• 제목/요약/키워드: package material

검색결과 474건 처리시간 0.023초

Computer modeling of elastoplastic stress state of fibrous composites with hole

  • Polatov, Askhad M.;Ikramov, Akhmat M.;Khaldjigitov, Abduvali A.
    • Coupled systems mechanics
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    • 제8권4호
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    • pp.299-313
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    • 2019
  • The paper represents computer modeling of the deformed state of physically nonlinear transversally isotropic bodies with hole. In order to describe the anisotropy of the mechanical properties of transversally-isotropic materials a structurally phenomenological model has been used. This model allows representing the initial material in the form of the coupled isotropic materials: the basic material (binder) considered from the positions of continuum mechanics and the fiber material oriented along the anisotropy direction of the original material. It is assumed that the fibers perceive only the axial tensile-compression forces and are deformed together with the base material. To solve the problems of the theory of plasticity, simplified theories of small elastoplastic deformation have been used for a transversely-isotropic body, developed by B.E. Pobedrya. A simplified theory allows applying the theory of small elastoplastic deformations to solve specific applied problems, since in this case the fibrous medium is replaced by an equivalent transversely isotropic medium with effective mechanical parameters. The essence of simplification is that with simple stretching of composite in direction of the transversal isotropy axis and in direction perpendicular to it, plastic deformations do not arise. As a result, the intensity of stresses and deformations both along the principal axis of the transversal isotropy and along the perpendicular plane of isotropy is determined separately. The representation of the fibrous composite in the form of a homogeneous anisotropic material with effective mechanical parameters allows for a sufficiently accurate calculation of stresses and strains. The calculation is carried out under different loading conditions, keeping in mind that both sizes characterizing the fibrous material fiber thickness and the gap between the fibers-are several orders smaller than the radius of the hole. Based on the simplified theory and the finite element method, a computer model of nonlinear deformation of fibrous composites is constructed. For carrying out computational experiments, a specialized software package was developed. The effect of hole configuration on the distribution of deformation and stress fields in the vicinity of concentrators was investigated.

PGA (Pin Grid Array) 패키지의 Lead Pin의 기계적 특성에 따른 Pin Pull 거동 특성 해석 (Pin Pull Characteristics of Pin Lead with Variation of Mechanical Properties of Pin Lead in PGA (Pin Grid Array) Package)

  • 조승현;최진원;박균명
    • 마이크로전자및패키징학회지
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    • 제17권1호
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    • pp.9-17
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    • 2010
  • 본 논문은 $20^{\circ}$ 각도의 굽힘과 50 ${\mu}m$ 인장조건에서 PGA (Pin Grid Array) 패키지의 lead pin에 발생하는 von Mises 응력과 전 변형률 에너지 밀도를 lead pin 소재의 열처리 온도 조건에 따라 유한요소법을 이용하여 해석하였다. 해석결과에 따르면 lead pin의 코너부와 리드핀의 헤드부와 솔더의 경계면이 국부적으로 응력이 집중되는 가장 취약한 위치이며 lead pin의 열처리 온도가 높을수록 발생하는 최대 응력과 변형률 에너지 밀도가 낮아져서 신뢰성이 우수한 것으로 판단된다. 또한 lead pin의 코너부에 라운드가공을 하면 헤드부와 솔더의 경계면에서 발생하는 von Mises 응력과 전변형률 에너지 밀도가 감소하였다. 이와 같은 해석결과는 전 변형률 에너지 밀도가 증가할수록 솔더의 피로수명이 감소하는 연구결과에 미루어볼 때 열처리를 통해 리드핀의 기계적특성을 변경하면 PGA 패키지의 신뢰성을 향상시킬 수 있음을 의미한다. 따라서, 리드핀의 형상최적화와 열처리를 통한 최적화된 소재특성을 통해 PGA 패키지의 신뢰성 향상이 요구된다.

팬아웃 웨이퍼 레벨 패키지 공정 중 재료 물성의 불확실성이 휨 현상에 미치는 영향 (Effect of Material Property Uncertainty on Warpage during Fan Out Wafer-Level Packaging Process)

  • 김금택;강기훈;권대일
    • 마이크로전자및패키징학회지
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    • 제26권1호
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    • pp.29-33
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    • 2019
  • 전자패키지 크기의 소형화와 전자기기의 성능 향상이 함께 이루어지면서 높은 입출력 밀도 구현이 중요한 요소로서 평가받고 있다. 이를 구현하기 위해 팬아웃 웨이퍼 레벨 패키지(FO-WLP)가 큰 주목을 받고 있다. 하지만 FO-WLP는 휨(Warpage) 현상에 취약하다는 약점이 있다. 휨 현상은 생산 수율 감소와 더불어 패키지 신뢰성 하락에 큰 원인이므로 이를 최소화하는 것이 필수적이다. 유한요소해석을 이용한 재질의 물성 등 FO-WLP의 휨 현상과 연관된 요소에 대한 많은 연구가 진행되어 왔지만, 대부분의 연구는 이러한 요소들의 불확실성을 고려하지 않았다. 재질의 물성, 칩의 위치 등 패키지의 휨 현상과 연관된 요소들은 제조 측면에서 보았을 때 불확실성을 가지고 있기 때문에, 실제 결과와 더 가깝게 모사하기 위해서는 이러한 요소들의 불확실성이 고려되어야 한다. 이번 연구에서는 FO-WLP 과정 중 칩의 탄성 계수가 정규 분포를 따르는 불확실성을 가졌을 때 휨 현상에 미치는 영향을 유한요소해석을 통해 알아보았다. 그 결과 칩의 탄성 계수의 불확실성이 최대 von Mises 응력에 영향을 미치는 것을 확인하였다. Von Mises 응력은 전체 패키지 신뢰성과 관련된 인자이기 때문에 칩의 물성에 대한 불확실성 제어가 필요하다.

Dielectric Properties of ink-Jet printed $Al_2O_3$-resin Hybrid Films

  • Hwang, Myung-Sung;Jang, Hun-Woo;Kim, Ji-Hoon;Kim, Hyo-Tae;Yoon, Young-Joon;Kim, Jong-Hee;Moon, Joo-Ho
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2009년도 추계학술대회 논문집
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    • pp.81-81
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    • 2009
  • Non-sintered Alumina films were fabricated via inkjet printing processes without a high temperature sintering process. The packing density of these inkjet-printed alumina films measured around 60%. Polymer resin was infiltrated thru these non-sintered films in order to fill out the 40% of voids constituting the rest of the inkjet-printed films. The concept of inkjet-printed Alumina-Resin hybrid materials was designed in order to be applicable to the ceramic package substrates for 3D-system module integration which may possibly substitute LTCC-based 3D module integration. So, the dielectric properties of these inkjet-printed $Al_2O_3$ hybridmaterialsareofourgreatinterest. We have measured dielectric constant and dissipation factor of the inkjet-printed $Al_2O_3$-resinhybridfilmsbyvaryingtheamountofresininfiltratedthruthe$Al_2O_3$films.

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Punching shear behavior of recycled aggregate concrete

  • Dan, Saikat;Chaudhary, Manpreet;Barai, Sudhirkumar V.
    • Computers and Concrete
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    • 제21권3호
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    • pp.321-333
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    • 2018
  • Flat-slabs, being a significant structural component, not only reduce the dead load of the structure but also reduce the amount of concrete required for construction. Moreover the use of recycled aggregates lowers the impact of large scale construction to nearby ecosystems. Recycled aggregate based concrete being a quasi-brittle material shows enormous cracking during failure. Crack growth in flat-slabs is mostly in sliding mode (Mode II). Therefore sufficient sections need to be provided for resistance against such failure modes. The main objective of the paper is to numerically determine the ultimate load carrying capacity of two self-similar flat-slab specimens and validate the results experimentally for the natural aggregate as well as recycled aggregate based concrete. Punching shear experiments are carried out on circular flat-slab specimen on a rigid circular knife-edge support built out of both normal (NAC) and recycled aggregate concrete (RAC, with full replacement). Uniaxial compression and bending tests have been conducted on cubes, cylinders and prisms using both types of concrete (NAC and RAC) for its material characterization and use in the numerical scheme. The numerical simulations have been conducted in ABAQUS (a known finite element software package). Eight noded solid elements have been used to model the flat slab and material properties have been considered from experimental tests. The inbuilt Concrete Damaged Plasticity model of ABAQUS has been used to monitor crack propagation in the specimen during numerical simulations.

반도체패키지에서의 층간박리 및 패키지균열에 대한 파괴역학적 연구 (1) -층간박리- (A Fracture Mechanics Approach on Delamination and Package Crack in Electronic Packaging(l) -Delamination-)

  • 박상선;반용운;엄윤용
    • 대한기계학회논문집
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    • 제18권8호
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    • pp.2139-2157
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    • 1994
  • In order to understand the delamination between leadframe and epoxy molding compound in an electronic packaging of surface mounting type, the stress intensity factor, T-stress and J-integral in fracture mechanics are obtained. The effects of geometry, material properties and molding process temperature on the delamination are investigated taking into account the temperature dependence of the material properties, which simulates as more realistic condition. As the crack length increases the J-integral increases, which suggest that the crack propagates if it starts growing from the small size. The effects of the material properties and molding process temperature on stress intensity factor, T-stress is and J-integral are less significant than the chip size for the practical cases considered here. The T-stress is negative in all eases, which is in agreement with observation that interfacial crack is not kinked until the crack approaches the edge of the leadframe.

허니컴 구조 SiC 발열체 성능 평가 시뮬레이션 (Simulation of Honeycomb-Structured SiC Heating Elements)

  • 이종혁;조영재;김찬영;권용우;공영민
    • 한국재료학회지
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    • 제25권9호
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    • pp.450-454
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    • 2015
  • A simulation method to estimate microstructure dependent material properties and their influence on performance for a honeycomb structured SiC heating element has been established. Electrical and thermal conductivities of a porous SiC sample were calculated by solving a current continuity equation. Then, the results were used as input parameters for a finite element analysis package to predict temperature distribution when the heating element was subjected to a DC bias. Based on the simulation results, a direction of material development for better heating efficiency was found. In addition, a modified metal electrode scheme to decelerate corrosion kinetics was proposed, by which the durability of the water heating system was greatly improved.

Computer-aided approach for modelling of FG cylindrical shell sandwich with ring supports

  • Hussain, Muzamal;Naeem, Muhammad Nawaz;Khan, Muhammad Shabaz;Tounsi, Abdelouahed
    • Computers and Concrete
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    • 제25권5호
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    • pp.411-425
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    • 2020
  • In this paper, the shell material has been taken as functionally graded material and their material quantity is located by the exponential volume fraction law. Moreover, the impact of ring supports around the shell circumference has been examined for their various positions along the shell axial length. These rings support restraints the radial displacement in the transverse direction. While the axial modal deformation functions have been estimated by characteristic beam functions and nature of materials used for construction of cylindrical shells. The fundamental natural frequency of cylindrical shell of parameter versus ratios of length- and height-to-radius for a wide range has been reported and investigated through the study. In addition, by increasing height-to-radius ratio resulting frequencies also increase and frequencies decrease on ratio of length-to-radius. Though the trends of frequency values of both ratios are converse to each other with three different boundary conditions. Also it is examined the position of ring supports with length-to radius ratio, height-to-radius ratio and varying the exponent of volume fraction. MATLAB software package has been utilized for extracting shell frequency spectra. The obtained results are confirmed by comparing with available literature.

잔류응력 완화에 미치는 상변태의 수치적 모델링 (N.M.for the Effect of P.T. on Resicual Stress Relaxation)

  • 장경복;손금렬;강성수
    • Journal of Welding and Joining
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    • 제17권6호
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    • pp.84-89
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    • 1999
  • Most of ferrous b.c.c weld materials may experience martensitic transformation during rapid cooling after welding. It is well known that volume expansion due to the phase transformation could influence on the relaxation of welding residual stress. To apply this effect practically, it is a prerequisite to establish a numerical model which is able to estimate the effect of phase transformation on residual stress relaxation quantitatively. For this purpose, the analysis is carried out in two regions. i.e., heating and cooling, because the variation of material properties following a phase transformation in cooling is different in comparison with the case in heating, even at the same temperature. The variation of material properties following phase transformation is considered by the adjustment of specific heat and thermal expansion coefficient, and the distribution of residual stress in analysis is compared with that of experiment by previous study. consequently, in this study, simplified numerical procedures considering phase transformation, which based on a commercial finite element package was established through comparing with the experimental data of residual stress distribution by other researcher. To consider the phase transformation effect on residual stress relaxation, the transition of mechanical and thermal property such as thermal expansion coefficient and specific heat capacity was found by try and error method in this analysis.

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통기성 상자 구조물에 대한 유한요소 해석 (Finite Element Analysis of a Ventilating Box Structure)

  • 박종민;권순구
    • Journal of Biosystems Engineering
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    • 제27권6호
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    • pp.557-564
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    • 2002
  • Corrugated board is an efficient low-cost structure material fur the boxes that are widely used for transporting, storing and distributing goods. Corrugated board is also considered as an orthotropic because the principal material directions are the same as in paperboard. The purpose of this study was to elucidate the principal design parameters of ventilating box through the FEA on the various types of ventilating hole. From the viewpoint of the stress distribution and stress level, the optimum pattern and location of the ventilating hole were vertically oblong, and symmetry position with a short distance to the right and left from the center of front and rear panel. And, the optimum location and pattern of hand hole were a short distance to the top from the center of both side panels, and modified shape to increase the radius of curvature of both side in horizontal oblong. In general, the optimum pattern and location of both the ventilating hole and hand hole based on the FEM analysis were well verified by experimental investigation. It is suggested that decrease in compressive strength of the box could be minimized in the same ventilating hole area under the condition of the length of major axis of ventilating hole is less than 1/4 of box length, the ratio of minor axis/major axis is 113.5∼l/2.5, and number of the ventilating holes is even and symmetrical.