• 한국정보디스플레이학회:학술대회논문집
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• 2007.08b
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• pp.1703-1705
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• 2007

Before the ultra-violet glue encapsulation, the research evaporated LiF thin film on device surface to be the extra packaging layer for improving the lifetime of organic light-emitting diode. The formula of UV glue was specially developed. We found 100 nm LiF is the optimum thickness. The best lifetime obtained by using LiF and special UV glue is 2.4 times longer than those by commercial UV glue.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.3-6
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• 2004

Power semiconductor devices are being compact, high performance and intelligent thanks to recent remarkable developments of silicon design, process and related packaging technologies. Developments of MOS-gate transistors such as MOSFET and IGBT are dominant thanks to their advantages on high speed operation. In conjunction with package technology, silicon technologies such as trench, charge balance and NPT will support future power semiconductors. In addition, wide band gap material such as SiC and GaN are being studies for next generation power semiconductor devices.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.8
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• pp.758-763
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• 2006

We has been studied the thin film encapsulation effect for organic light-emitting diodes (OLED). To evaluate the passivation properties of the passivation layer materials, we have carried out the fabrication of green light emitting diodes with ultra violet(UV) light absorbing polymer resin, $SiO_2,\;and\;SiN_x$, respectively. From the measurement results of shrinkage properties according to the exposure time to the atmosphere, we found that $SiN_x$ thin film is the best material for passivation layer. We have investigated the emission efficiency and life time of OLED device using the package structure of $OLED/SiN_x/polymer$ resin/Al/polymer resin. The emission efficiency of this OLED device was 13 lm/W and life time was about 2,000 hours, which reach 95 % of the performance for the OLED encapsulated with metal.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.1
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• pp.43-47
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• 2004

We have been using Moisture Barrier Bags for dry packing of semiconductor packages to prevent moisture from absorbing during shipping. Moisture barrier bag material is required to be waterproof, vapor proof and offer superior ESD (Electro-static discharge) and EMI shielding. Also, the bag should be formed easily to the shape of products for vacuum packing while providing excellent puncture resistance and offer very low gas ＆ moisture permeation. There are some problems like pinholes and punctured bags after sealing and before the surface mount process. This failure may easily result in package pop corn crack during board mounting. The bags should be developed to meet the requirements of excellent electrical and physical properties by means of optimization of their raw material composition and their thickness. This study investigates the performance of moisture barrier bags by characterization of their mechanical endurance, tensile strength and through thermal analysis. By this study, we arrived at a robust material composition (polyester/Aluminate) for better packing.

• Journal of Korean Society of Steel Construction
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• v.16 no.5 s.72
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• pp.621-628
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• 2004

This paper introduces a new theory, that in a stiffened plate, a steel stiffener could be substituted a composite material in order to prevent from buckling. Changing a steel stiffener into a composite material would not only preclude welding, but could also prevent damage to the material due to fatigue and corrosion.A composite material is assumed to adhere to a steel plate, and is never separated from the plate until the steel plate reaches buckling.Such plate has variable shapes, with different lengths and widths, and also shows an anisotropic material property. LUSAS, a commercial finite element analysis package, was used in the buckling analysis.This paper investigated buckling behavior in anisotropic composite plates with variable parameters.

• Archives of design research
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• v.16 no.3
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• pp.151-160
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• 2003

Packages have been used for a wide variety of purposes, for protection, for display, for transportation of goods, or for keeping personal belongings. According to the demands of society and the times, liquor packages have been specialized and have appeared in almost every shape and size without restriction to cine particular type of material. In spite of its rapid development and wide application in our society, liquor package design has rarely been considered as a subject of comprehensive study. Majoring in package design, I have become especially interested in the area of liquor package design. I would like to explore liquor package design from several aspects. With the advent of new market and the rise of a new consumer society, advertising and mass media have expanded rapidly. While convenience of use is not a major issue, serving size certainly are quality, appeal of heritage and health concerns. Heritage is a major consumer appeal in Whisky, Beer, Wine and spirits. Designers have drawn heavily on the tradition of alcoholic products, have used type and graphics to create the illusion of heritage for new products. A sidelight to the heritage aspect of spirits package is the evolution of outer boxes for international liquors. International liquors package design illustrated the past and current themes. The design is contemporary and spare. Colored panels correlated to the liquor flavor used on clean white, black, gold boxes. While this research does not deny the impact of structural innovation and convenience package design , it does deny the existence of a graphic plateau. It is assumed therefore, that development in technology can facilitate communication between East and West. This can be accomplished because as containers of products are used in social setting, their form will gradually apply strong influence to the need for economical, easily handled, easily utilized packaging. Typically, ethnic package designs are those packages containing products which are prepared and marketed to a category of people who are prepared and marketed to a culture traits. They are liquor products sold in the metropolitan New York area which are marketed specially to Asians, Hispanics, or Eurpean population. These cultural groups share numerous traits including religion, language, dietary habits and traditional drinking styles. Therefore, the products which are familiar or common in their native countries are often imported or marketed there to serve them. These packages and products are frequently found on the shelves of supermarkets in predominantly ethnic areas. That is Korea, Japan if packaging is correctly design it would appeal to the American market. My research is that oriental beverage -Soju is good example of this precept. Assumedly, there must be a degree of subjectivity since it is a mean in which the consumers can relate to its advertising. This degree to relate and identify is the degree to which the package will be remembered and purchased. Subjectivity is intimately related to purchases since there is no such thing as a rational purchase in a society that operates on mass consumption. It is essential that packages become more personal human, entertaining, and more like advertising in order to maximize merchandising potential.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.37-44
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• 2013

It is well known that thermal deformation of electronic packages with Pb-Sn solder and with lead-free solder is significantly affected by material properties consisting the package, as well as those of the solder itself. In this paper, the method for determining coefficient of thermal expansion(CTE) of new material is established by using temperature characteristic of strain gages, and the CTE of molding compound are obtained experimentally. The temperature-dependent CTE of molding compound for Pb-Sn solder and that for lead-free solder are obtained by using strain measurements with well known steel specimen and aluminium specimen as reference specimens, and the CTE's are also measured non-contactly by using moire interferometry. Those results are compared, and the agreement between the two types of strain gage experiment and the moire experiment show the strain gage method used in this paper to be reliable. In the case of the molding compound for Pb-Sn solder, the CTE is measured as approximately $15.8ppm/^{\circ}C$ regardless of the temperature. In the case for the lead-free solder, the CTE is measured as of approximately $9.9ppm/^{\circ}C$ below the temperature of $100^{\circ}C$, and then the CTE is increased sharply depending on the temperature, and reaches to $15.0ppm/^{\circ}C$ at $130^{\circ}C$.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.37-42
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• 2022

Recently, the semiconductor package structures are becoming thinner and more complex. As the thickness decrease, interfacial delamination due to material mismatch can be further maximized, so the reliability of interface is a critical issue in industry field. Especially, the polymers, which are widely used in semiconductor packaging, are significantly affected by the temperature and moisture. Therefore, in this study, the delamination prediction at the interface of package structure was performed through finite element analysis considering the moisture absorption and desorption under the various temperature conditions. The material properties such as diffusivity and saturated moisture content were obtained from moisture absorption test. The hygro-swelling coefficients of each material were analyzed through TMA and TGA after the moisture absorption. The micro-shear test was conducted to evaluate the adhesion strength of each interface at various temperatures considering the moisture effect. The finite element analysis of interfacial delamination was performed that considers both deformation due to temperature and moisture absorption. Consequently, the interfacial delamination was successfully predicted in consideration of the in-situ moisture desorption and temperature behavior during the reflow process.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.369-370
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• 2005

LTCC (Low Temperature Cofired Ceramic) technology is one of technologies which can realize SIP (System-In-a-Package). In this paper realization of gas sensor using LTCC technology was described. In the conventional gas sensor structure, wire bonding method is generally used as an interconnection method whereas in the LTCC sensor structure, via was used for the interconnection. As sensing materials, $SnO_2$ was adopted. The effect of frit glass portion on the adhesion of the sensing material to the LTCC substrate and the electrical conductivity of the sensing material were analyzed. AgPd, PdO, Pt was added to the sensing material as an additive for improving the gas sensitivity and electrical conductivity and the effect of the amount of additives in the sensing material on the electrical conductivity was investigated. The effect of the amount of frit glass in the termination on the sensor performance, especially mechanical integrity, was considered and the crack initiation and propagation in the boundary between the sensing material and the termination was studied.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.322-323
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• 2008

Multi layered thin films with ZnS/$Na_3AlF_6$/ZnS were deposited on glass substrate by thermal evaporator precess and simulated by using EMP(Essential Macleod Program). EMP is a comprehensive software package to design and analyse the optical characteristics of multi-layered thin film. ZnS and $Na_3AlF_6$ were selected as a high refractive index and low refractive index material respectively. Additionally Cu was chosen as mid reflective material. Optical properties including color effect were systematically studied. in terms of different optical thickness of low refractive index material. The optical thickness of $Na_3AlF_6$ was changed as 0.25, 0.5, 0.75 and $1.0\lambda$. The film with 0.25, 0.5, 0.75 and $1.0\lambda$. of optical thickness showed mixed color range between bluish green and red purple, yellowish green and bluish green, purple and mixed color range of green and purple respectively.