.E. Pobedrya. A simplified theory allows applying the theory of small elastoplastic deformations to solve specific applied problems, since in this case the fibrous medium is replaced by an equivalent transversely isotropic medium with effective mechanical parameters. The essence of simplification is that with simple stretching of composite in direction of the transversal isotropy axis and in direction perpendicular to it, plastic deformations do not arise. As a result, the intensity of stresses and deformations both along the principal axis of the transversal isotropy and along the perpendicular plane of isotropy is determined separately. The representation of the fibrous composite in the form of a homogeneous anisotropic material with effective mechanical parameters allows for a sufficiently accurate calculation of stresses and strains. The calculation is carried out under different loading conditions, keeping in mind that both sizes characterizing the fibrous material fiber thickness and the gap between the fibers-are several orders smaller than the radius of the hole. Based on the simplified theory and the finite element method, a computer model of nonlinear deformation of fibrous composites is constructed. For carrying out computational experiments, a specialized software package was developed. The effect of hole configuration on the distribution of deformation and stress fields in the vicinity of concentrators was investigated.

• Journal of the Microelectronics and Packaging Society
• /
• v.17 no.1
• /
• pp.9-17
• /
• 2010

In this study, von Mises stress and total strain energy density characteristics of lead pin in PGA (Pin Grid Array) packages have been calculated by using the FEM (Finite Element Method). FEM computation is carried out with various heat treatment conditions of lead pin material under $20^{\circ}$ bending and 50 mm tension condition. Results show that von Mises stress locally concentrated on lead pin corners and interface between lead pin head and solder. von Mises stress and total strain energy density decrease as heat treatment temperature of lead pin increases. Also, round shaped corner of lead pin decreases both von Mises stress and total strain energy density on interface between lead pin head and solder. This means that PGA package reliability can be improved by changing the mechanical property of lead pin through heat treatment. This has been known that solder fatigue life decreases as total strain energy density of solder increases. Therefore, it is recommended that both optimized lead pin shape and optimized material property with high lead pin heat treatment temperature determine better PGA package reliability.

• Journal of the Microelectronics and Packaging Society
• /
• v.26 no.1
• /
• pp.29-33
• /
• 2019

With shrinking form factor and improving performance of electronic packages, high input/output (I/O) density is considered as an important factor. Fan out wafer-level packaging (FO-WLP) has been paid great attention as an alternative. However, FO-WLP is vulnerable to warpage during its manufacturing process. Minimizing warpage is essential for controlling production yield, and in turn, package reliability. While many studies investigated the effect of process and design parameters on warpage using finite element analysis, they did not take uncertainty into consideration. As parameters, including material properties, chip positions, have uncertainty from the point of manufacturing view, the uncertainty should be considered to reduce the gap between the results from the field and the finite element analysis. This paper focuses on the effect of uncertainty of Young's modulus of chip on fan-out wafer level packaging warpage using finite element analysis. It is assumed that Young's modulus of each chip follows the normal distribution. Simulation results show that the uncertainty of Young's modulus affects the maximum von Mises stress. As a result, it is necessary to control the uncertainty of Young's modulus of silicon chip since the maximum von Mises stress is a parameter related to the package reliability.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2009.11a
• /
• pp.81-81
• /
• 2009

Non-sintered Alumina films were fabricated via inkjet printing processes without a high temperature sintering process. The packing density of these inkjet-printed alumina films measured around 60%. Polymer resin was infiltrated thru these non-sintered films in order to fill out the 40% of voids constituting the rest of the inkjet-printed films. The concept of inkjet-printed Alumina-Resin hybrid materials was designed in order to be applicable to the ceramic package substrates for 3D-system module integration which may possibly substitute LTCC-based 3D module integration. So, the dielectric properties of these inkjet-printed $Al_2O_3$ hybridmaterialsareofourgreatinterest. We have measured dielectric constant and dissipation factor of the inkjet-printed $Al_2O_3$-resinhybridfilmsbyvaryingtheamountofresininfiltratedthruthe$Al_2O_3$films.

• Computers and Concrete
• /
• v.21 no.3
• /
• pp.321-333
• /
• 2018

Flat-slabs, being a significant structural component, not only reduce the dead load of the structure but also reduce the amount of concrete required for construction. Moreover the use of recycled aggregates lowers the impact of large scale construction to nearby ecosystems. Recycled aggregate based concrete being a quasi-brittle material shows enormous cracking during failure. Crack growth in flat-slabs is mostly in sliding mode (Mode II). Therefore sufficient sections need to be provided for resistance against such failure modes. The main objective of the paper is to numerically determine the ultimate load carrying capacity of two self-similar flat-slab specimens and validate the results experimentally for the natural aggregate as well as recycled aggregate based concrete. Punching shear experiments are carried out on circular flat-slab specimen on a rigid circular knife-edge support built out of both normal (NAC) and recycled aggregate concrete (RAC, with full replacement). Uniaxial compression and bending tests have been conducted on cubes, cylinders and prisms using both types of concrete (NAC and RAC) for its material characterization and use in the numerical scheme. The numerical simulations have been conducted in ABAQUS (a known finite element software package). Eight noded solid elements have been used to model the flat slab and material properties have been considered from experimental tests. The inbuilt Concrete Damaged Plasticity model of ABAQUS has been used to monitor crack propagation in the specimen during numerical simulations.

• Transactions of the Korean Society of Mechanical Engineers
• /
• v.18 no.8
• /
• pp.2139-2157
• /
• 1994

In order to understand the delamination between leadframe and epoxy molding compound in an electronic packaging of surface mounting type, the stress intensity factor, T-stress and J-integral in fracture mechanics are obtained. The effects of geometry, material properties and molding process temperature on the delamination are investigated taking into account the temperature dependence of the material properties, which simulates as more realistic condition. As the crack length increases the J-integral increases, which suggest that the crack propagates if it starts growing from the small size. The effects of the material properties and molding process temperature on stress intensity factor, T-stress is and J-integral are less significant than the chip size for the practical cases considered here. The T-stress is negative in all eases, which is in agreement with observation that interfacial crack is not kinked until the crack approaches the edge of the leadframe.

• Korean Journal of Materials Research
• /
• v.25 no.9
• /
• pp.450-454
• /
• 2015

A simulation method to estimate microstructure dependent material properties and their influence on performance for a honeycomb structured SiC heating element has been established. Electrical and thermal conductivities of a porous SiC sample were calculated by solving a current continuity equation. Then, the results were used as input parameters for a finite element analysis package to predict temperature distribution when the heating element was subjected to a DC bias. Based on the simulation results, a direction of material development for better heating efficiency was found. In addition, a modified metal electrode scheme to decelerate corrosion kinetics was proposed, by which the durability of the water heating system was greatly improved.

• Computers and Concrete
• /
• v.25 no.5
• /
• pp.411-425
• /
• 2020

In this paper, the shell material has been taken as functionally graded material and their material quantity is located by the exponential volume fraction law. Moreover, the impact of ring supports around the shell circumference has been examined for their various positions along the shell axial length. These rings support restraints the radial displacement in the transverse direction. While the axial modal deformation functions have been estimated by characteristic beam functions and nature of materials used for construction of cylindrical shells. The fundamental natural frequency of cylindrical shell of parameter versus ratios of length- and height-to-radius for a wide range has been reported and investigated through the study. In addition, by increasing height-to-radius ratio resulting frequencies also increase and frequencies decrease on ratio of length-to-radius. Though the trends of frequency values of both ratios are converse to each other with three different boundary conditions. Also it is examined the position of ring supports with length-to radius ratio, height-to-radius ratio and varying the exponent of volume fraction. MATLAB software package has been utilized for extracting shell frequency spectra. The obtained results are confirmed by comparing with available literature.

• Journal of Welding and Joining
• /
• v.17 no.6
• /
• pp.84-89
• /
• 1999

Most of ferrous b.c.c weld materials may experience martensitic transformation during rapid cooling after welding. It is well known that volume expansion due to the phase transformation could influence on the relaxation of welding residual stress. To apply this effect practically, it is a prerequisite to establish a numerical model which is able to estimate the effect of phase transformation on residual stress relaxation quantitatively. For this purpose, the analysis is carried out in two regions. i.e., heating and cooling, because the variation of material properties following a phase transformation in cooling is different in comparison with the case in heating, even at the same temperature. The variation of material properties following phase transformation is considered by the adjustment of specific heat and thermal expansion coefficient, and the distribution of residual stress in analysis is compared with that of experiment by previous study. consequently, in this study, simplified numerical procedures considering phase transformation, which based on a commercial finite element package was established through comparing with the experimental data of residual stress distribution by other researcher. To consider the phase transformation effect on residual stress relaxation, the transition of mechanical and thermal property such as thermal expansion coefficient and specific heat capacity was found by try and error method in this analysis.

• Journal of Biosystems Engineering
• /
• v.27 no.6
• /
• pp.557-564
• /
• 2002

Corrugated board is an efficient low-cost structure material fur the boxes that are widely used for transporting, storing and distributing goods. Corrugated board is also considered as an orthotropic because the principal material directions are the same as in paperboard. The purpose of this study was to elucidate the principal design parameters of ventilating box through the FEA on the various types of ventilating hole. From the viewpoint of the stress distribution and stress level, the optimum pattern and location of the ventilating hole were vertically oblong, and symmetry position with a short distance to the right and left from the center of front and rear panel. And, the optimum location and pattern of hand hole were a short distance to the top from the center of both side panels, and modified shape to increase the radius of curvature of both side in horizontal oblong. In general, the optimum pattern and location of both the ventilating hole and hand hole based on the FEM analysis were well verified by experimental investigation. It is suggested that decrease in compressive strength of the box could be minimized in the same ventilating hole area under the condition of the length of major axis of ventilating hole is less than 1/4 of box length, the ratio of minor axis/major axis is 113.5∼l/2.5, and number of the ventilating holes is even and symmetrical.