• Journal of the Korean Society for Precision Engineering
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• v.27 no.1
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• pp.91-98
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• 2010

The increasing of power and processing speed and miniaturization of central processor unit (CPU) used in electronics equipment requires better performing thermal management systems. A typical thermal management package consists of thermal interfaces, heat dissipaters, and external cooling systems. There have been a number of experimental techniques and procedures for estimating thermal conductivity of thin, compressible thermal interface material (TIM). The TIM performance is affected by many factors and thus TIM should be evaluated under specified application conditions. In compact packaging of electronic equipment the chip is interfaced with a thin heat spreader. As the package is made thinner, the coupling between heat flow through TIM and that in the heat spreader becomes stronger. Thus, a TIM characterization system for considering the heat spreader effect is proposed and demonstrated in detail in this paper. The TIM test apparatus developed based on ASTM D-5470 standard for thermal interface resistance measurement of high performance TIM, including the precise measurement of changes in in-situ materials thickness. Thermal impedances are measured and compared for different directions of heat dissipation. The measurement of the TIM under the practical conditions can thus be used as the thermal criteria for the TIM selection.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2007.04a
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• pp.37-47
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• 2007

Factor : Structure Metal pad & SMO size Board level TC test : - Large SMO size better Board level Drop test : - Large SMO size better Factor : Structure Substrate thickness Board level TC test : - Thick substrate better Board level Drop test : - Substrate thickness is not a significant factor for drop test Factor : Material Solder alloy Board level TC test : - Not so big differences over Pb-free solder and NiAu, OSP finish Board level Drop test : - Ni/Au+SAC105, CuOSP+LF35 are better Factor : Material Pad finish Board level TC test : - NiAu/NiAu is best Board livel Drop test : - CuOSP is best Factor : Material Underfill Board level TC test - Several underfills (reworkable) are passed TCG x500 cycles Board level Drop test : - Underfill lots have better performance than non-underfill lots Factor : Process Multiple reflow Board level TC test : - Multiple reflow is not a significant actor for TC test Board level Drop test : N/A Factor : Process Peak temp Board level TC test : - Higher peak temperature is worse than STD Board level Drop test : N/A Factor : Process Stack method Board level TC test : - No big difference between pre-stack and SMT stack Board level Drop test : - Flux dipping is better than paste dipping but failure rate is more faster

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.17-20
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• 2003

The EMC's rheological effects on molding process are evaluated in this study. When considering mold processing for IC packages, the major concerning items in current studies are incomplete fill, severe wire sweeping and paddle shifts etc. To simulate EMC's fast curing rheokinetics with 3D mold flow behavior, one should select appropriate rheometry which characterize each EMC's rheological motion and finding empirical parameters for numerical analysis current studies present the new rheometry with parallel plate rheometry for reactive rheokinetic experiments, the experiment and numerical analysis is done with the commercial higher filler loaded EMC for the case of Thin Quad Plant Packages (TQFP) with package thickness below 1.0 mm. The experimental results and simulation results based on new rheometry matches well in point of the prediction of wire sweep, filling behavior of melt front advancement and void trapping position.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11b
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• pp.205-208
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• 2001

Steady state and transient thermal analysis has been done by a finite element method in a diode of 12kV blocking voltage for microwave oven. The diode was fabricated by soldering ten pieces of 1200V diodes in series, capping a dummy wafer at the far end of diode series, and finally copper wire bonded for building anode and cathode terminal. In order to achieve high voltage and reliability, the edge of each diode was beveled and passivated by resin and epoxy with a thickness of $25{\mu}m$ and $3700{\mu}m$, respectively. The chip size, thickness and material properties were very important factor for high voltage diode package. And also, thermal stress value was highest in the edge of diode and solder. So, design of edge in silicon was very important to thermal stress.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.205-208
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• 2001

Steady state and transient thermal analysis has been done by a finite element method in a diode of 12kV blocking voltage for microwave oven. The diode was fabricated by soldering ten pieces of 1200V diodes in series, capping a dummy wafer at the far end of diode series, and finally copper wire bonded for building anode and cathode terminal. In order to achieve high voltage and reliability, the edge of each diode was beveled and passivated by resin and epoxy with a thickness of 25$\mu\textrm{m}$ and 3,700$\mu\textrm{m}$, respectively. The chip size, thickness and material properties were very important factor for high voltage diode package. And also, thermal stress value was highest in the edge of diode and solder. So, design of edge in silicon was very important to thermal stress.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.6
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• pp.575-579
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• 2004

Package reliability test was conducted to investigate the effect of solder paste composition at BGA Package. It was found that the shape and size of the phase form are affected by the processing parameters. The material have used to fill in the via was Sn/36Pb/2Ag and Sn/0.75Cu type solder paste. Sn/36Pb/2Ag and Sn/0.75Cu paste were fabricated on Tape-BGA substrates by screen printing process, and via ball mount data were characterized with variations of dwell time of 85 seconds at reflow peak temperature at 22$0^{\circ}C$ or 24$0^{\circ}C$. The test condition was MRT 30 $^{\circ}C$/60 %RH/96 HR. Failures formed of a ball-off in solder paste process were observed by using a Optical Microscope and SEM(Scanning Electron Microscope). It was concluded that intermetallic layer growth played important roles in increasing solder fatigue strength for addition of Ag composition. The degradation of shear strength of solder composition is discussed.

• Korean journal of food and cookery science
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• v.27 no.1
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• pp.63-73
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• 2011

Cabbage (Baechu) Kimchi in its truncated form was placed in four different packing materials, Ny/PE/LLDP, OPP/AL/PE, PP and PET, and quality changes were observed during storage. Changes in pH and total acidity showed an x-shaped cross-curve as pH decreased and total acidity increased during storage. PP tray showed the slowest change at $5^{\circ}C$ with time. The pH was initially 6.25, but decreased to 4.12~4.16 at 20 days, and total acidity showed a 4 to 4.8-fold increase after 20 days of storage compared to the initial value. During storage at $5^{\circ}C$, total bacterial count and lactic acid bacterial count rapidly increased after 4 days. The total bacterial quantity decreased after a period of time and there were differences according to packaging material; OPP/AL/PE packaging showed the most dramatic decrease. Change in microbial count mostly followed a similar pattern to that of total acidity for all packaging materials. Changes in the color of Kimchi liquid, when examined by color index in $L{\cdot}b$/a form, rapidly decreased over time, similar to pH. Small Ny/PE/PP and OPP/AL/PE packages of Kimchi were examined for changes in free volume inside the packaging. After 13 days of storage at $5^{\circ}C$, the volume was 243 mL, but storage at $20^{\circ}C$ resulted in a volume of 372 mL, a more than 1.5-fold increase in free volume. There were changes in the quality characteristics of small package Kimchi according to storage temperature and packaging material, and large changes in pH, total acidity, and microbial count were evident upon storage at $5^{\circ}C$ for 8 days, which was the optimum palatability period. Mostly, PP treatment showed the slowest quality changes upon storage at $5^{\circ}C$. However, due to small package Kimchi's fast consumption system, the appropriate choice of packaging material must consider the product's turnover ratio. Further, the varieties of small package Kimchi should be diversified according to different consumer preferences by offering Kimchi with different maturity levels. Further, since the leading consumer base ranges in age from the teens to thirties, the development of various products targeting such consumers is necessary.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.35-41
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• 2016

Ceramic-metal based high power LED array package was developed via thick film LTCC technology using a glass-ceramic insulation layer and a silver conductor patterns directly printed on the aluminum heat sink substrate. The thermal resistance measurement using thermal transient tester revealed that ceramic-metal base LED package exhibited a superior heat dissipation property to compare with the previously known packaging method such as FR-4 based MCPCB. A prototype LED package sub-module with 50 watts power rating was fabricated using a ceramic-metal base chip-on-a board technology with minimized camber deformation during heat treatment by using partially covered glass-ceramic insulation layer design onto the aluminum heat spread substrate. This modified circuit design resulted in a camber-free packaging substrate and an enhanced heat transfer property compared with conventional MCPCB package. In addition, the partially covered design provided a material cost reduction compared with the fully covered one.

• Archives of design research
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• v.21
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• pp.139-147
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• 1997

The concept of package in these day is getting changing with fluctuation of living and management circumstance. The is due to society trancefiguration and change of economic structure and induced to appear small paxkage. These package trend to covert from the class management to total management system and these system made a promotion to development current industry. In these day, with the development of industry and the progress of the life , the package is performing the first faculty such as perservation of manufacture, convenience of keeping and loading in , expedition of sale and additionally the role of package in modern economy is significant for the essen tial element of enterprise prosperity by improving its shape color and materials. It is readilly appearent to anyone in the recycling field that stable markets for collected materials are vitals to any successful program. The recycling movement has increased in popularity throughout the any country: however, it has brought with it a market for them. This attitute also prevails in the political arena where atates or municipalities who are committed to recycling major portion of the solid waste stream are asking these same question regarding the disposition of thte recycled material.

• Journal of Radiation Protection and Research
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• v.22 no.4
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• pp.251-261
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• 1997

A package to transport the high level radioactive materials is required to withstand the hypothetical accident conditions as well as normal transport conditions according to IAEA standards and domestic regulations. The regulations require that the package should maintain the shielding, thermal and structural integrities to release no radioactive material. In general, safety evaluation of packages is performed by experimental methods using scale model and/or analytical methods using computer codes. This paper presents the safety evaluation of package to transport the radioisotopes produced in the HANARO to the radioisotope production facility. Radiation shielding, thermal and structural analyses were peformed using the computer codes. It has been verified that the package is safe under hypothetical accident conditions as well as normal transport conditions.