• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2006년도 하계종합학술대회
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• pp.595-596
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• 2006

A novel Si via structure is suggested and fabricated for 3D MEMS package using the doped silicon as an interconnection material. Oxide isolations which define Si via are formed simultaneously when fabricating the MEMS structure by using DRIE and oxidation. Silicon Direct Bonding Multi-stacking process is used for stacked package, which consists of a substrate, MEMS structure layer and a cover layer. The bonded wafers are thinned by lapping and polishing. A via with the size of $20{\mu}m$ is fabricated and the electrical and mechanical characteristics of via are under testing.

• Journal of Welding and Joining
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• 제17권2호
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• pp.61-65
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• 1999

Because of the need for packages which accommodate high pin count, high density and high speed device, PBGA(plastic ball grid array) package gets more spotlight. But the substrate material which is used for PBGA package is in nature susceptible to moisture penetration. The objective of the study is to find out the path of delamination in the stacked structure of substrate. To increase the adhesion between the cooper laminate and PSR(photo solder resist) which is the weakest part, experiments were performed by changing parameters of printing pre-treatment and post-treatment process. As a result of experiments, the factor effects on the adhesion between the cooper laminate and PSR is caused by all of the pre-treatment and post-treatment condition. A considerable change was observed depending on the amount of UV irradiation after thermal cure which is typical of printing post-treatment condition rather than pre-treatment condition.

• Computers and Concrete
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• 제7권2호
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• pp.87-102
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• 2010

This paper discusses new capabilities developed for the Virtual Penetration Laboratory (VPL) software package to address the challenges of determining Penetration Resistance (PR) equations for concrete materials. Specifically, the paper introduces a three-invariant concrete constitutive model recently developed by the authors. The Advanced Fundamental Concrete (AFC) model was developed to provide a fast-running predictive model to simulate the behavior of concrete and other high-strength geologic materials. The Continuous Evolutionary Algorithms (CEA) automatic fitting algorithms used to fit the new model are discussed, and then examples are presented to demonstrate the effectiveness of the new AFC model. Finally, the AFC model in conjunction with the VPL software package is used to develop a PR equation for a concrete material.

• 한국식생활문화학회지
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• 제22권2호
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• pp.167-175
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• 2007

This study was to investigate purchase of women for commercial kimchi. Survey was carried out by questionnaire method that is target on 322 female over 20 age in Seoul area. The results of the study was that the way they get kimchi of women answered that they make it by themselves(63.3%). The reason of purchasing is they do not have enough time to make it at their home(43.8%) and its good taste(56.8%) result in their purchase. In the degree of preference about package material, prefer polyethylene(39.6%). Also respondents prefer purchasing poggi kimchi(63.4%) among other different types of kimchi. The promotion facts of purchasing commercial kimchi shows a high score in cold chain system package and specific kimchi development.

• 한국산학기술학회논문지
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• 제14권5호
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• pp.2113-2120
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• 2013

본 연구는, LED 칩 패키지에 있는 토출된 형광체 수지의 모양을 인라인 측정을 통해 개발된 검사 시스템을 기초로 한 효율적인 머신 비전에 관한 연구이다. 형광체의 반투명 특성 때문에 조사된 빛이 칩의 표면뿐만 아니라 하단 부에서도 반사된다. 이러한 현상이 LED 칩 검사의 신뢰성을 저하시키기 때문에 적절한 조명 광학계를 결정하기 위해 백색광 LED 와 635nm의 레이저 슬릿 빛을 이용하여 검사하였다. 또한, 광 삼각측정법을 이용해 정반사와 분산반사법으로 검사를 수행하였다. 실험 결과 백색 슬릿 광과 정반사 반사법의 조합이 가장 좋은 검사 결과를 낸다는 것을 확인할 수 있었다. Catmull-Rom 스플라인 보간법을 이용하여 측정된 데이터를 부드러운 표면 형상으로 나타내었다. 측정 결과를 통해 개발된 시스템이 LED 칩 패키징 공정에 인라인 검사에 성공적으로 적용될 수 있다는 결론을 내릴 수 있다.

• 한국콘텐츠학회논문지
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• 제7권12호
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• pp.1-12
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• 2007

문헌과 풍속도를 통해 보자기의 용도와 쓰임새를 알아보고, 민보와 상용보를 중심으로 그 가치와 기능을 분석 하였다. 산업사회 가방문화의 단일성과는 달리 보자기는 다양성과 역동성, 가변적수용성, 2차원과 3차원이 동시에 공존하고 있다는 것을 발견했고, 보자기를 만드는 과정에 있어서 짜투리 천조각의 재활용성은 세계 어느 전통 운반기구의 문화 에서도 찾아볼 수 없는 친환경적요소를 내재하고 있다. 이런 다의적 요소들은 기술과 재료의 발달로 다양한 기능으로 컨버전스 되어 새로운 관점의 포장디자인이 가능해진다. 이를 현대 포장디자인 관점에서 분석하여 복합적이고, 융합적인 다양한 기능의 현대 포장디자인 방향을 제시한다.

• 센서학회지
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• 제16권5호
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• pp.325-330
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• 2007

For the application to optic devices, wafer level package including spacer with particular thickness according to optical design could be required. In these cases, the uniformity of spacer thickness is important for bonding strength and optical performance. Packaging process has to be performed at low temperature in order to prevent damage to devices fabricated before packaging. And if photosensitive material is used as spacer layer, size and shape of pattern and thickness of spacer can be easily controlled. This paper presents polymer bonding using thick, uniform and patterned spacing layer of SU-8 2100 photoresist for wafer level package. SU-8, negative photoresist, can be coated uniformly by spin coater and it is cured at $95^{\circ}C$ and bonded well near the temperature. It can be bonded to silicon well, patterned with high aspect ratio and easy to form thick layer due to its high viscosity. It is also mechanically strong, chemically resistive and thermally stable. But adhesion of SU-8 to glass is poor, and in the case of forming thick layer, SU-8 layer leans from the perpendicular due to imbalance to gravity. To solve leaning problem, the wafer rotating system was introduced. Imbalance to gravity of thick layer was cancelled out through rotating wafer during curing time. And depositing additional layer of gold onto glass could improve adhesion strength of SU-8 to glass. Conclusively, we established the coating condition for forming patterned SU-8 layer with $400{\mu}m$ of thickness and 3.25 % of uniformity through single coating. Also we improved tensile strength from hundreds kPa to maximum 9.43 MPa through depositing gold layer onto glass substrate.

• 반도체디스플레이기술학회지
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• 제18권1호
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• pp.10-14
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• 2019

In this study, we synthesized two $Y_3Al_5O_{12}:Ce^{3+}$ phosphors ($7{\mu}m$-sized and $2{\mu}m$-sized YAG) with different sizes by controlling particles sizes of starting materials of the phosphors for white LED. In the smaller one ($2{\mu}m$-sized YAG), its photoluminescence intensity in the reflective mode was 63 % that of the bigger one ($7{\mu}m$-sized YAG); the quantum efficiencies were 93 % and 70 % for the smaller and the bigger ones. Two kinds of white LED packages with the same color coordinates were fabricated with a blue package (chip size $53{\times}30$) and two phosphors. The luminous flux of the white LED package with the smaller YAG phosphor was 92 % of that with the bigger one, indicating that the quantum efficiency of phosphor dispersed inside LED package was higher than that of the pure powder. It was consistently confirmed by the optical simulation (LightTools 6.3). It is notable according to the optical simulation that the white LED with the smaller phosphor showed 24 % higher luminous efficiency. If the smaller one had the same quantum efficiency as the bigger one (~93 %). Therefore, it can be suggested that the higher luminous efficiency of white LED can be possible by reducing the particle size of the phosphor along with maintaining its similar quantum efficiency.

• 반도체디스플레이기술학회지
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• 제22권4호
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• pp.124-130
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• 2023

Recently, fan out wafer level packaging, which enables high integration, miniaturization, and low cost, is being rapidly applied in the semiconductor industry. In particular, FOWLP is attracting attention in the mobile and Internet of Things fields, and is recognized as a core technology that will lead to technological advancements such as 5G, self-driving cars, and artificial intelligence in the future. However, as chip density and package size within the package increase, FOWLP warpage is emerging as a major problem. These problems have a direct impact on the reliability and electrical performance of semiconductor products, and in particular, cause defects such as vacuum leakage in the manufacturing process or lack of focus in the photolithography process, so technical demands for solving them are increasing. In this paper, warpage simulation according to the thickness of FOWLP material was performed using finite element analysis. The thickness range was based on the history of similar packages, and as a factor causing warpage, the curing temperature of the materials undergoing the curing process was applied and the difference in deformation due to the difference in thermal expansion coefficient between materials was used. At this time, the stacking order was reflected to reproduce warpage behavior similar to reality. After performing finite element analysis, the influence of each variable on causing warpage was defined, and based on this, it was confirmed that warpage was controlled as intended through design modifications.

• 한국전산유체공학회:학술대회논문집
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• 한국전산유체공학회 2000년도 춘계 학술대회논문집
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• pp.27-32
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• 2000

In this study, the three-dimensional blood flow within the sac of KTAH(Korean artificial heart) is simulated using fluid-structure interaction model. The numerical method employed in this study is the finite element commercial package ADINA. The thrombus formation is one of the most critical problems in KTAH. High fluid shear stress or stagnated flow are believed to be the main causes of these disastrous phenomenon. We solved the fluid-structure interaction between the 3D blood flow in the sac and the surrounding sac material. The sac material is assumed as linear elastic material and the blood as incompressible viscous fluid. Numerical solutions show that high shear stress region and stagnated flow are found near the upper part of the sac and near the comer of the outlet during diastole stage.