• 한국정밀공학회지
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• 제27권1호
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• pp.91-98
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• 2010

The increasing of power and processing speed and miniaturization of central processor unit (CPU) used in electronics equipment requires better performing thermal management systems. A typical thermal management package consists of thermal interfaces, heat dissipaters, and external cooling systems. There have been a number of experimental techniques and procedures for estimating thermal conductivity of thin, compressible thermal interface material (TIM). The TIM performance is affected by many factors and thus TIM should be evaluated under specified application conditions. In compact packaging of electronic equipment the chip is interfaced with a thin heat spreader. As the package is made thinner, the coupling between heat flow through TIM and that in the heat spreader becomes stronger. Thus, a TIM characterization system for considering the heat spreader effect is proposed and demonstrated in detail in this paper. The TIM test apparatus developed based on ASTM D-5470 standard for thermal interface resistance measurement of high performance TIM, including the precise measurement of changes in in-situ materials thickness. Thermal impedances are measured and compared for different directions of heat dissipation. The measurement of the TIM under the practical conditions can thus be used as the thermal criteria for the TIM selection.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2007년도 SMT/PCB 기술세미나
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• pp.37-47
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• 2007

Factor : Structure Metal pad & SMO size Board level TC test : - Large SMO size better Board level Drop test : - Large SMO size better Factor : Structure Substrate thickness Board level TC test : - Thick substrate better Board level Drop test : - Substrate thickness is not a significant factor for drop test Factor : Material Solder alloy Board level TC test : - Not so big differences over Pb-free solder and NiAu, OSP finish Board level Drop test : - Ni/Au+SAC105, CuOSP+LF35 are better Factor : Material Pad finish Board level TC test : - NiAu/NiAu is best Board livel Drop test : - CuOSP is best Factor : Material Underfill Board level TC test - Several underfills (reworkable) are passed TCG x500 cycles Board level Drop test : - Underfill lots have better performance than non-underfill lots Factor : Process Multiple reflow Board level TC test : - Multiple reflow is not a significant actor for TC test Board level Drop test : N/A Factor : Process Peak temp Board level TC test : - Higher peak temperature is worse than STD Board level Drop test : N/A Factor : Process Stack method Board level TC test : - No big difference between pre-stack and SMT stack Board level Drop test : - Flux dipping is better than paste dipping but failure rate is more faster

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.17-20
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• 2003

The EMC's rheological effects on molding process are evaluated in this study. When considering mold processing for IC packages, the major concerning items in current studies are incomplete fill, severe wire sweeping and paddle shifts etc. To simulate EMC's fast curing rheokinetics with 3D mold flow behavior, one should select appropriate rheometry which characterize each EMC's rheological motion and finding empirical parameters for numerical analysis current studies present the new rheometry with parallel plate rheometry for reactive rheokinetic experiments, the experiment and numerical analysis is done with the commercial higher filler loaded EMC for the case of Thin Quad Plant Packages (TQFP) with package thickness below 1.0 mm. The experimental results and simulation results based on new rheometry matches well in point of the prediction of wire sweep, filling behavior of melt front advancement and void trapping position.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집 Vol.14 No.1
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• pp.205-208
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• 2001

Steady state and transient thermal analysis has been done by a finite element method in a diode of 12kV blocking voltage for microwave oven. The diode was fabricated by soldering ten pieces of 1200V diodes in series, capping a dummy wafer at the far end of diode series, and finally copper wire bonded for building anode and cathode terminal. In order to achieve high voltage and reliability, the edge of each diode was beveled and passivated by resin and epoxy with a thickness of $25{\mu}m$ and $3700{\mu}m$, respectively. The chip size, thickness and material properties were very important factor for high voltage diode package. And also, thermal stress value was highest in the edge of diode and solder. So, design of edge in silicon was very important to thermal stress.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집
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• pp.205-208
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• 2001

Steady state and transient thermal analysis has been done by a finite element method in a diode of 12kV blocking voltage for microwave oven. The diode was fabricated by soldering ten pieces of 1200V diodes in series, capping a dummy wafer at the far end of diode series, and finally copper wire bonded for building anode and cathode terminal. In order to achieve high voltage and reliability, the edge of each diode was beveled and passivated by resin and epoxy with a thickness of 25$\mu\textrm{m}$ and 3,700$\mu\textrm{m}$, respectively. The chip size, thickness and material properties were very important factor for high voltage diode package. And also, thermal stress value was highest in the edge of diode and solder. So, design of edge in silicon was very important to thermal stress.

• 한국전기전자재료학회논문지
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• 제17권6호
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• pp.575-579
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• 2004

Package reliability test was conducted to investigate the effect of solder paste composition at BGA Package. It was found that the shape and size of the phase form are affected by the processing parameters. The material have used to fill in the via was Sn/36Pb/2Ag and Sn/0.75Cu type solder paste. Sn/36Pb/2Ag and Sn/0.75Cu paste were fabricated on Tape-BGA substrates by screen printing process, and via ball mount data were characterized with variations of dwell time of 85 seconds at reflow peak temperature at 22$0^{\circ}C$ or 24$0^{\circ}C$. The test condition was MRT 30 $^{\circ}C$/60 %RH/96 HR. Failures formed of a ball-off in solder paste process were observed by using a Optical Microscope and SEM(Scanning Electron Microscope). It was concluded that intermetallic layer growth played important roles in increasing solder fatigue strength for addition of Ag composition. The degradation of shear strength of solder composition is discussed.

• 한국식품조리과학회지
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• 제27권1호
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• pp.63-73
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• 2011

Cabbage (Baechu) Kimchi in its truncated form was placed in four different packing materials, Ny/PE/LLDP, OPP/AL/PE, PP and PET, and quality changes were observed during storage. Changes in pH and total acidity showed an x-shaped cross-curve as pH decreased and total acidity increased during storage. PP tray showed the slowest change at $5^{\circ}C$ with time. The pH was initially 6.25, but decreased to 4.12~4.16 at 20 days, and total acidity showed a 4 to 4.8-fold increase after 20 days of storage compared to the initial value. During storage at $5^{\circ}C$, total bacterial count and lactic acid bacterial count rapidly increased after 4 days. The total bacterial quantity decreased after a period of time and there were differences according to packaging material; OPP/AL/PE packaging showed the most dramatic decrease. Change in microbial count mostly followed a similar pattern to that of total acidity for all packaging materials. Changes in the color of Kimchi liquid, when examined by color index in $L{\cdot}b$/a form, rapidly decreased over time, similar to pH. Small Ny/PE/PP and OPP/AL/PE packages of Kimchi were examined for changes in free volume inside the packaging. After 13 days of storage at $5^{\circ}C$, the volume was 243 mL, but storage at $20^{\circ}C$ resulted in a volume of 372 mL, a more than 1.5-fold increase in free volume. There were changes in the quality characteristics of small package Kimchi according to storage temperature and packaging material, and large changes in pH, total acidity, and microbial count were evident upon storage at $5^{\circ}C$ for 8 days, which was the optimum palatability period. Mostly, PP treatment showed the slowest quality changes upon storage at $5^{\circ}C$. However, due to small package Kimchi's fast consumption system, the appropriate choice of packaging material must consider the product's turnover ratio. Further, the varieties of small package Kimchi should be diversified according to different consumer preferences by offering Kimchi with different maturity levels. Further, since the leading consumer base ranges in age from the teens to thirties, the development of various products targeting such consumers is necessary.

• 마이크로전자및패키징학회지
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• 제23권4호
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• pp.35-41
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• 2016

고출력 LED 조명용 패키지를 제조함에 있어서 발열은 LED의 광출력과 수명에 매우 중요한 영향을 주는 인자로 알려져 있다. 본 연구에서는 가로등용 고출력 LED 패키지를 개발함에 있어서 효과적인 방열을 하기 위하여 방열효과가 상대적으로 우수한 구조인 chip-on-a-heat sink 구조를 가지는 세라믹-메탈 기반의 패키지를 제조하였다. 열확산 기능을 하는 heat sink 기판소재는 알루미늄 합금을, LED 어레이 회로를 형성하는 절연막으로는 저온동시소성용 glass-ceramics을 사용하였다. 특히 열처리 시 가장 이슈가 되는 세라믹-금속 하이브리드 패키지 기판의 휨을 억제하기 위한 수단으로서, glass-ceramic 절연막을 부분 코팅함으로써 휨현상을 용이하게 줄일 수 있게 되었다. 또한, LED 패키지의 방열특성의 향상 즉 열저항도 기존의 MCPCB 패키지나 전면 코팅형 절연막 패키지에 비해 훨씬 낮아지는 효과를 얻었을 뿐 아니라, 세라믹 코팅소재의 절감효과도 볼 수 있게 되었다.

• 디자인학연구
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• 제21권
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• pp.139-147
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• 1997

본 연구는 우리의 일상 생활에서 물건을 보호하며 이를 용기에 담아 운반하는 것과 넓은 의미의 포장은 인류의 역사와 더불어 시작된 지혜이며 인간의 삶의 질을 향상시킨다는 하나의 행위이다. 산업발달과 국민경제의 고도성장과 수출증대에 따라 포장산업은 국내외적으로 대량유통체제가 요청되고 있으며 이러한 유통체제에 적응키 위해 제품의 생산에서 소비에 이르는 유통과정을 일관하는 매체로서 중요한 산업이 되어가고 있다. 그러나 산업발달에 따른 다양해지는 제품과 포장의 급증으로 배출되는 포장 폐기물은 심각한 사회문제가 되고 있다. 그러므로 제품의 보호, 운송, 보관에 적합하게 하면서도 기능적으로 편리하게 하고 내용물을 소모한 뒤의 포장 폐기물 처리 문제에까지 고려하는 것이 오늘날의 문제이다. 따라서 일반소비자들은 환경 적으로 건전하다고 판단되는 제품을 구매하거나 재활용함으로써 일차적인 환경보존에 기여할 수 있어야 한다. 그러므로 본 논문은 포장의 1차용도의 개념에서 벗어나 2차용도인 재활용을 위한 새로운 포장기능을 널리 인식시키고 앞으로 디자인방향의 개선점을 고려해 봄에 있다.

• Journal of Radiation Protection and Research
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• 제22권4호
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• pp.251-261
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• 1997

방사성 동위원소 등의 고준위 방사성물질을 운반하기 위한 운반용기는 국내외의 관련법규에 따라 정상수송은 물론 가상사고조건에서도 방사성물질의 누설이 발생되지 않도록 방사선차폐, 열 및 구조적 건전성이 유지되어야 한다. 운반용기의 건전성 평가는 시험모델을 이용한 시험적 방법과 전산해석 코드를 이용한 해석적 방법에 의하여 이루어지고 있다. 본 논문에서는 원자력연구소의 하나로에서 생산되는 동위원소를 동위원소 생산시설까지 이송하기 위한 HTS (Hydraulic Transfer System) 방사성 동위원소 운반용기의 안전성을 평가하였다. 방사선차폐해석, 열해석 및 구조해석을 수행한 결과 동위원소 운반용기는 정상수송조건 뿐만 아니라 가상사고조건에서도 건전성이 유지되는 것으로 나타났다.